Patents by Inventor Tsung-Ching Wu

Tsung-Ching Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10727344
    Abstract: A semiconductor device includes a fin field effect transistor (FinFET). The FinFET includes a channel disposed on a fin, a gate disposed over the channel and a source and drain. The channel includes at least two pairs of a first semiconductor layer and a second semiconductor layer formed on the first semiconductor layer. The first semiconductor layer has a different lattice constant than the second semiconductor layer. A thickness of the first semiconductor layer is three to ten times a thickness of the second semiconductor layer at least in one pair.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Ching Cheng, Chih Chieh Yeh, Cheng-Hsien Wu, Hung-Li Chiang, Jung-Piao Chiu, Tzu-Chiang Chen, Tsung-Lin Lee, Yu-Lin Yang, I-Sheng Chen
  • Publication number: 20200201151
    Abstract: A projector comprises a casing, a projection lens module and a light emitting module. The casing comprises a first air inlet and an air outlet. The projection lens module is disposed in the casing and adjacent to the first air inlet. The light emitting module is disposed in the casing and adjacent to the air outlet. The casing comprises a rear cover. The rear cover comprises a second air inlet, the second air inlet corresponds to the light emitting module. A first airflow flows into the casing from the first air inlet to dissipate heat from the projection lens module and the light emitting module, and then flows out of the air outlet. A second airflow flows into the casing from the second air inlet to dissipate heat from the light emitting module, and then flows out of the air outlet.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 25, 2020
    Applicant: Coretronic Corporation
    Inventors: Chih-Sheng Wu, Te-Tang Chen, Tsung-Ching Lin
  • Publication number: 20200152599
    Abstract: A method of manufacturing a semiconductor structure is provided. The method includes providing a first substrate including a plurality of conductive bumps disposed over the first substrate; providing a second substrate; disposing a patterned adhesive over the first substrate, wherein at least a portion of the plurality of conductive bumps is exposed through the patterned adhesive; bonding the first substrate with the second substrate; and singulating a chip from the first substrate.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: ALEXANDER KALNITSKY, YI-YANG LEI, HSI-CHING WANG, CHENG-YU KUO, TSUNG LUNG HUANG, CHING-HUA HSIEH, CHUNG-SHI LIU, CHEN-HUA YU, CHIN-YU KU, DE-DUI LIAO, KUO-CHIO LIU, KAI-DI WU, KUO-PIN CHANG, SHENG-PIN YANG, ISAAC HUANG
  • Patent number: 10650786
    Abstract: An automatically brightness adjusting electronic device and a brightness adjusting method are provided. The method comprises: sensing an environmental light intensity; generating a brightness adjustment signal according to the environmental light intensity via a second control unit; and adjusting a display brightness of a display unit according to the brightness adjustment signal via a first control unit or the second control unit.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: May 12, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chin-Hung Lin, Wei-Chung Hung, Huai-Hao Syu, Tzu-Ping Lin, Chia-Po Chou, Tsung-Lin Wu, Han-Wei Tang, Yi-Ching Chen, Chih-Lung Lin, Ping-Fu Hsieh
  • Patent number: 10651296
    Abstract: Methods of fabricating FinFET devices are provided. The method includes forming a fin over a substrate. The method also includes implanting a first dopant on a top surface of the fin and implanting a second dopant on a sidewall surface of the fin. The first dopant is different from the second dopant. The method further includes forming an oxide layer on the top surface and the sidewall surface of the fin, and forming a gate electrode layer over the oxide layer.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: May 12, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Han Wu, Tong-Min Weng, Chun-Yi Huang, Po-Ching Lee, Chih-Hsuan Hsieh, Shu-Ching Tsai
  • Patent number: 10620516
    Abstract: A projector includes a casing, an optical engine module and a heat dissipation module. The optical engine module disposed in the casing includes a light source, a light valve and a projection lens. The heat dissipation module disposed in the casing includes at least two heat pipes and a heat dissipation fin set. The heat dissipation fin set includes at least a heat dissipation fin and at least a turbulent structure. The heat dissipation fin has a surface including a heat pipe arrangement region and a turbulent region adjacent to each other. The at least one heat pipe passes through the heat pipe arrangement region, and an air flowing section is formed near the at least one heat pipe. The turbulent region has a turbulent section corresponding to the air flowing section, and the turbulent structure is disposed in the turbulent region and extends continuously in the turbulent section.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: April 14, 2020
    Assignee: Coretronic Corporation
    Inventors: Pei-Rong Wu, Shi-Wen Lin, Wen-Yen Chung, Tsung-Ching Lin
  • Patent number: 10614945
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 7, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20200035815
    Abstract: Methods of fabricating FinFET devices are provided. The method includes forming a fin over a substrate. The method also includes implanting a first dopant on a top surface of the fin and implanting a second dopant on a sidewall surface of the fin. The first dopant is different from the second dopant. The method further includes forming an oxide layer on the top surface and the sidewall surface of the fin, and forming a gate electrode layer over the oxide layer.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Han WU, Tong-Min WENG, Chun-Yi HUANG, Po-Ching LEE, Chih-Hsuan HSIEH, Shu-Ching TSAI
  • Publication number: 20200027750
    Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Inventors: Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang, Chun-Che Chen, Jhih-Ming Lin, Chih-Ching Lin, Shih-Wen Huang, Chun Hua Chang, Tsung-Yang Hsieh
  • Publication number: 20200026167
    Abstract: A projector includes a casing, an optical engine module and a heat dissipation module. The optical engine module disposed in the casing includes a light source, a light valve and a projection lens. The heat dissipation module disposed in the casing includes at least two heat pipes and a heat dissipation fin set. The heat dissipation fin set includes at least a heat dissipation fin and at least a turbulent structure. The heat dissipation fin has a surface including a heat pipe arrangement region and a turbulent region adjacent to each other. The at least one heat pipe passes through the heat pipe arrangement region, and an air flowing section is formed near the at least one heat pipe. The turbulent region has a turbulent section corresponding to the air flowing section, and the turbulent structure is disposed in the turbulent region and extends continuously in the turbulent section.
    Type: Application
    Filed: May 28, 2019
    Publication date: January 23, 2020
    Applicant: Coretronic Corporation
    Inventors: Pei-Rong Wu, Shi-Wen Lin, Wen-Yen Chung, Tsung-Ching Lin
  • Patent number: 10535629
    Abstract: A method of manufacturing a semiconductor structure includes receiving a first substrate including an IMD layer disposed over the first substrate and a plurality of conductive bumps disposed in the IMD layer; receiving a second substrate; disposing a patterned adhesive over the first substrate, wherein at least a portion of the IMD layer is exposed through the patterned adhesive; and bonding the first substrate with the second substrate, wherein a top surface of the at least portion of the IMD layer is exposed through the patterned adhesive after bonding the first substrate with the second substrate.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu, Chin-Yu Ku, De-Dui Liao, Kuo-Chio Liu, Kai-Di Wu, Kuo-Pin Chang, Sheng-Pin Yang, Isaac Huang
  • Patent number: 10495957
    Abstract: A wavelength conversion device includes a main body, at least one wavelength conversion layer, at least one heat dissipation plate, a heat conducting component and a driving unit. The wavelength conversion layer is disposed on the main body. The heat dissipation plate is disposed on a side of the main body with an interval. The heat conducting component is connected between the heat dissipation plate and the main body. The driving unit is connected to the main body and the heat dissipation plate and adapted to drive the main body and the heat dissipation plate to rotate. The driving unit and the heat conducting component have a gap therebetween. In addition, a projector including the wavelength conversion device is also provided. The wavelength conversion device according to the disclosure has good heat dissipation efficiency.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: December 3, 2019
    Assignee: Coretronic Corporation
    Inventors: Te-Ying Tsai, Tsung-Ching Lin, Shi-Wen Lin, Pei-Rong Wu, Chia-Lun Tsai
  • Publication number: 20190311836
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 10, 2019
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190287709
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 19, 2019
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 10366818
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 30, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190227223
    Abstract: A display device includes a display module and an optical film. The display module has a through hole. At least one optical film is located on the display module and has an alignment through hole aligned with the through hole and an alignment mark surrounding the alignment through hole.
    Type: Application
    Filed: August 1, 2018
    Publication date: July 25, 2019
    Inventors: Chi-Ming WU, Yi-Ching WANG, Tsung-Chin LIN, Ching-Huan LIAO
  • Patent number: 10354789
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: July 16, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190183960
    Abstract: The present invention provides a method to treat asthma and airway allergy by administering the dipeptide cyclo tyrosine-valine or a related cyclodipeptide compound to a subject in need thereof. Cyclo tyrosine-valine or the related cyclodipeptide compound reduces Th2 cell activation, airway hyperresponsiveness, accumulation of immune cells in bronchoalveolar fluid, and allergen-specific antibody production in an animal or human subject. The compound can therefore be used to treat asthma and airway allergy.
    Type: Application
    Filed: February 27, 2018
    Publication date: June 20, 2019
    Inventors: Yun-Fei Ko, Jan Martel, Jian-Ching Liau, Chen-Yaw Chiu, Chuan-Sheng Lin, Luis Dominick B. Antig, Pei-Wen Hsieh, Yu-Li Chen, Chih-Jung Chang, Tsung-Ru Wu, David Marcelo Ojcius, Chia-Chen Lu, Hsin-Chih Lai, John D. Young
  • Patent number: D887311
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 16, 2020
    Assignee: Karma Medical Products Co., LTD.
    Inventors: Li-Wei Wu, Chih-Hung Tseng, Wei-Lin Hsieh, Tsung-Ching Li, Chien-Hung Wu
  • Patent number: D887313
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: June 16, 2020
    Assignee: Karma Medical Products Co., LTD.
    Inventors: Li-Wei Wu, Chih-Hung Tseng, Wei-Lin Hsieh, Tsung-Ching Li, Chien-Hung Wu