Abstract: A semiconductor module, including: a stacked substrate including a plurality of circuit boards formed on an upper surface of an insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The bonding portion includes a plate-shaped portion having an upper surface and a lower surface. The plate-shaped portion has a roughened region in which a plurality of recessed portions are formed on the upper surface of the plate-shaped portion. The plurality of recessed portions include a plurality of first recessed portions that each has a peeling suppressing portion protruding inward to thereby narrow a width of each first recessed portion.

Abstract: A semiconductor module, including: a stacked substrate, which includes an insulating plate, and a plurality of circuit boards formed on an upper surface of the insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a plate-shaped bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The plate-shaped bonding portion has a plurality of recessed portions formed on an upper surface thereof, each recessed portion is of a hexagonal shape in a plan view of the semiconductor module.

Abstract: A semiconductor module includes a stacked substrate in which a plurality of circuit boards are arranged on an upper surface of an insulating plate, a semiconductor element arranged on an upper surface of at least one of the circuit boards, and a metal wiring board arranged on an upper surface of the semiconductor element. The metal wiring board has a first bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The first bonding portion includes a plate-shaped portion having an upper surface and a lower surface, and at least one groove is provided along an outer periphery of the first bonding portion on the upper surface of the plate-shaped portion.

Abstract: A semiconductor module, including: a stacked substrate including a plurality of circuit boards formed on an upper surface of an insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The bonding portion includes a plate-shaped portion having an upper surface and a lower surface. The plate-shaped portion has a roughened region in which a plurality of recessed portions are formed on the upper surface thereof. The plurality of recessed portions include a plurality of kinds, each kind differing in at least one of a size, a shape, and a depth of the recess portions therein from another kind.

Abstract: A semiconductor module, including: a circuit board including a semiconductor element; a lead bonded to an electrode of the semiconductor element by a bonding material; and a sealing material sealing the semiconductor element and the lead. The lead includes: a bonding portion bonded to the electrode, and a roughening recess formed on an upper surface of the bonding portion. The roughening recess includes: a main recess having a first wall surfaces and a second wall surface opposite to each other, and a barbed portion formed on the first wall surface and protruding toward the second wall surface, and a sub-recess having: a center, which is located, in a plan view of the semiconductor module, outside the main recess and at a position away from the first wall surface by a predetermined distance, and an inclined surface that becomes shallower from the center toward an opening end of the main recess.

Abstract: A semiconductor module, including: a circuit board including a semiconductor element having an electrode on an upper surface thereof; a lead bonded to the electrode by a bonding material; and a sealing material that seals the semiconductor element and the lead. The lead includes: a bonding portion bonded to the electrode, the bonding portion having a lower surface facing the electrode, and an upper surface opposite to the lower surface, and a plurality of recesses formed on the upper surface of the bonding portion. In a plan view of the semiconductor module, the bonding portion has a plurality of sides, and each recess has a bottom surface of a planar shape, the planar shape having a side extending in a direction that is not orthogonal to any of the sides of the bonding portion. Each of the recesses a barbed portion protruding from a wall surface thereof.

Abstract: A semiconductor device, including a circuit board, a case member, and first and second main terminals each having an outer terminal portion and an inner terminal portion. The case member includes a terminal arrangement portion having a recess formed between the outer terminal portions of the first and second main terminals and extending in a direction from a first end to a second end thereof, the first end being closer to a housing portion of the case member than the second end, and than first end portions of the outer terminal portions of the main terminals, and the second end being farther from the housing portion than second end portions of the outer terminal portion of the main terminals. A protrusion is formed on a wall surface of the terminal arrangement portion toward the housing portion, and is aligned with the recess and separates the recess and the housing portion.

Abstract: Three-dimensional data acquisition means acquires three-dimensional data output from a three-dimensional ranging sensor for scanning a paved surface for aircraft using laser light. Extraction means extracts, from the three-dimensional data, real image data about a real image present on the paved surface and mirage image data about a mirage image corresponding to the real image. Foreign object detection means detects a foreign object left on the paved surface using the real image data and the mirage image data.

Abstract: A semiconductor module includes a lead including a first bonding portion and a coupling portion extending in a Y direction from the first bonding portion. The first bonding portion has a first width end, and a second width end connected to the coupling portion. The lead has first and second length sides opposite to each other in an X direction. The lead has in the X direction first and second widths at first and second positions, and the second position is away from the first position in the Y direction. In the plan view, the lead has a shape in which the first width is greater than the second width such that positions of the first and second length sides at the second position are respectively located inward in the X direction with respect to positions of the first and second length sides at the first position.

Abstract: Three-dimensional data acquisition means acquires three-dimensional data output from a three-dimensional ranging sensor for scanning a paved surface for aircraft using laser light. Extraction means extracts, from the three-dimensional data, real image data about a real image present on the paved surface and mirage image data about a mirage image corresponding to the real image. Foreign object detection means detects a foreign object left on the paved surface using the real image data and the mirage image data.

Abstract: In an arithmetic operation system, an evaluation unit calculates a difference amount between a teaching signal and an estimated signal. The teaching signal is a spatial distribution signal observed with respect to a spatial structure on a path of an emission wave in a target space (i.e., a teaching space) by using the emission wave. In addition, the estimated signal is a signal for comparing with the teaching signal, and is an estimated spatial distribution signal. The estimated signal is formed based on estimated density associated to each sample point acquired from a spatial estimation model, by a sampling unit inputting information about a position of each of a plurality of sample points on the path to the spatial estimation model. An updating unit updates the spatial estimation model, based on the difference amount.

Abstract: In an arithmetic operation system, an evaluation unit calculates a difference amount between a teaching signal and an estimated signal. The teaching signal has a value that is obtained by integrating spatial distribution signals observed by a sensor using emission waves for a spatial structure along a region of interest in an emission wave region in which emission waves are emitted from a plurality of emission reference directions and reach the sensor. The region of interest is a curved line region or a curved surface region intersecting the plurality of emission reference directions. This estimated signal is calculated by integrating a plurality of pieces of estimated density of a plurality of sample points obtained from a spatial estimation model by having a sampling unit input information about a position of each of the plurality of sample points on the region of interest to the spatial estimation model.

Abstract: In an arithmetic operation system, an updating unit updates a spatial estimation model, based on a first difference amount and a second difference amount. The first difference amount is a difference amount between a first teaching signal and a first estimated signal. The first teaching signal is a spatial distribution signal observed by a first sensor with respect to a spatial structure on a path of an emission wave in a target space (i.e., a teaching space) by using the emission wave. The second difference amount is a difference amount between a second teaching signal and a second estimated signal. The second teaching signal is an observed signal observed by a second sensor different in type from the first sensor. The second estimated signal is a signal for comparing with the second teaching signal, and is a signal of a form similar to that of the second teaching signal.

Abstract: An optical apparatus includes: a plurality of lens portions that forms respective images of an object; a plurality of filters disposed on respective optical axes of the plurality of lens portions; and a holding member holding the plurality of lens portions and the plurality of filters, in which the plurality of filters includes a first filter and a second filter mutually different in transmission characteristic, and in which the holding member includes a first mount portion and is detachably mountable to an imaging apparatus via the first mount portion.

Abstract: An optical sensing device includes a controller that rotates a light irradiation circuit that irradiates an irradiation target being at least a part of a target with laser light, and thus move an incident position of the laser light on the irradiation target in a reciprocating manner between one end and another end of the irradiation target, via a center positioned between the one end and the another end of the irradiation target, an acquisition circuit that acquires information relating to reflected light associated with the incident position, based on the reflected light from the irradiation target, and a generation circuit that generates point cloud data relating to the irradiation target, based on the information relating to the reflected light, wherein, when the incident position moves to the center of the irradiation target, the controller reduces a speed at which the light irradiation circuit is rotated.

Abstract: An apparatus includes a first sensor unit that includes a plurality of first sensors arranged in the first direction which include a first sensor configured to receive a first image formed by light with a first wavelength, a second sensor unit that includes a plurality of second sensors arranged in the first direction which include a second sensor configured to receive a second image formed by light with a second wavelength, and a controller configured to control the first and second sensor units. The controller controls the plurality of first sensors under a first common exposure condition, and controls the plurality of second sensors in the second sensor unit under a second common exposure condition.

Abstract: An optical unit detachably mountable to a lens barrel portion disposed closer to an object than an image sensor included in an imaging apparatus includes a plurality of lens units each configured to form an image of the object, a plurality of filters disposed on optical axes of the plurality of lens units, and a common holding member configured to hold the plurality of lens units and the plurality of filters. The plurality of filters includes a first filter and a second filter having light transmission characteristics different from each other. The holding member includes a coupling portion capable of being coupled with the lens barrel portion.

Abstract: An optical system includes a diffusion element configured to diffuse an incident light beam at a diffusion point and to emit diffused light, and an imaging element configured to form an image of the diffusion point. Peak intensities in a diffusion angle distribution characteristic of the diffused light are discrete. A predetermined condition is satisfied.

Abstract: A semiconductor apparatus a semiconductor module including a semiconductor device and a resin section covering the periphery of the semiconductor device, and a cooler arranged below the semiconductor device. The cooler includes a top plate that is attached to a lower surface of the resin section. The resin section has a protrusion protruding downward from an outer peripheral edge of the lower surface of the resin section. The protrusion includes a first straight section extending in a predetermined direction in a plan view of the semiconductor apparatus, and a first curved section having a curved shape convex inward the semiconductor module and being connected to the first straight section. The top plate includes a first notch that is engageable with the protrusion, and the resin section and the top plate are bonded to each other with an adhesive interposed therebetween.