Patents by Inventor Tsung-Kuan A. Chou

Tsung-Kuan A. Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Collapsible contact switch
    Publication number: 20050219016
    Abstract: Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Tsung-Kuan Chou, Hanan Bar
  • Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
    Patent number: 6942750
    Abstract: A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having a second surface. Photosensitive benzocyclobutene (BCB) polymer is then applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along the bonding layer.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: September 13, 2005
    Assignee: The Regents of the University of Michigan
    Inventors: Tsung-Kuan A. Chou, Khalil Najafi, Luis P. Bernal, Peter D. Washabaugh
  • Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
    Publication number: 20020195673
    Abstract: A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having a second surface. Photosensitive benzocyclobutene (BCB) polymer is then applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along the bonding layer.
    Type: Application
    Filed: June 5, 2002
    Publication date: December 26, 2002
    Inventors: Tsung-Kuan A. Chou, Khalil Najafi, Luis P. Bernal, Peter D. Washabaugh