Abstract: A liquid cooling pump unit including a pump unit and water block unit is provided. The pump unit includes a chamber body and rotor assembly unit. The rotor assembly unit is mounted to and in fluid communication with the chamber body. The pump unit is mounted to and in fluid communication with the water block unit. The chamber body includes a chamber bottom having a chamber side including a pair of velocity enhancing openings. The pair of velocity enhancing openings is configured so that the working fluid flows from the rotor assembly unit to the water block unit via the pair of velocity enhancing openings. The rotor assembly unit is configured to increase a pressure and flow of working fluid flowing through the water block unit. The pair of velocity enhancing openings is configured to increase a velocity of the flow of working fluid to the water block unit.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A method of manufacturing a memory device includes providing a substrate and sequentially forming a stack layer and a hard mask layer on the substrate. The method includes forming a first patterned mandrel and a plurality of second patterned mandrels on the hard mask layer, wherein the first patterned mandrel is adjacent to and spaced apart from an end of the second patterned mandrels in the first direction. The method further includes using the first patterned mandrel and the second patterned mandrels as masks, patterning the hard mask layer and the stack layer sequentially to form a dummy structure and a plurality of word lines separated from each other on the substrate. A portion of the stack layer corresponding to the first mandrel is formed into the dummy structure, and a portion of the stack layer corresponding to the second patterned mandrels is formed into the word lines.

Abstract: A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate via structure is formed over a substrate. The first stacked die package structure is over the through substrate via structure, wherein the first stacked die package structure comprises a plurality of memory dies. The underfill layer is over the first stacked die package structure. the package layer is over the underfill layer, wherein the package layer has a protruding portion that extends below a top surface of the through substrate via structure.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

Abstract: A display may have an array of pixels. Display driver circuitry may supply data and control signals to the pixels. Each pixel may have seven transistors, a capacitor, and a light-emitting diode such as an organic light-emitting diode. The seven transistors may receive control signals using horizontal control lines. Each pixel may have first and second emission enable transistors that are coupled in series with a drive transistor and the light-emitting diode of that pixel. The first and second emission enable transistors may be coupled to a common control line or may be separately controlled so that on-bias stress can be effectively applied to the drive transistor. The display driver circuitry may have gate driver circuits that provide different gate line signals to different rows of pixels within the display. Different rows may also have different gate driver strengths and different supplemental gate line loading structures.

Abstract: A semiconductor device includes a drift region, a dielectric film, and an anti-type doping layer. The drift region has a first type conductivity. The anti-type doping layer is located between the drift region and the dielectric film, and has a second type conductivity opposite to the first type conductivity so as to change a current path of a current in the drift region, to thereby prevent the current from being influenced by the dielectric film. A method for manufacturing a semiconductor device and a method for reducing an influence of a dielectric film are also disclosed.

Abstract: The present disclosure provides a method for manufacturing an auto-crosslinked hyaluronic acid gel, comprising conducting auto-crosslinking reaction of a colloid containing hyaluronic acid continuously at low temperature in an acidic environment, and treating the reaction product with steam at high temperature to obtain the auto-crosslinked hyaluronic acid gel with high viscosity.

Abstract: A method includes removing a dummy gate stack to form a trench between gate spacers, depositing a gate dielectric extending into the trench, and performing a first treatment process on the gate dielectric. The first treatment process is performed using a fluorine-containing gas. A first drive-in process is then performed to drive fluorine in the fluorine-containing gas into the gate dielectric. The method further includes performing a second treatment process on the gate dielectric, wherein the second treatment process is performed using the fluorine-containing gas, and performing a second drive-in process to drive fluorine in the fluorine-containing gas into the gate dielectric. After the second drive-in process, conductive layers are formed to fill the trench.

Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.

Abstract: The invention provides a light source optimization apparatus including a storage apparatus and a processor. The storage apparatus stores a plurality of modules. The processor is coupled to the storage apparatus and configured to execute the plurality of modules. The plurality of modules include a critical pattern module and a light source optimization module. The critical pattern module retrieves critical pattern data. The light source optimization module executes an ant colony optimization (ACO) algorithm according to a preset parameter to adjust an initial light source image to generate an output light source image, and the initial light source image corresponds to the critical pattern data.

Abstract: A liquid cooling heat exchange casing including a chassis having a first side is provided. The first side includes a first inlet flow passageway system having a first inlet liquid coolant opening, a first outlet flow passageway system having a first outlet liquid coolant opening, a plurality of adapters, and at least one radiator. The at least one radiator is mounted to the first inlet flow passageway system via a radiator inlet and one of the plurality of adapters and to the first outlet flow passageway system via a radiator outlet and another of the plurality of adapters. A cooling fluid flows from the first inlet liquid coolant opening, through the first inlet flow passageway system, through the at least one radiator, and through the first outlet flow passageway system, to the first outlet liquid coolant opening, before being circulated to repeat the flow process again.

Abstract: A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

Abstract: A water cooling radiator includes a first radiator having a liquid tank, first liquid return tank, first inlet radiator portion, and first outlet radiator portion. The first inlet radiator portion is adjacent to the first outlet radiator portion and both are between the liquid tank and first liquid return tank. The first inlet radiator portion includes at least one first inlet pipe thermally coupled to at least one first inlet heat dissipating fin. The first outlet radiator portion includes at least one first outlet pipe thermally coupled to at least one first outlet heat dissipating fin. A first inlet temperature of a liquid coolant at a first inlet fluid input end is greater than a first return temperature of the liquid coolant at a first outlet fluid input end. A pitch measurement of a first inlet fin pitch is greater than a pitch measurement of a first outlet fin pitch.

Abstract: A light-emitting fan includes a fan frame, an impeller, a circuit board and a light-emitting component. The impeller includes a light guiding hub and a plurality of blades. The light guiding hub is disposed on the fan frame. The light guiding hub has an outer top surface, an outer annular surface, an inner annular surface, and a recess. The outer annular surface is connected to the outer top surface, the inner annular surface faces away from the outer annular surface. The blades are connected to the outer annular surface. The recess is located at the inner annular surface so as to form a light guiding protrusion of the light guiding hub. The circuit board is disposed on the fan frame. The light-emitting component is disposed on the circuit board. Light generated by the light-emitting component is emitted from the outer top surface through the light guiding protrusion.

Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.