Abstract: A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface covers the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.

Abstract: A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area.

Abstract: A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area.

Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.

Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.

Abstract: A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.

Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.

Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the copper layer. The photoresist layer is exposed. The photoresist layer is developed to form a patterned photoresist layer, thereby exposing portions of the copper layer. The exposed portions of the copper layer exposed are removed so that the remaining portions of the copper layer form electrical traces. The patterned photoresist layer is removed.

Abstract: A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.

Abstract: An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.

Abstract: The present invention relates to a method for manufacturing printed circuit boards. A substrate including a base and two conductive layers on two opposite surfaces of the base is provided. A through-hole passing through the base and the conductive layers is defined in the substrate. A metal layer is formed on the substrate. The metal layer has a first portion on an outer surface of the substrate and a second portion on an inner surface in the through-hole thereof. A protecting material is applied onto the metal layer in the through-hole, an unwanted section of the first portion of the metal layer is removed. Electrical traces in each of the conductive layers are formed.

Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the copper layer. The photoresist layer is exposed. The photoresist layer is developed to form a patterned photoresist layer, thereby exposing portions of the copper layer. The exposed portions of the copper layer exposed are removed so that the remaining portions of the copper layer form electrical traces. The patterned photoresist layer is removed.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.

Abstract: An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and chromium. A patterned photoresist layer is formed on the copper layer with portions of the copper layer are exposed from the photoresist pattern layer. Exposed portions of the copper layer are removed using a copper etchant to form a number of electrical traces, thereby exposing portions of the intermediate layer from the patterned photoresist layer. Exposed portions of the intermediate layer are removed using a chromium-nickel etchant. The method can prevent a bottom of each of electrical traces from enlarging, thereby improving quality of printed circuit board.

Abstract: A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.

Abstract: An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board.

Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.

Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.

Abstract: A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.