Abstract: A semiconductor equipment management method applicable to an electronic device for managing multiple pieces of semiconductor equipment is provided. The pieces of semiconductor equipment are respectively controlled through multiple control hosts, and the control hosts and the electronic device are connected to a switch device. The method includes: receiving real-time image information of each control host through the switch device; determining whether the real-time image information of each control host includes a triggering event by performing an image recognition on the real-time image information; executing a macro corresponding to the triggering event, where the macro includes at least one self-defined operation; generating at least one input command according to the self-defined operation of the executed macro; and controlling the control hosts to execute the self-defined operation of the executed macro by transmitting the input command to the control hosts through the switch device.

Abstract: A fabrication system for fabricating an IC is provided which includes a processing tool, a computation device and a FDC system. The processing tool includes an electrode and an RF sensor to execute a semiconductor manufacturing process to fabricate the IC. The RF sensor wirelessly detects the intensity of the RF signal. The computation device extracts statistical characteristics based on the detection of the intensity of the RF signal. The FDC system determines whether or not the intensity of the RF signal meets a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the FDC system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

Abstract: A microscope directs light through an excitation objective to generate a lattice light sheet (LLS) within a sample. A detection objective collects signal light from the sample in response to the LLS and images the collected light onto a detector. Second and third light beams are imaged onto focal planes of the excitation objective and detection objective, respectively. One or more wavefront detectors determine wavefronts of light emitted from the sample and through the excitation objective in response to the imaged second light beam and emitted from the sample through the detection objective in response to the imaged third light beam. A wavefront of the first light beam is modified to reduce a sample-induced aberration of the LLS within the sample, and a wavefront of the signal light emitted from the sample is modified to reduce a sample-induced aberration of the signal light at the detector.

Abstract: A light emitting device is described that may reduce the coupling of emitted light into silicon and may increase the efficiency with which light is emitted into the far field. Such a device may include a semiconductor layer, a metallic structure, and a light emission layer disposed between the semiconductor layer and the metallic structure. The light emission layer may be in physical contact with the metallic structure and the semiconductor layer. The light emission layer may include at least one fluorescent molecule that emits light upon excitation.

Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

Abstract: A rotor of an inner-rotor motor includes a shaft having a connecting portion. A permanent magnet is mounted around the connecting portion of the shaft. The permanent magnet includes at least one first engaging portion. At least one coupling member includes a through-hole. The shaft extends through the through-hole. The at least one coupling member includes a second engaging portion engaged with the at least one first engaging portion of the permanent magnet.

Abstract: An electronic lock includes a lock mechanism operable to change a state thereof between a lock state and an unlock state, and an electric control device including a motor module and a controller. The motor module is electrically operable to perform a lock operation or an unlock operation on the lock mechanism. The controller is configured to, when the lock mechanism changes the state thereof, determine whether a driving current provided to drive operation of the motor module satisfies a predetermined current condition. The controller stops driving operation of the motor module after determining at least that the driving current satisfies the predetermined current condition.

Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

Abstract: A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

Abstract: A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

Abstract: A probe structure is provided, including two probe heads for electrically contacting with the two objects, respectively, an elastic buffer portion forming a hollow space therein, a conductive portion being disposed within the hollow space and thereby being surrounded by the elastic buffer portion, and having two ends respectively electrically being connected to the two probe heads. When the two probe heads do not contact with the two objects electrically, the conductive portion is linearly extended between the two probe heads.

Abstract: A cooling system for a hand-held electronic device includes a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment. A wind driving assembly is mounted in the compartment and includes a frame, a package, and a thermally conductive cover. The thermally conductive cover engages with the frame and the package. An impeller is rotatably arranged in the frame having an outlet hole adjacent to the at least one air outlet. The package receives at least one electronic element that generates heat during operation. The thermally conductive cover includes an inlet hole in communication with an interior of the frame. An air channel is formed between the thermally conductive cover and an interior wall face of the casing. The at least one air inlet intercommunicates with the inlet hole via the air channel.

Abstract: A circuit board with via capacitor structure is introduced herein, including a base, a deposition layer, disposed on the base, having at least a via in the deposition layer, at least a thin film capacitor, each thin film capacitor disposed in each via, each thin film capacitor having a body, a second terminal, and a first terminal, the second terminal and the first terminal located on two opposite sides of the body; at least a first electrode, each first electrode electrically connected to the first terminal of each thin film capacitor; and at least a second electrode, each second electrode electrically connected to the second terminal of each thin film capacitor.

Abstract: A stack type test interface board assembly is provided herein, which comprises: a space transform board having a narrow pitch transform board and a wide pitch transform board, a plurality of first connection nodes disposed on a side of the narrow pitch transform board to be electrically connected to a finished or semi-finished semiconductor product, a plurality of second connection nodes disposed on a side of the wide pitch transform board, and a printed circuit board where a side thereof is electrically connected to the plurality of the second connection nodes. The narrow pitch transform board and the wide pitch transform board are assembled in perpendicular stack into the space transform board. A pitch between each two of the plurality of the first connection nodes is smaller than a pitch between each two of the plurality of the second connection nodes.

Abstract: A display device includes a housing, a frame bonded to the housing, and a display module. The display module includes a back cover bonded to the frame, a light guide plate (LGP), a support element, a display panel, and an optical film set. The LGP is supported on the back cover and has a light exiting surface and an opposite back surface. At least two sides of the LGP's back surface are adhered on the back cover, and the LGP is made of glass. The support element and display panel are supported respectively on the LGP and support element. The optical film set is between the display panel and LGP. A hybrid LGP includes a first light guide sub-plates and a second light guide sub-plate. The second light guide sub-plate is stacked on and bonded to the first light guide sub-plate.

Abstract: A power amplifier circuit including a power transistor, a variable impedance circuit, first and second envelope detecting circuits is provided. The power transistor receives an input signal and outputs an output signal. The variable impedance circuit includes an impedance control transistor and a first filter capacitor. An equivalent impedance of the variable impedance circuit varies with the input signal. The impedance control transistor is coupled to the power transistor and receives a control voltage. The first filter capacitor is coupled between the impedance control transistor and ground. Both the first and the second envelope detecting circuits detect the input signal to dynamically control the equivalent impedance of the variable impedance circuit.