Patents by Inventor Tsukasa Shiraishi

Tsukasa Shiraishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190237303
    Abstract: A target supply device may be provided with a tank configured to contain a metal as a target material, a nozzle having a nozzle hole through which the target material is output from the tank, a filter disposed in a communication portion for conducting the target material from the tank to the nozzle hole, a temperature adjuster configured to change the temperature of the target material in the tank, and a controller controlling the temperature adjuster to change the temperature of the target material in the tank such that oxygen in the target material is precipitated as metal oxide.
    Type: Application
    Filed: April 9, 2019
    Publication date: August 1, 2019
    Applicant: Gigaphoton Inc.
    Inventors: Fumio IWAMOTO, Yutaka SHIRAISHI, Tsukasa HORI, Osamu WAKABAYASHI
  • Patent number: 9076752
    Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: July 7, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Toshiyuki Kojima, Tsukasa Shiraishi, Norihito Tsukahara, Takayuki Hirose, Keiko Ikuta, Masayoshi Koyama
  • Patent number: 8822753
    Abstract: An absorbent article that enables the presence of moisture, for example, derived from urination to be easily recognized. The absorbent article includes an outer sheet provided on a side that faces a wearer's skin, i.e., on its side facing a liquid-absorbent structure with moisture visualizing elements. The moisture visualizing elements are formed by coating the outer sheet with hot melt composition comprising pH indicator mixed with pressure-sensitive adhesive ingredient. Two or more stripes of the hot melt composition forming the moisture visualizing elements extend in a longitudinal direction at least across a crotch region. Between the moisture visualizing elements and the liquid-absorbent structure, there is provided a barrier sheet or barrier sheets extending in a transverse direction so as to intersect the moisture visualizing elements comprising two or more stripes of the hot melt composition.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: September 2, 2014
    Assignee: Unicharm Corporation
    Inventors: Tsukasa Shiraishi, Yusuke Kawakami
  • Publication number: 20140231981
    Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).
    Type: Application
    Filed: January 10, 2013
    Publication date: August 21, 2014
    Applicant: Panasonic Corporation
    Inventors: Toshiyuki Kojima, Tsukasa Shiraishi, Norihito Tsukahara, Takayuki Hirose, Keiko Ikuta, Masayoshi Koyama
  • Patent number: 8353102
    Abstract: A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: January 15, 2013
    Assignee: Panasonic Corporation
    Inventors: Masayoshi Koyama, Tsukasa Shiraishi
  • Publication number: 20120029453
    Abstract: In an absorbent article 1, an absorber 30 is arranged between a liquid-permeable topsheet 10 and a liquid-impermeable backsheet 20, and the absorber 30 includes electrolyte particles as a hygroscopic material 70. This enables exhibition of a sufficient hygroscopicity during wearing and more surely suppress a discomfort of a wearer due to sweatiness or tackiness.
    Type: Application
    Filed: February 1, 2010
    Publication date: February 2, 2012
    Applicant: UNI-CHARM CORPORATION
    Inventors: Yuki Noda, Mitsuhiro Wada, Tsukasa Shiraishi
  • Patent number: 8063486
    Abstract: A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.
    Type: Grant
    Filed: May 14, 2007
    Date of Patent: November 22, 2011
    Assignee: Panasonic Corporation
    Inventors: Koichi Hirano, Tsukasa Shiraishi, Seiichi Nakatani, Tatsuo Ogawa
  • Patent number: 7963310
    Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: June 21, 2011
    Assignee: Panasonic Corporation
    Inventors: Tsukasa Shiraishi, Seiichi Nakatani
  • Publication number: 20110112497
    Abstract: An absorbent article that enables the presence of moisture, for example, derived from urination to be easily recognized. The absorbent article includes an outer sheet provided on a side that faces a wearer's skin, i.e., on its side facing a liquid-absorbent structure with moisture visualizing elements. The moisture visualizing elements are formed by coating the outer sheet with hot melt composition comprising pH indicator mixed with pressure-sensitive adhesive ingredient. Two or more stripes of the hot melt composition forming the moisture visualizing elements extend in a longitudinal direction at least across a crotch region. Between the moisture visualizing elements and the liquid-absorbent structure, there is provided a barrier sheet or barrier sheets extending in a transverse direction so as to intersect the moisture visualizing elements comprising two or more stripes of the hot melt composition.
    Type: Application
    Filed: March 23, 2009
    Publication date: May 12, 2011
    Inventors: Tsukasa Shiraishi, Yusuke Kawakami
  • Publication number: 20110049218
    Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.
    Type: Application
    Filed: November 5, 2010
    Publication date: March 3, 2011
    Applicant: Panasonic Corporation
    Inventors: Tsukasa SHIRAISHI, Seiichi Nakatani
  • Publication number: 20100331801
    Abstract: According to an absorptive article (disposable diaper) 10 of the present invention, an absorber (absorptive structure) 12 is provided with a first region 55 disposed on an internal surface sheet 41 side and having a higher content ratio of the superabsorptive polymer than a content ratio of the hydrophilic fiber, a second region 56 disposed on an external surface sheet 42 side and having a lower content ratio of the superabsorptive polymer than the content ratio of the superabsorptive polymer in the first region and a higher content ratio of the hydrophilic fiber than the content ratio of the hydrophilic fiber in the first region, and a space that penetrates from the external surface sheet 42 side of the second region 56 to the first region 55, and that can be entered by the superabsorptive polymer that is swollen by absorbing a body fluid in the first region 55.
    Type: Application
    Filed: November 6, 2008
    Publication date: December 30, 2010
    Inventors: Yusuke Kawakami, Tsukasa Shiraishi
  • Patent number: 7850803
    Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: December 14, 2010
    Assignee: Panasonic Corporation
    Inventors: Tsukasa Shiraishi, Seiichi Nakatani
  • Patent number: 7752749
    Abstract: One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY? direction.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: July 13, 2010
    Assignee: Panasonic Corporation
    Inventors: Tsukasa Shiraishi, Yukihiro Ishimaru, Shinobu Masuda, Satoru Tomekawa
  • Patent number: 7649267
    Abstract: A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: January 19, 2010
    Assignee: Panasonic Corporation
    Inventors: Tsukasa Shiraishi, Yukihiro Ishimaru, Seiji Karashima, Seiichi Natkatani, Hiroki Yabe
  • Publication number: 20090085227
    Abstract: A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.
    Type: Application
    Filed: May 9, 2006
    Publication date: April 2, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Tsukasa Shiraishi, Seiichi Nakatani, Seiji Karashima, Koichi Hirano, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu
  • Publication number: 20090049687
    Abstract: [Problem] To improve productivity and reliability in mounting an electronic component. [Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder.
    Type: Application
    Filed: March 17, 2006
    Publication date: February 26, 2009
    Inventors: Tsukasa Shiraishi, Yukihiro Ishimaru, Shinobu Masuda, Satoru Tomekawa
  • Publication number: 20080304237
    Abstract: On a first component built-in substrate having built-in electronic components, a second component built-in substrate having built-in electronic components is stacked, and further on the second component built-in substrate, a radiator is attached. The second component built-in substrate includes a wiring layer with electronic components mounted on a main surface thereof, and an insulating layer which is mainly composed of a mixture containing an inorganic filler and a thermosetting resin and in which the electronic components mounted on the wiring layer are embedded. The insulating layer of the second component built-in substrate conducts heat generated from the electronic components and the wiring layer to the radiator.
    Type: Application
    Filed: June 2, 2008
    Publication date: December 11, 2008
    Inventor: Tsukasa SHIRAISHI
  • Publication number: 20080298023
    Abstract: An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.
    Type: Application
    Filed: May 27, 2008
    Publication date: December 4, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Rikiya Okimoto, Tsukasa Shiraishi, Yukihiro Ishimaru, Toshiyuki Kojima
  • Publication number: 20080283284
    Abstract: A wiring board connection method connects wiring boards each having a strip-shaped connection terminal for connecting with another substrate, the method including the steps of: aligning the wiring boards so that the connection terminals face each other with a fluid interposed therebetween; and bonding the connection terminals with each other by heating and then-cooling the fluid, wherein: the fluid is a material that generates air bubbles upon being heated; a plurality of the connection terminals are provided on each of the wiring boards; and a groove is formed in each of at least one of the connection terminals in at least one of the wiring boards, the groove extending across the relevant connection terminal.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masayoshi KOYAMA, Tsukasa SHIRAISHI
  • Publication number: 20080265437
    Abstract: A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
    Type: Application
    Filed: March 8, 2006
    Publication date: October 30, 2008
    Inventors: Tsukasa Shiraishi, Yukihiro Ishimaru, Seiji Karashima, Seiichi Natkatani, Hiroki Yabe