Abstract: Embodiments of a front-end pre-concentrator module, a back-end pre-concentrator module and a gas analysis subsystem are disclosed, as well as gas analysis systems using combinations of the front-end pre-concentrator module, the back-end pre-concentrator module and the gas analysis subsystem. Embodiments of disposable and re-usable moisture removal filters are disclosed for use alone or in combination with a gas analysis system.

Abstract: The disclosure describes a substrate with a fluid-handling assembly coupled to the substrate, the fluid-handling assembly including a plurality of fluid-handling components removably coupled to the substrate and removably coupled to each other. The plurality of fluid handling components includes a gas chromatograph having a fluid inlet and a fluid outlet, and a detector array having a fluid inlet and a fluid outlet, wherein the fluid inlet of the detector array is fluidly coupled to the fluid outlet of the gas chromatograph. A control circuit is communicatively coupled to at least one of the plurality of fluid-handling components, and a readout circuit communicatively coupled to the detector array and to the control circuit. Other embodiments are disclosed and claimed.

Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.

Abstract: A seek-scan-probe memory device, utilizing a media electrode to allow active cantilevers to contact the storage media, and a pull electrode to pull up cantilevers away from the storage media when in an inactive mode. Other embodiments are described and claimed.

Abstract: Embodiments of a front-end pre-concentrator module, a back-end pre-concentrator module and a gas analysis subsystem are disclosed, as well as gas analysis systems using combinations of the front-end pre-concentrator module, the back-end pre-concentrator module and the gas analysis subsystem. Embodiments of disposable and re-usable moisture removal filters are disclosed for use alone or in combination with a gas analysis system.

Abstract: The disclosure describes a cascaded gas chromatograph including a first gas chromatograph having a first temperature control and a second gas chromatograph coupled to the first gas chromatograph. The first and second chromatographs have individual temperature controls that can be controlled independently of each other. Other embodiments are disclosed and claimed.

Abstract: An apparatus including an ion injector having an inlet and an outlet and a micro-corona ionizer positioned between the inlet and the outlet of the ion injector. A drift and separation channel having a first end and a second end is positioned with the first end coupled to outlet of the ion injector, and an ion detector is coupled to the second end of the ion separation and drift channel. Other embodiments are disclosed and claimed.

Abstract: A seek-scan-probe memory device, utilizing a media electrode to allow active cantilevers to contact the storage media, and a pull electrode to pull up cantilevers away from the storage media when in an inactive mode. Other embodiments are described and claimed.

Abstract: A Seek and Scan Probe (SSP) memory device is disclosed. The memory device includes a moving part having microelectromechanical (MEMS) structures fabricated on a first wafer and CMOS and memory medium components fabricating on a second wafer bonded to the first wafer.

Abstract: Methods and systems are disclosed for the detecting of whether a subject has a lung disorder such as asthma, tuberculosis or lung cancer. Monitoring the subject's health and prognosis is also disclosed.

Abstract: A Seek and Scan Probe (SSP) memory device is disclosed. The memory device includes a moving part having microelectromechanical (MEMS) structures fabricated on a first wafer and CMOS and memory medium components fabricating on a second wafer bonded to the first wafer.

Abstract: A method is disclosed. The method includes fabricating microelectromechanical (MEMS) structures of a Seek and Scan Probe (SSP) memory device on a first wafer, and fabricating CMOS and memory medium components of the SSP memory device on a second wafer.

Abstract: Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.

Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.

Abstract: A method is disclosed. The method includes fabricating microelectromechanical (MEMS) structures of a Seek and Scan Probe (SSP) memory device on a first wafer, and fabricating CMOS and memory medium components of the SSP memory device on a second wafer.

Abstract: An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.

Abstract: An apparatus and method of fabricating a through-wafer via. A first mask is formed over a first side of a first semiconductor die to define a first via area. A deep recess is etched through the first semiconductor die in the first via area and a blanket metal layer is formed over the first side including the deep recess. The blanket metal layer is removed from an outer surface of the first side of the first semiconductor die while retaining a portion of the blanket metal layer within the deep recess.

Abstract: According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a top movable electrode, and an actutaion electrode with an undoped polysilicon stopper region to contact the top movable electrode when an actuation current is applied. The undoped polysilicon stopper region prevents actuation charging that accumulates over time in a unipolar actuation condition.

Abstract: According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a substrate, a bottom electrode mounted on the substrate, a top electrode mounted on the bottom electrode, an actuation electrode mounted on the substrate and a resistor coupled to the actuation electrode. The resistor prevents self-actuation at the actuation electrode whenever the switch is open.

Abstract: A cantilevered beam radio frequency microelectro-mechanical switch may be formed of low stress gradient polysilicon with a metallic contact. The region between the beam and the substrate may be free of dielectric in some embodiments. Oxide layers may be protected by a nitride protection layer in some cases.