Patents by Inventor Tsung-Ming Tsai

Tsung-Ming Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129167
    Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 18, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chung-Hsien Tsai, Che-Yu Chiang, Yu-Ting Liu, Tsung-Lin Lee, Chia-Sheng Peng, Ting-Ming Yang
  • Patent number: 11963117
    Abstract: A method performed by a wireless communication device includes determining whether to transmit a first Sidelink Synchronization Signal (SLSS) according to a priority parameter when an occasion of the first SLSS collides with a Physical Sidelink Feedback Channel (PSFCH) that carries Sidelink Feedback Control Information (SFCI). The priority parameter is associated with a Physical Sidelink Shared Channel (PSSCH) that corresponds to the PSFCH.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: April 16, 2024
    Assignee: Hannibal IP LLC
    Inventors: Yu-Hsin Cheng, Tsung-Hua Tsai, Chie-Ming Chou, Yung-lan Tseng
  • Publication number: 20240121718
    Abstract: Some of the present implementations provide a method for a user equipment (UE) for receiving a power saving signal. The method receives, from a base station, a power saving signal comprising a minimum applicable K0 (K0min) that indicates a minimum scheduling offset restriction between a physical downlink control channel (PDCCH) and a physical downlink shared channel (PDSCH). The method determines an application delay based on a predefined value. The method then applies the minimum scheduling offset restriction after the application delay.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 11, 2024
    Inventors: Yu-Hsin Cheng, Chie-Ming Chou, Wan-Chen Lin, Tsung-Hua Tsai
  • Patent number: 11953740
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11944412
    Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
  • Patent number: 11944935
    Abstract: A gas detection purification device is disclosed and includes a main body, a purification unit, a gas guider, a gas detection module and a controlling-driving module. The main body includes an inlet, an outlet, an external socket and a gas-flow channel disposed between the inlet and the outlet. The purification unit is disposed in the gas-flow channel for filtering gas introduced through the gas-flow channel. The gas guider is disposed in the gas channel and located at a side of the purification unit. The gas is inhaled through the inlet, flows through the purification unit and is discharged out through the outlet. The gas detection module is plugged into or detached from the external socket. The controlling driving module is disposed within the main body and electrically connected to the gas guider to control the operation of the gas guider in an enabled state and a disabled state.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai, Wei-Ming Lee, Tsung-I Lin
  • Patent number: 11947173
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11943785
    Abstract: A method for PDCCH monitoring performed by a UE is provided. The method includes performing the PDCCH monitoring in a first group associated with at least one first PDCCH monitoring configuration; receiving, from a base station, DCI comprising an indicator; performing the PDCCH monitoring in a second group associated with at least one second PDCCH monitoring configuration; and stopping the PDCCH monitoring in the first group after receiving the indicator.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: March 26, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Wan-Chen Lin, Chie-Ming Chou, Tsung-Hua Tsai, Yu-Hsin Cheng
  • Patent number: 11923318
    Abstract: A method of manufacturing a semiconductor package includes the following steps. A backside redistribution structure is formed, wherein the backside redistribution structure comprises a first dielectric layer, and a redistribution metal layer over the first dielectric layer and comprising a dummy pattern. A semiconductor device is provided over the backside redistribution structure, wherein an active surface of the semiconductor device faces away from the backside redistribution structure, the semiconductor device is electrically insulated from the dummy pattern and overlapped with the dummy pattern from a top view of the semiconductor package. A front side redistribution structure is formed over the semiconductor device, wherein the front side redistribution structure is electrically connected to the semiconductor device. A patterning process is performed on the first dielectric layer to form a marking pattern opening exposing a part of the dummy pattern.
    Type: Grant
    Filed: August 29, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo
  • Patent number: 11852216
    Abstract: A transmission system of a decelerating mechanism includes a planetary gear unit including a sun gear being adjacent to the first surface and a planetary gear set and a holder including a carrier and several planetary shaft units rotatably disposed on the carrier. The carrier has a first surface and a second surface that face opposite directions. The planetary gear set has several first gears being adjacent to the first surface, respectively fitting around the planetary shaft units, and meshing with the sun gear, several second gears being adjacent to the second surface and being coaxially disposed with the first gears, and an internal gear ring meshing with the second gears. By respectively arranging the first gears and the second gears on two opposite sides of the carrier, mutual interference therebetween while turning could be avoided, and an overall volume of the transmission system could be reduced.
    Type: Grant
    Filed: February 20, 2023
    Date of Patent: December 26, 2023
    Assignee: TIEN HSIN INDUSTRIES CO., LTD.
    Inventors: Ming-Lan Ou, Tsung-Ming Tsai, Yu-Nong Wu
  • Publication number: 20230272841
    Abstract: A transmission system of a decelerating mechanism includes a planetary gear unit including a sun gear being adjacent to the first surface and a planetary gear set and a holder including a carrier and several planetary shaft units rotatably disposed on the carrier. The carrier has a first surface and a second surface that face opposite directions. The planetary gear set has several first gears being adjacent to the first surface, respectively fitting around the planetary shaft units, and meshing with the sun gear, several second gears being adjacent to the second surface and being coaxially disposed with the first gears, and an internal gear ring meshing with the second gears. By respectively arranging the first gears and the second gears on two opposite sides of the carrier, mutual interference therebetween while turning could be avoided, and an overall volume of the transmission system could be reduced.
    Type: Application
    Filed: February 20, 2023
    Publication date: August 31, 2023
    Applicant: TIEN HSIN INDUSTRIES CO., LTD.
    Inventors: MING-LAN OU, TSUNG-MING TSAI, YU-NONG WU
  • Patent number: 10702845
    Abstract: A reaction method with a homogeneous-phase supercritical fluid includes introducing a first fluid into a mixing chamber. A mass is less than or equal to that can be absorbed by the molecular sieve component, totally absorbing the first fluid by the molecular sieve component. A second fluid is introduced into the mixing chamber with a mass being greater than that can be absorbed by the molecular sieve component. A temperature and a pressure in the mixing chamber are adjusted to a critical temperature and a critical pressure of the second fluid, respectively, releasing the first fluid in supercritical phase from the molecular sieve component into the mixing chamber, followed by homogeneously mixing with the second fluid in supercritical phase in the mixing chamber to obtain a homogeneous-phase mixing fluid. The homogeneous-phase mixing fluid is then introduced into a reaction chamber connected to the mixing chamber.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: July 7, 2020
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Ting-Chang Chang, Chih-Yang Lin, Tsung-Ming Tsai, Chih-Cheng Shih, Ming-Hui Wang
  • Patent number: 10461252
    Abstract: A resistive random access memory overcomes the low durability of the conventional resistive random access memory. The resistive random access memory includes a first electrode, a second electrode, an enclosing layer and an oxygen-containing resistance changing layer. The first and second electrodes are separate from each other. The enclosing layer forms a first via-hole. The oxygen-containing resistance changing layer is arranged for the first via-hole. The first and second electrodes and the enclosing layer jointly enclose the oxygen-containing resistance changing layer. Each of the first electrode, the second electrode and the enclosing layer is made of an element not containing oxygen.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: October 29, 2019
    Assignee: National Sun Yat-Sen University
    Inventors: Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Cheng Shih, Chih-Hung Pan
  • Publication number: 20190020151
    Abstract: A high frequency electronic connector is formed by a first connector and a second connector. The first connector has a first body and at least one first terminal, and the first terminal is built in the first body. The second connector has a second body and at least one second terminal, and the second terminal is built in the second body and provided for inserting and connecting the first body. The first terminal has a front end surface in form of a slope or a curved surface, and the second terminal has a front end surface in form of at least one slope or at least one curved surface, so as to increase the contact area between the first and second terminals, and improve the stability of a high frequency signal transmission.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 17, 2019
    Inventors: HAO-WEN CHIEN, LI-CHUN LAN, MIN-AN CHING, PING-HUAN TSOU, WEN-YING CHENG, BOR-CHEN TSAI, TSUNG-MING TSAI, CHIH-FENG CHEN
  • Patent number: 10181669
    Abstract: A pogo pin connector includes: a piston cylinder, a cylindrical piston with its bottom latched into the piston cylinder and capable of moving along the piston. cylinder axially; a needle head partially latched into the piston and capable of rotating freely in the piston, a spring installed between the needle head and the bottom of the piston cylinder for pushing the needle head to the outside, such that the top of the needle may protrude from the top of the needle head under the elastic effect of the spring. The needle head is latched to the top of the piston under the elastic effect of the spring and the top of the needle head protrudes from the piston to contact with a connecting member for an electrical conduction when there is no external pressure.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: January 15, 2019
    Assignee: DONGGUAN C.C.P. CONTACT PROBES CO., LTD.
    Inventors: Tsung-Ming Tsai, Yu-Shou Lin, Shen-Yi Hsieh
  • Publication number: 20190009239
    Abstract: A reaction method with a homogeneous-phase supercritical fluid includes introducing a first fluid into a mixing chamber. A mass is less than or equal to that can be absorbed by the molecular sieve component, totally absorbing the first fluid by the molecular sieve component. A second fluid is introduced into the mixing chamber with a mass being greater than that can be absorbed by the molecular sieve component. A temperature and a pressure in the mixing chamber are adjusted to a critical temperature and a critical pressure of the second fluid, respectively, releasing the first fluid in supercritical phase from the molecular sieve component into the mixing chamber, followed by homogeneously mixing with the second fluid in supercritical phase in the mixing chamber to obtain a homogeneous-phase mixing fluid. The homogeneous-phase mixing fluid is then introduced into a reaction chamber connected to the mixing chamber.
    Type: Application
    Filed: September 12, 2018
    Publication date: January 10, 2019
    Inventors: Ting-Chang Chang, Chih-Yang Lin, Tsung-Ming Tsai, Chih-Cheng Shih, Ming-Hui Wang
  • Publication number: 20180227997
    Abstract: A method for increasing the luminous intensity of an ultraviolet light emitting diode includes heating an ultraviolet light emitting diode to a working temperature, and supplying electricity to the ultraviolet light emitting diode at the working temperature to make the ultraviolet light emitting diode emit ultraviolet light. An apparatus for increasing the luminous intensity of an ultraviolet light emitting diode includes a substrate, an ultraviolet light emitting diode mounted on the substrate, an electric heater mounted on the substrate, a temperature sensor, and a controller electrically connected to the ultraviolet light emitting diode, the electric heater, and the temperature sensor. The controller can heat the ultraviolet light emitting diode through the substrate.
    Type: Application
    Filed: May 17, 2017
    Publication date: August 9, 2018
    Inventors: Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Cheng Shih, Bo-Wei Chen, Chung-I Yang
  • Patent number: 10045414
    Abstract: A method for increasing the luminous intensity of an ultraviolet light emitting diode includes heating an ultraviolet light emitting diode to a working temperature, and supplying electricity to the ultraviolet light emitting diode at the working temperature to make the ultraviolet light emitting diode emit ultraviolet light. An apparatus for increasing the luminous intensity of an ultraviolet light emitting diode includes a substrate, an ultraviolet light emitting diode mounted on the substrate, an electric heater mounted on the substrate, a temperature sensor, and a controller electrically connected to the ultraviolet light emitting diode, the electric heater, and the temperature sensor. The controller can heat the ultraviolet light emitting diode through the substrate.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: August 7, 2018
    Assignee: National Sun Yat-Sen University
    Inventors: Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Cheng Shih, Bo-Wei Chen, Chung-I Yang
  • Publication number: 20180183167
    Abstract: A large-slippage connector includes: a piston cylinder, a cylindrical piston with its bottom latched into the piston cylinder and capable of moving along the piston cylinder axially; a needle head partially latched into the piston and capable of rotating freely in the piston, a spring installed between the needle head and the bottom of the piston cylinder for pushing the needle head to the outside, such that the top of the needle may protrude from the top of the needle head under the elastic effect of the spring. The needle head is latched to the top of the piston under the elastic effect of the spring and the top of the needle head protrudes from the piston to contact with a connecting member for an electrical conduction when there is no external pressure.
    Type: Application
    Filed: November 6, 2017
    Publication date: June 28, 2018
    Inventors: TSUNG-MING TSAI, YU-SHOU LIN, SHEN-YI HSIEH
  • Patent number: 9991629
    Abstract: Disclosed are a magnetic automobile vehicle device and its multifunctional module. The magnetic automobile vehicle device obtains electric power from a cigarette lighter slot of an automobile vehicle and includes a first magnet and an impact detector. The impact detector generates a distress signal when the automobile vehicle is collided. The multifunctional module includes a second magnet and an output element coupled to the magnetic automobile vehicle device by magnetic attraction and provided for charging or supplying power to the output element, and the output element has an ultrasonic transmitter, a USB slot or an O3 air purifier. Therefore, the device comes with a multifunctional configuration and meets market and consumer requirements.
    Type: Grant
    Filed: May 7, 2017
    Date of Patent: June 5, 2018
    Assignee: C.C.P. CONTACT PROBES CO., LTD.
    Inventors: Hao-Wen Chien, Li-Chun Lan, Min-An Ching, Ping-Huan Tsou, Wen-Ying Cheng, Bor-Chen Tsai, Tsung-Ming Tsai, Chih-Feng Chen