Abstract: A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Abstract: A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.

Abstract: A display device and a manufacturing method of a display device are provided. The display device includes a substrate, a plurality of first light-emitting elements, and at least one second light-emitting element. The first light-emitting elements are arranged on the substrate. A plurality of first electrodes are provided on a surface of each of the first light-emitting elements facing away from the substrate. The second light-emitting element is disposed on the substrate. A plurality of second electrodes are provided on a surface of the second light-emitting element facing away from the substrate. An orthographic projection of the second light-emitting element on the substrate partially overlaps orthographic projections of the first light-emitting elements on the substrate.

Abstract: A light-emitting diode display having sub-pixel regions is provided. Each of the sub-pixel region includes a substrate, first and second electrodes, a light-emitting diode, and at least one blocking wall. The substrate has an active device. The first and second electrodes are separately disposed on the substrate. The first electrode is electrically connected to the active device, and a horizontal distance between the first and second electrodes is W1. The light-emitting diode is disposed on the substrate and includes a semiconductor stack, and first and second pads. The first pad contacts the first electrode, the second pad contacts the second electrode, and a maximum thickness of the semiconductor stack is H1. The blocking wall is disposed on the substrate and located between the first and second pads to prevent a contact therebetween. A height of the blocking wall is H2 and a width thereof is W2. H2?½H1, and W2?W1.

Abstract: A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.

Abstract: A light-emitting substrate and a repair method thereof are provided. The light-emitting substrate includes a substrate, a first conductive line, a second conductive line, a signal line, an insulating layer, first to third light-emitting devices, and a first sub-conductive line. The first and second conductive lines and the signal line are disposed on the substrate. The insulating layer is disposed on the first and second conductive lines. The first to third light-emitting devices are disposed on the substrate. The first light-emitting device is disposed corresponding to the first conductive line. The second light-emitting device is disposed corresponding to the second conductive line. The first to third light-emitting devices are disposed corresponding to the signal line. The first sub-conductive line is disposed on the insulating layer. The first sub-conductive line is overlapped with the first and second conductive lines.

Abstract: A light emitting diode panel including a first substrate, a second substrate and a plurality of display units is provided. The display units are disposed between the first substrate and the second substrate. One display unit has multiple first regions and a second region surrounded by the first regions and includes multiple first light emitting diodes, multiple control signal lines and a second light emitting diode. Every N first light emitting diodes construct one pixel unit located within one of the first regions, wherein N is an integer greater than 1. The control signal lines are disposed on the first substrate and each extends toward one first light emitting diode. The second light emitting diode is disposed on the first substrate, located within the second region, and surrounded by the first regions. The second light emitting diode is electrically connected to one of the control signal lines.

Abstract: A light-emitting diode display having sub-pixel regions is provided. Each of the sub-pixel region includes a substrate, first and second electrodes, a light-emitting diode, and at least one blocking wall. The substrate has an active device. The first and second electrodes are separately disposed on the substrate. The first electrode is electrically connected to the active device, and a horizontal distance between the first and second electrodes is W1. The light-emitting diode is disposed on the substrate and includes a semiconductor stack, and first and second pads. The first pad contacts the first electrode, the second pad contacts the second electrode, and a maximum thickness of the semiconductor stack is H1. The blocking wall is disposed on the substrate and located between the first and second pads to prevent a contact therebetween. A height of the blocking wall is H2 and a width thereof is W2. H2?½H1, and W2?W1.

Abstract: A display device and a manufacturing method of a display device are provided. The display device includes a substrate, a plurality of first light-emitting elements, and at least one second light-emitting element. The first light-emitting elements are arranged on the substrate. A plurality of first electrodes are provided on a surface of each of the first light-emitting elements facing away from the substrate. The second light-emitting element is disposed on the substrate. A plurality of second electrodes are provided on a surface of the second light-emitting element facing away from the substrate. An orthographic projection of the second light-emitting element on the substrate partially overlaps orthographic projections of the first light-emitting elements on the substrate.

Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.

Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover an outermost sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. The sacrificial pattern layer is located between the connection patterns, and the sacrificial pattern layer is overlapped with the pads in a normal direction of the substrate.

Abstract: A transfer device including a first electrode set, a second electrode set, a shielding element, a driving circuit and an elastomer is provided. The first electrode set includes a first electrode configured to receive a first voltage and a second electrode configured to receive a second voltage and structurally separated from the first electrode, wherein a voltage difference exists between the first voltage and the second voltage. The second electrode set disposed adjacent to the first electrode set includes a third electrode configured to receive a third voltage and a fourth electrode configured to receive a fourth voltage and structurally separated from the third electrode, wherein a voltage difference exists between the third voltage and the fourth voltage. The shielding element is disposed on a substrate and located between the first electrode set and the second electrode set. The driving circuit is electrically connected to the first electrode set and the second electrode set.

Abstract: A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (?LED), a first conductive layer, and a second conductive layer. A light emitting surface of the ?LED is away from the substrate. The ?LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

Abstract: A light emitting diode panel including a first substrate, a second substrate and a plurality of display units is provided. The display units are disposed between the first substrate and the second substrate. One display unit has multiple first regions and a second region surrounded by the first regions and includes multiple first light emitting diodes, multiple control signal lines and a second light emitting diode. Every N first light emitting diodes construct one pixel unit located within one of the first regions, wherein N is an integer greater than 1. The control signal lines are disposed on the first substrate and each extends toward one first light emitting diode. The second light emitting diode is disposed on the first substrate, located within the second region, and surrounded by the first regions. The second light emitting diode is electrically connected to one of the control signal lines.

Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.

Abstract: The present disclosure provides a display panel, which includes a first light-emitting unit, a first electrode line A, a second light-emitting unit, a second electrode line A, and a first electrode line B. The first light-emitting unit includes a first electrode A and a first electrode B located at both ends of the first light-emitting unit respectively. The first electrode line A is connected to the first electrode A. The second light-emitting unit is located on a first side of the first light-emitting unit and includes a second electrode A and a second electrode B located at both ends of the second light-emitting unit respectively. The second electrode line A is connected to the second electrode A, and the second electrode line A and the first electrode line A are independent in terms of signal. The first electrode line B is arranged between the first light-emitting unit and the second light-emitting unit and connected to the first electrode B and the second electrode B respectively.

Abstract: A light-emitting substrate and a repair method thereof are provided. The light-emitting substrate includes a substrate, a first conductive line, a second conductive line, a signal line, an insulating layer, first to third light-emitting devices, and a first sub-conductive line. The first and second conductive lines and the signal line are disposed on the substrate. The insulating layer is disposed on the first and second conductive lines. The first to third light-emitting devices are disposed on the substrate. The first light-emitting device is disposed corresponding to the first conductive line. The second light-emitting device is disposed corresponding to the second conductive line. The first to third light-emitting devices are disposed corresponding to the signal line. The first sub-conductive line is disposed on the insulating layer. The first sub-conductive line is overlapped with the first and second conductive lines.

Abstract: A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (?LED), a first conductive layer, and a second conductive layer. A light emitting surface of the ?LED is away from the substrate. The ?LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

Abstract: A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.

Abstract: A transfer device including a first electrode set, a second electrode set, a shielding element, a driving circuit and an elastomer is provided. The first electrode set includes a first electrode configured to receive a first voltage and a second electrode configured to receive a second voltage and structurally separated from the first electrode, wherein a voltage difference exists between the first voltage and the second voltage. The second electrode set disposed adjacent to the first electrode set includes a third electrode configured to receive a third voltage and a fourth electrode configured to receive a fourth voltage and structurally separated from the third electrode, wherein a voltage difference exists between the third voltage and the fourth voltage. The shielding element is disposed on a substrate and located between the first electrode set and the second electrode set. The driving circuit is electrically connected to the first electrode set and the second electrode set.