Abstract: Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.

Abstract: An electromechanical switch with a rigidified electrode includes an actuation electrode, a suspended electrode, a contact, and a signal line. The actuation electrode is disposed on a substrate. The suspended electrode is suspended proximate to the actuation electrode and includes a rigidification structure. The contact is mounted to the suspended electrode. The signal line is positioned proximate to the suspended electrode to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the suspended electrode.

Abstract: An electromechanical switch includes an actuation electrode, a cantilever electrode, a contact, a suspended conductor, and a signal line. The actuation electrode is mounted to a substrate, the cantilever electrode is suspended proximate to the actuation electrode, and the contact is mounted to the cantilever electrode. The suspended conductor is coupled to the contact and straddles a portion of the cantilever electrode. The signal line is positioned to form a closed circuit with the contact and the suspended conductor when an actuation voltage is applied between the actuation electrode and the cantilever electrode.

Abstract: An information storage device comprises a ferroelectric media and a cantilever including a tip extending from the cantilever toward the ferroelectric media, and a capacitive sensor formed over the cantilever. The tip applies a probe voltage to the ferroelectric media and the capacitive sensor vibrates according to a response of the ferroelectric media to the probe voltage. Circuitry determines a polarization of the ferroelectric media based on the vibration of the capacitive sensor.

Abstract: In one embodiment, the present invention includes an apparatus having a cantilever structure to move in a vertical direction, including a grounded cantilever body and a conductive tip, a vertical actuation electrode to actuate the cantilever to cause the conductive tip to contact a ferroelectric media surface, an AC electrostatic drive electrode to produce electrostatic forces to cause the cantilever structure to vibrate, and a sensing trace coupled with the conductive tip to sense charge generated by the ferroelectric media surface in response to a force applied by the conductive tip. Other embodiments are described and claimed.

Abstract: A micro-electromechanical device includes an actuation electrode and a suspended electrode. The actuation electrode is disposed on a substrate. The suspended electrode is suspended proximate to the actuation electrode. The suspended electrode includes support members and a plate member. Each of the support members is clamped at either end to the substrate via anchors and the plate member is supported by the support members. The support members are flexible in response to an actuation voltage that is applied between the actuation electrode and the suspended electrode to allow the suspended electrode to electrostatically pull towards the actuation electrode. A signal line is coupled to the suspended electrode.

Abstract: An apparatus comprising a substrate having one or more anchors formed thereon; a movable platform suspended by one or more tether beams from the one or more anchors; an actuator coupled to the movable platform; and a micro-electro-mechanical (MEMS) probe having a proximal end, a distal end and a longitudinal axis extending between the proximal end and the distal end, wherein the proximal end is coupled to the movable platform and the distal end can be actuated in a direction substantially normal to a surface of the substrate.

Abstract: An apparatus and method of fabricating a through-wafer via. A first mask is formed over a first side of a first semiconductor die to define a first via area. A deep recess is etched through the first semiconductor die in the first via area and a blanket metal layer is formed over the first side including the deep recess. The blanket metal layer is removed from an outer surface of the first side of the first semiconductor die while retaining a portion of the blanket metal layer within the deep recess.

Abstract: In one embodiment, the present invention includes an apparatus having a first cantilever structure to move in a vertical direction, including a first plate formed of a conductive material, an insulation beam adapted on a portion of the first plate, and a second cantilever structure adapted on the insulation beam and including a second plate formed of a conductive material, where an air gap is present between the first and second plates. Other embodiments are described and claimed.

Abstract: A seek-scan-probe memory device, utilizing a media electrode to allow active cantilevers to contact the storage media, and a pull electrode to pull up cantilevers away from the storage media when in an inactive mode. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a method for forming a sacrificial oxide layer on a base layer of a microelectromechanical systems (MEMS) probe, patterning the sacrificial oxide layer to provide a first trench pattern having a substantially rectangular form and a second trench pattern having a substantially rectangular portion and a lateral portion extending from the substantially rectangular portion, and depositing a conductive layer on the patterned sacrificial oxide layer to fill the first and second trench patterns to form a support structure for the MEMS probe and a cantilever portion of the MEMS probe. Other embodiments are described and claimed.

Abstract: A MEMS platform with four actuators and four corresponding actuation electrodes. Movement of the platform in the x-y lateral plane is controlled by voltages applied to the four actuation electrodes. Other embodiments are described and claimed.

Abstract: An apparatus comprising a substrate having one or more anchors formed thereon; a movable platform suspended by one or more tether beams from the one or more anchors; an actuator coupled to the movable platform; and a micro-electro-mechanical (MEMS) probe having a proximal end, a distal end and a longitudinal axis extending between the proximal end and the distal end, wherein the proximal end is coupled to the movable platform and the distal end can be actuated in a direction substantially normal to a surface of the substrate.

Abstract: An apparatus comprising a substrate having a probe suspension formed thereon, a see-saw probe coupled to the probe suspension, the see-saw probe including first and second ends, with a tip projecting from a side of the first end, and an actuation electrode formed on the substrate, the actuation electrode positioned to exert a force upon the second end of the see-saw probe. A process comprising forming a probe suspension on a substrate, coupling a see-saw probe to the probe suspension, the see-saw probe including first and second ends, with a tip projecting from a side of the first end, and forming an actuation electrode on the substrate, the actuation electrode positioned to exert a force upon the second end of the see-saw probe.

Abstract: Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.

Abstract: A microelectromechanical system switch may include a relatively stiff cantilevered beam coupled, on its free end, to a more compliant or flexible extension. A contact may be positioned at the free end of the cantilevered beam. The extension reduces the actuation voltage that is needed and compensates for the relative stiffness of the cantilevered beam in closing the switch. In opening the switch, the stiffness of the cantilevered beam may advantageously enable quicker operation which may be desirable in higher frequency situations.

Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.

Abstract: An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.

Abstract: An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.

Abstract: According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a substrate, a plurality of actuation electrodes mounted on the substrate, a plurality of bottom electrodes mounted on the substrate, a capacitor having subcomponents mounted on the two or more bottom electrodes and a top bendable electrode mounted on the substrate. The top electrode collapses a first magnitude towards the actuation electrodes whenever a first voltage is applied to one or more of the actuation electrodes and collapses a second magnitude towards the actuation electrodes whenever a second voltage is applied to the actuation electrodes.