Abstract: A cooling system assembly may include a housing and two pump assemblies. The housing includes two pump cavities, each, disposed parallel against each other, and an inlet and outlet. Each two pump cavities includes a pump cavity inlet and pump cavity outlet. Each two pump assemblies is disposed in each two pump cavities and includes an impeller casing and a liquid driving assembly. Each liquid driving assembly includes a power source and an impeller. Each impeller casing includes a driving chamber, driving chamber inlet, and driving chamber outlet. Each power source respectively drives each impeller to rotate relative to each driving chamber. Each impeller casing defines an inlet chamber separate from the driving chamber. Each driving chamber is fluidly connected to the inlet via each driving chamber inlet, each inlet chamber, and each pump cavity inlet. The outlet is fluidly connected to each driving chamber.

Abstract: A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

Abstract: A variable-part liquid cooling pumping unit including a water block set, flow guiding plate, and water block cover of a water block unit, and a chamber body of a pump housing assembly of a pump unit is provided. The chamber body includes an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of an impeller of a rotor assembly unit. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A variable-part liquid cooling pumping unit, including a water block set, flow guiding plate, and water block cover of a water block unit, and a chamber body of a pump housing assembly of a pump unit is provided. The chamber body includes an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of an impeller of a rotor assembly unit. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.

Abstract: A semiconductor structure includes a substrate and a target pattern. The target pattern is disposed on the substrate. The top-view pattern of the target pattern includes a main portion and a protruding portion. The main portion and the protruding portion are connected with each other along the long axis of the top-view pattern of the target pattern. The protruding portion is connected to the main portion. The protruding portion includes a first portion located on one side of the long axis. The maximum width of the first portion perpendicular to the long axis is less than half of the maximum width of the main portion.

Abstract: A method for forming a semiconductor memory structure includes sequentially forming an active layer, a hard mask layer and a core layer over a substrate, and etching the core layer to form a core pattern. The core pattern includes a first strip, a second strip, and a plurality of supporting features abutting the first and second strips. The method also includes forming a spacer layer alongside the core pattern, removing the core pattern, forming a photoresist pattern above the spacer layer, etching the hard mask layer using the photoresist pattern and the spacer layer to form a hard mask pattern, and transferring the hard mask pattern into the active layer to form a gate stack.

Abstract: A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening positioned above the heat exchange chamber, a cover coupled to the base plate, the cover and the base plate defining a heat exchange chamber, the cover is over the second opening, the cover includes a first opening and a third opening defined adjacent to the first opening, the first opening and the third opening positioned above the heat exchange chamber, the first opening in fluid communication with the heat exchange chamber through the second opening, and a pumping unit disposed on the base plate, the pumping unit is over the first opening and the third opening, the pumping unit configured to circulate fluid into and out of the heat exchange chamber.

Abstract: A manufacturing method of a semiconductor structure includes the following steps. A substrate is provided. A material layer is formed on the substrate. A first hard mask pattern is formed on the material layer. The top-view pattern of the first hard mask pattern is ring-shaped. The first hard mask pattern has an opening. A second hard mask pattern is formed on the first hard mask pattern. The second hard mask pattern fills the opening. The top-view pattern of the second hard mask pattern is completely located inside the outer contour of the top-view pattern of the first hard mask pattern. The pattern of the first hard mask pattern and the pattern of the second hard mask pattern are transferred to the material layer to form a first target pattern.

Abstract: A liquid-cooling heat dissipation device including a base and two pumps. The base has a first inlet and a first outlet. The two pumps are disposed on the base and connected to the first inlet and the first outlet in a parallel arrangement.

Abstract: A liquid cooling pump unit including a pump unit and water block unit is provided. The pump unit includes a chamber body and rotor assembly unit. The rotor assembly unit is mounted to and in fluid communication with the chamber body. The pump unit is mounted to and in fluid communication with the water block unit. The chamber body includes a chamber bottom having a chamber side including a pair of velocity enhancing openings. The pair of velocity enhancing openings is configured so that the working fluid flows from the rotor assembly unit to the water block unit via the pair of velocity enhancing openings. The rotor assembly unit is configured to increase a pressure and flow of working fluid flowing through the water block unit. The pair of velocity enhancing openings is configured to increase a velocity of the flow of working fluid to the water block unit.

Abstract: A method of manufacturing a memory device includes providing a substrate and sequentially forming a stack layer and a hard mask layer on the substrate. The method includes forming a first patterned mandrel and a plurality of second patterned mandrels on the hard mask layer, wherein the first patterned mandrel is adjacent to and spaced apart from an end of the second patterned mandrels in the first direction. The method further includes using the first patterned mandrel and the second patterned mandrels as masks, patterning the hard mask layer and the stack layer sequentially to form a dummy structure and a plurality of word lines separated from each other on the substrate. A portion of the stack layer corresponding to the first mandrel is formed into the dummy structure, and a portion of the stack layer corresponding to the second patterned mandrels is formed into the word lines.

Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.

Abstract: The invention provides a light source optimization apparatus including a storage apparatus and a processor. The storage apparatus stores a plurality of modules. The processor is coupled to the storage apparatus and configured to execute the plurality of modules. The plurality of modules include a critical pattern module and a light source optimization module. The critical pattern module retrieves critical pattern data. The light source optimization module executes an ant colony optimization (ACO) algorithm according to a preset parameter to adjust an initial light source image to generate an output light source image, and the initial light source image corresponds to the critical pattern data.

Abstract: A liquid cooling heat exchange casing including a chassis having a first side is provided. The first side includes a first inlet flow passageway system having a first inlet liquid coolant opening, a first outlet flow passageway system having a first outlet liquid coolant opening, a plurality of adapters, and at least one radiator. The at least one radiator is mounted to the first inlet flow passageway system via a radiator inlet and one of the plurality of adapters and to the first outlet flow passageway system via a radiator outlet and another of the plurality of adapters. A cooling fluid flows from the first inlet liquid coolant opening, through the first inlet flow passageway system, through the at least one radiator, and through the first outlet flow passageway system, to the first outlet liquid coolant opening, before being circulated to repeat the flow process again.

Abstract: A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

Abstract: A water cooling radiator includes a first radiator having a liquid tank, first liquid return tank, first inlet radiator portion, and first outlet radiator portion. The first inlet radiator portion is adjacent to the first outlet radiator portion and both are between the liquid tank and first liquid return tank. The first inlet radiator portion includes at least one first inlet pipe thermally coupled to at least one first inlet heat dissipating fin. The first outlet radiator portion includes at least one first outlet pipe thermally coupled to at least one first outlet heat dissipating fin. A first inlet temperature of a liquid coolant at a first inlet fluid input end is greater than a first return temperature of the liquid coolant at a first outlet fluid input end. A pitch measurement of a first inlet fin pitch is greater than a pitch measurement of a first outlet fin pitch.

Abstract: A light-emitting fan includes a fan frame, an impeller, a circuit board and a light-emitting component. The impeller includes a light guiding hub and a plurality of blades. The light guiding hub is disposed on the fan frame. The light guiding hub has an outer top surface, an outer annular surface, an inner annular surface, and a recess. The outer annular surface is connected to the outer top surface, the inner annular surface faces away from the outer annular surface. The blades are connected to the outer annular surface. The recess is located at the inner annular surface so as to form a light guiding protrusion of the light guiding hub. The circuit board is disposed on the fan frame. The light-emitting component is disposed on the circuit board. Light generated by the light-emitting component is emitted from the outer top surface through the light guiding protrusion.

Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.