Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.

Abstract: A variable-part liquid cooling pumping unit comprising a water block unit having a water block set, flow guiding plate, and water block cover, and a pump unit having a pump housing assembly is provided. The pump housing assembly comprises an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side of and plane as the pump housing assembly. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of a rotor assembly unit impeller. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.

Abstract: A pick-up structure for a memory device and method for manufacturing memory device are provided. The pick-up structure includes a substrate and a plurality of pick-up electrode strips. The substrate has a memory cell region and a peripheral pick-up region adjacent thereto. The pick-up electrode strips are parallel to a first direction and arranged on the substrate in a second direction. The second direction is different from the first direction. Each pick-up electrode strip includes a main part in the peripheral pick-up region and an extension part extending from the main part to the memory cell region. The main part is defined by fork-shaped patterns of a first mask layer. The extension part has a width less than that of the main part, and the extension part has a side wall surface aligned with a side wall surface of the main part.

Abstract: A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

Abstract: A manufacturing method of a semiconductor device includes forming a hard mask layer and a photoresist on a substrate having a layer to be etched, and performing exposure and development such that the patterned photoresist has first trenches and to expose the hard mask layer, wherein ends of the first trenches have a width gradually decreased toward an end point. The exposed hard mask layer is removed using the patterned photoresist to transfer the pattern of the first trenches to the hard mask layer such that the patterned hard mask layer has second trenches, and the ends of the second trenches have a width gradually decreased toward an end point. Spacers are formed on inner walls of the second trenches. The hard mask layer is removed such that the layer to be etched is exposed. The exposed layer to be etched is removed using the spacers as an etch mask.

Abstract: A word line layout includes a substrate, a first word line group, a second word line group, and an I-shaped third word line. The first word line group is disposed on the substrate and includes a plurality of L-shaped first word lines, and each of the first word lines has a first segment and a second segment connected to each other. The second word line group is disposed on the substrate and includes a plurality of L-shaped second word lines, and each of the second word lines has a first segment and a second segment connected to each other. The first word line group and the second word line group are arranged in juxtaposition and symmetric to each other. The I-shaped third word line is disposed on the outer side of the first word line group and the second word line group.

Abstract: The disclosure provides a liquid storage device configured for storing a working liquid and including a casing and a liquid driving device. The casing includes a reservoir and an accommodation part detachably disposed on the reservoir. The reservoir has a reservoir chamber. The liquid driving device is disposed in the accommodation part and forms a liquid chamber. The liquid driving device includes an impeller located in the liquid chamber and configured to force the working liquid to flow towards the liquid chamber from the reservoir chamber.

Abstract: A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening positioned above the heat exchange chamber, a cover coupled to the base plate, the cover and the base plate defining a heat exchange chamber, the cover is over the second opening, the cover includes a first opening and a third opening defined adjacent to the first opening, the first opening and the third opening positioned above the heat exchange chamber, the first opening in fluid communication with the heat exchange chamber through the second opening, and a pumping unit disposed on the base plate, the pumping unit is over the first opening and the third opening, the pumping unit configured to circulate fluid into and out of the heat exchange chamber

Abstract: A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

Abstract: A word line layout includes a substrate, a first word line group, a second word line group, and an I-shaped third word line. The first word line group is disposed on the substrate and includes a plurality of L-shaped first word lines, and each of the first word lines has a first segment and a second segment connected to each other. The second word line group is disposed on the substrate and includes a plurality of L-shaped second word lines, and each of the second word lines has a first segment and a second segment connected to each other. The first word line group and the second word line group are arranged in juxtaposition and symmetric to each other. The I-shaped third word line is disposed on the outer side of the first word line group and the second word line group.

Abstract: A method for forming a semiconductor memory structure includes sequentially forming an active layer, a hard mask layer and a core layer over a substrate, and etching the core layer to form a core pattern. The core pattern includes a first strip, a second strip, and a plurality of supporting features abutting the first and second strips. The method also includes forming a spacer layer alongside the core pattern, removing the core pattern, forming a photoresist pattern above the spacer layer, etching the hard mask layer using the photoresist pattern and the spacer layer to form a hard mask pattern, and transferring the hard mask pattern into the active layer to form a gate stack.

Abstract: A manufacturing method of a semiconductor device includes forming a hard mask layer and a photoresist on a substrate having a layer to be etched, and performing exposure and development such that the patterned photoresist has first trenches and to expose the hard mask layer, wherein ends of the first trenches have a width gradually decreased toward an end point. The exposed hard mask layer is removed using the patterned photoresist to transfer the pattern of the first trenches to the hard mask layer such that the patterned hard mask layer has second trenches, and the ends of the second trenches have a width gradually decreased toward an end point. Spacers are formed on inner walls of the second trenches. The hard mask layer is removed such that the layer to be etched is exposed. The exposed layer to be etched is removed using the spacers as an etch mask.

Abstract: A liquid-cooling heat dissipation device including a base and two pumps. The base has a first inlet and a first outlet. The two pumps are disposed on the base and connected to the first inlet and the first outlet in a parallel arrangement.

Abstract: The disclosure provides a liquid storage device configured for storing a working liquid and including a casing and a liquid driving device. The casing includes a reservoir and an accommodation part detachably disposed on the reservoir. The reservoir has a reservoir chamber. The liquid driving device is disposed in the accommodation part and forms a liquid chamber. The liquid driving device includes an impeller located in the liquid chamber and configured to force the working liquid to flow towards the liquid chamber from the reservoir chamber.

Abstract: The present invention relates to an anti-static photomask, including a substrate and a patterned mask layer formed on the substrate. The patterned mask layer includes a conductive strip and a conductive string, wherein the conductive strip includes an end, and the conductive string includes an isolated end. The end of the conductive strip is connected to the conductive string.

Abstract: A fan impeller has a fan hub, an outer circular frame surrounding the fan hub, and metallic blades independent from one another. Two ends of each of the metallic blades are a root and a distal end respectively, at least a portion of the root is embedded in the fan hub, and at least a portion of the distal end is embedded in the outer circular frame. The metallic blades, the plastic fan hub and the plastic outer circular frame are connected by means of insert molding, so that the number of the blades can be increased to provide increased air output.

Abstract: A fan blade includes a hub and a plurality of vanes. The vanes are connected to the hub. Each of the vanes includes a main body and a guide plate. The main body has an inflow surface and an outflow surface. The guide plate is disposed on the outflow surface. When the fan blade rotates, an airflow occurs and flows into a side of the fan blade via the inflow surface, and the guide plate guides part of the airflow to flow out of another side of the fan blade in a first direction and a second direction so as to cool an electronic component disposed adjacent to the another side of the fan blade.

Abstract: The disclosure provides an easy-to-mount leakage detection sleeve configured to be mounted on a tube. The easy-to-mount leakage detection sleeve includes a flexible water absorbing layer, a plurality of electrically conductive wires and a connecting assembly. The plurality of electrically conductive wires are disposed on the flexible water absorbing layer and spaced apart from each other. The connecting assembly includes a first connecting part and a second connecting part. The first connecting part and the second connecting part are respectively disposed on two opposite sides of the flexible water absorbing layer, and the second connecting part is detachably engaged with the first connecting part so that the flexible water absorbing layer forms a tube accommodation space configured for accommodating the tube.

Abstract: A fan blade includes a hub and a plurality of vanes. The vanes are connected to the hub. Each of the vanes includes a main body and a guide plate. The main body has an inflow surface and an outflow surface. The guide plate is disposed on the outflow surface. When the fan blade rotates, an airflow occurs and flows into a side of the fan blade via the inflow surface, and the guide plate guides part of the airflow to flow out of another side of the fan blade in a first direction and a second direction so as to cool an electronic component disposed adjacent to the another side of the fan blade.