Abstract: The present disclosure provides a high surface dopant concentration semiconductor device and method of fabricating. In an embodiment, a method of forming the semiconductor device includes providing a substrate, forming a doped region in the substrate, forming a stressing layer over the doped region, performing a boron (B) doping implant to the stressing layer, annealing the B doping implant, and after annealing the B doping implant, forming a silicide layer over the stressing layer.

Abstract: A power transmission circuit, a light source module including the power transmission circuit, and a panel display device are provided. The power transmission circuit includes a substrate, a power transmission layer, a metal shielding layer, a first protective layer, and a second protective layer. The substrate has a first surface and a second surface with the power transmission layer and the metal shielding layer respectively formed thereon. The metal shielding layer covers a projection region of a transmission section of the power transmission layer. The first and second protective layers are respectively disposed on the power transmission layer and the metal shielding layer and opposite to the substrate to protect the power transmission layer and the metal shielding layer.

Abstract: A gate output control method is adapted into a flat display having a plurality of gate drive integrated circuits. The method comprises: providing a gate control signal; providing a oblique control signal to oblique modulate the gate control signal for generating a gate control signal with oblique; modulating the gate control signal with oblique to obtain a modulated gate control signal; and outputting the modulated gate control signal to the gate drive integrated circuits. A falling edge of the modulated gate control signal comprises a oblique-varying period and a vertical-varying period. In the oblique-varying period, the modulated gate control signal firstly changes to a predetermined voltage in a first slope, and then changes in a second slope until the vertical-varying period. In the vertical-varying period, the modulated gate control signal changes vertically or nearly vertically.

Abstract: The present invention relates to a gate pulse modulation (GPM) circuit and the application of same in a liquid crystal display for improving the display performance thereof. The gate pulse modulation circuit is configured to modulate multi-phase clock pulse signals so as to correspondingly generate odd gate pulse waveforms and even gate pulse waveforms that are different from one another.

Abstract: A portable electronic apparatus with automatic backlight adjustability and an adjusting method thereof are provided. The portable electronic apparatus comprises a display unit, a storage unit, an image capture unit, a processing unit and a backlight driver. The storage unit is used for storing a backlight parameter table. The image capture unit is used for capturing an image. The processing unit calculates a corresponding exposure value according to the image to obtain a backlight parameter corresponding to the backlight parameter table, and outputs a backlight setting according to the backlight parameter. The backlight driver adjusts the display unit according to the backlight setting to achieve target backlight brightness.

Abstract: A thermally enhanced packaging structure and fabrication method thereof. The structure includes a printed circuit board (PCB), heat-conductive substrate laminated with the PCB, first chip on the heat-conductive substrate, conductor electrically connecting the chip and PCB, and isolation structure isolating the chip and conductor from the external environment.

Abstract: A thermally enhanced packaging structure and fabrication method thereof. The structure includes a printed circuit board (PCB), heat-conductive substrate laminated with the PCB, first chip on the heat-conductive substrate, conductor electrically connecting the chip and PCB, and isolation structure isolating the chip and conductor from the external environment.

Abstract: The present invention is to provide an arrangement structure applying to sawing a package panel. The present invention applies for two sizes of the rectangle panel. When the length of the panel is 16 inch and the width of the panel is 13.3 inch; there are eight pieces rectangle integrated circuit (IC) substrates arranged on the rectangle panel, and wherein a short side of each of those IC substrates is about 67 mm to 78 mm and a long side of each of those IC substrates is about 172 mm to 192 mm. Besides, as the length of the panel is 20 inch and the width of the panel is 16 inch, there are twelve or fourteen pieces rectangle integrated circuit (IC) substrates arranged on the panel. Hence, the present invention can obtain an effective balance between the substrate size and the manufacturing ability of the machine and simultaneously give consideration to the utility rate of the panel arrangement and the yield of manufacturing so as the present invention can effectively improve the yield and cost down the cost.