Semiconductor module

- FUJI ELECTRIC CO., LTD.
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Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is another perspective view thereof.

The broken lines illustrate portions of the article that form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D1037163
Type: Grant
Filed: Dec 8, 2021
Date of Patent: Jul 30, 2024
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Tsubasa Nakamura (Kawasaki), Daiki Yoshida (Kawasaki), Takahiro Koyama (Kawasaki)
Primary Examiner: Christy Nemeth
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/818,441