Abstract: A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Abstract: The present invention proposes a self-emission type display and a repairing method thereof. The self-emission type display includes a carrier substrate and a light-emitting element. The carrier substrate includes a first electrode, a second electrode, and a plurality of repairing electrodes. The first electrode has a plurality of first strip portions connected to a first level. The second electrode has a plurality of second strip portions connected to a second level. The first electrode is separated from the second electrode, and the first level is different from the second level. The repairing electrodes are electrically insulated from the first electrode and the second electrode. The light-emitting element is disposed on the carrier substrate and has a first connecting portion and a second connecting portion. The first connecting portion is electrically connected to the first level through the first strip portions.

Abstract: A pixel structure is provided. The pixel structure includes a first sub-pixel. The first sub-pixel includes a first yellow light-emitting diode (LED), a first blue LED, and a first color filter. The first color filter is disposed above the first yellow LED and the first blue LED. The first color filter is configured to pass light of a first color.

Abstract: A display device of the present invention includes a light source layer and a sensing unit layer. The light source layer has a display side and a sensing side at the backside of the display side. The light source layer includes a plurality of first light sources generating a first light, and a plurality of second light sources generating a second light. The first light at least partially emits toward the sensing side; the second light at least partially emits toward the display side. A second wavelength of the second light is different from a first wavelength of the first light. The sensing unit layer is disposed at the sensing side of the light source layer. In a sensing mode, the plurality of the first light sources is activated to generate and provide the first light for the sensing unit layer. In a displaying mode, the plurality of the second light sources is activated to generate the second light for displaying an image at the display side.

Abstract: A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including first adhesive bumps is provided. A transfer stamp picks up first light-emitting device groups including first light-emitting devices. The transfer stamp approaches the adhesive layer such that the first light-emitting devices of one first light-emitting device group are in contact with the first adhesive bumps of one corresponding first adhesive bump group. When the first light-emitting devices are in contact with the first adhesive bumps, the remaining first light-emitting devices on the transfer stamp are staggered with the first adhesive bumps and are not in contact with the adhesive layer. The transfer stamp is kept away from the adhesive layer such that the first light-emitting devices stay on the first adhesive bumps of the corresponding first adhesive bump group.

Abstract: A pixel structure includes a plurality of sub-pixels. Each of the sub-pixels includes a first light-emitting diode (LED) and a second LED. The first LED is configured to emit a first color light. The second LED is configured to emit a second color light. Each of the first LED and the second LED includes an anode and a cathode. The anode of the first LED and the anode of the second LED are coupled to a same signal line. The cathode of the first LED and the cathode of the second LED are coupled to different signal lines.

Abstract: A light emitting device includes a substrate, a light emitting chip, a first electrode, and a second electrode. The light emitting chip includes a first and a second semiconductor layers. The first semiconductor layer is disposed on the substrate. The second semiconductor layer is stacked on the first semiconductor layer and forms a light emitting junction with the first semiconductor layer. The first electrode connects to the first semiconductor layer and the second electrode connects to the second semiconductor layer. The light emitting device may further include a transparent layer that is disposed on the substrate and surrounds and contacts the lateral of the light emitting chip. A refraction index of the transparent layer is between a refraction index of the light emitting chip and that of a vacuum. The first electrode may penetrate the second semiconductor layer to connect to the first semiconductor.

Abstract: A micro light emitting diode structure includes a light emitting stacking layer, an insulating layer, a first electrode and a second electrode. The light emitting stacking layer includes a truncated quadrangular pyramid, wherein the truncated quadrangular pyramid includes a first sidewall, a second sidewall, a third sidewall and a fourth sidewall, and a top portion of the truncated quadrangular pyramid has a recess. The insulating layer covers the first sidewall, the third sidewall and a part of the top portion of the light emitting stacking layer. The first electrode covers the first sidewall of the light emitting stacking layer, a part of the insulating layer on the top portion, and the bottom surface of the recess. The second electrode covers the third sidewall of the light emitting stacking layer, and another part of the insulating layer on the top portion and contacts the light emitting stacking layer through an opening of the insulating layer.

Abstract: A light emitting diode (LED) display includes a substrate, a pixel define layer, at least one first color micro LED, and at least one second color micro LED. The pixel define layer is disposed on the substrate and has a first opening and a second opening separated from each other. Contours of the first and second openings on a surface of the pixel define layer facing away from the substrate respectively define areas which are the same as each other. The first color micro LED is disposed in the first opening and has a first vertical projection projected on the substrate. The second color micro LED is disposed in the second opening and has a second vertical projection projected on the substrate. An area of the first vertical projection is different from an area of the second vertical projection.

Abstract: A display device includes a plurality of pixel repairing blocks and each pixel repairing block includes a first sub-pixel unit and a second sub-pixel unit. The first sub-pixel unit has a first power supply terminal and a second power supply terminal. The first power supply terminal of the first sub-pixel unit is electrically coupled to a first power line and the second power supply terminal of the first sub-pixel unit is electrically coupled to a second power line. The second sub-pixel unit has a first power supply terminal and a second power supply terminal. The first power supply terminal of the second sub-pixel unit is electrically coupled to the first power line and the second power supply terminal of the second sub-pixel units electrically coupled to a third power line. The second sub-pixel unit is adjacent to the first sub-pixel unit, and both the second sub-pixel unit and the first sub-pixel unit are configured to generate a first colored light.

Abstract: A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.

Abstract: A display device includes a plurality of pixel repairing blocks and each pixel repairing block includes a first sub-pixel unit and a second sub-pixel unit. The first sub-pixel unit has a first power supply terminal and a second power supply terminal. The first power supply terminal of the first sub-pixel unit is electrically coupled to a first power line and the second power supply terminal of the first sub-pixel unit is electrically coupled to a second power line. The second sub-pixel unit has a first power supply terminal and a second power supply terminal. The first power supply terminal of the second sub-pixel unit is electrically coupled to the first power line and the second power supply terminal of the second sub-pixel units electrically coupled to a third power line. The second sub-pixel unit is adjacent to the first sub-pixel unit, and both the second sub-pixel unit and the first sub-pixel unit are configured to generate a first colored light.

Abstract: A self-emission type display including a carrier substrate, a light-emitting element, a first electrode, and a second electrode is provided. The light-emitting element is disposed on the carrier substrate and has a first pad and a second pad. The first electrode has a plurality of first stripe portions electrically connected to a first electric potential. The first pad of the light-emitting element is electrically connected to the carrier substrate through at least one first strip portion. The second electrode has a plurality of second stripe portions electrically connected to a second electric potential. The first electrode and the second electrode are separated from each other. The second pad of the light-emitting element is electrically connected to the carrier substrate through at least one second strip portion. The first electric potential is different from the second electric potential.

Abstract: A micro light emitting diode structure includes a light emitting stacking layer, an insulating layer, a first electrode and a second electrode. The light emitting stacking layer includes a truncated quadrangular pyramid, wherein the truncated quadrangular pyramid includes a first sidewall, a second sidewall, a third sidewall and a fourth sidewall, and a top portion of the truncated quadrangular pyramid has a recess. The insulating layer covers the first sidewall, the third sidewall and a part of the top portion of the light emitting stacking layer. The first electrode covers the first sidewall of the light emitting stacking layer, a part of the insulating layer on the top portion, and the bottom surface of the recess. The second electrode covers the third sidewall of the light emitting stacking layer, and another part of the insulating layer on the top portion and contacts the light emitting stacking layer through an opening of the insulating layer.

Abstract: A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including first adhesive bumps is provided. A transfer stamp picks up first light-emitting device groups including first light-emitting devices. The transfer stamp approaches the adhesive layer such that the first light-emitting devices of one first light-emitting device group are in contact with the first adhesive bumps of one corresponding first adhesive bump group. When the first light-emitting devices are in contact with the first adhesive bumps, the remaining first light-emitting devices on the transfer stamp are staggered with the first adhesive bumps and are not in contact with the adhesive layer. The transfer stamp is kept away from the adhesive layer such that the first light-emitting devices stay on the first adhesive bumps of the corresponding first adhesive bump group.

Abstract: The present disclosure provides a display panel, which includes a first light-emitting unit, a first electrode line A, a second light-emitting unit, a second electrode line A, and a first electrode line B. The first light-emitting unit includes a first electrode A and a first electrode B located at both ends of the first light-emitting unit respectively. The first electrode line A is connected to the first electrode A. The second light-emitting unit is located on a first side of the first light-emitting unit and includes a second electrode A and a second electrode B located at both ends of the second light-emitting unit respectively. The second electrode line A is connected to the second electrode A, and the second electrode line A and the first electrode line A are independent in terms of signal. The first electrode line B is arranged between the first light-emitting unit and the second light-emitting unit and connected to the first electrode B and the second electrode B respectively.

Abstract: A self-emission type display including a carrier substrate, a light-emitting element, a first electrode, and a second electrode is provided. The light-emitting element is disposed on the carrier substrate and has a first pad and a second pad. The first electrode has a plurality of first stripe portions electrically connected to a first electric potential. The first pad of the light-emitting element is electrically connected to the carrier substrate through at least one first strip portion. The second electrode has a plurality of second stripe portions electrically connected to a second electric potential. The first electrode and the second electrode are separated from each other. The second pad of the light-emitting element is electrically connected to the carrier substrate through at least one second strip portion. The first electric potential is different from the second electric potential.

Abstract: The present invention proposes a self-emission type display and a repairing method thereof. The self-emission type display includes a carrier substrate and a light-emitting element. The carrier substrate includes a first electrode, a second electrode, and a plurality of repairing electrodes. The first electrode has a plurality of first strip portions connected to a first level. The second electrode has a plurality of second strip portions connected to a second level. The first electrode is separated from the second electrode, and the first level is different from the second level. The repairing electrodes are electrically insulated from the first electrode and the second electrode. The light-emitting element is disposed on the carrier substrate and has a first connecting portion and a second connecting portion. The first connecting portion is electrically connected to the first level through the first strip portions.

Abstract: A light emitting device includes a substrate, a light emitting chip, a first electrode, and a second electrode. The light emitting chip includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer is disposed on the substrate. The second semiconductor layer is stacked on the first semiconductor layer and forms a light emitting junction with the first semiconductor layer. The first electrode connects to the first semiconductor layer and is isolated from the second semiconductor layer. The second electrode connects to the second semiconductor layer and is isolated from the first electrode. The light emitting device may further include a transparent layer that is disposed on the substrate and surrounds and contacts the lateral of the light emitting chip. A refraction index of the transparent layer is between a refraction index of the light emitting chip and that of a vacuum.

Abstract: A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.