Abstract: In example implementations, a computing device is provided. The computing device includes a system management bus, a controller communicatively coupled to the system management bus, a noise generating component communicatively coupled to the controller, a noise cancellation codec communicatively coupled to the system management bus, and a speaker communicatively coupled to the noise cancellation codec. The operating parameters of the noise generating component are provided to the controller. The noise cancellation codec is to receive the operating parameters of the noise generating component from the controller via the system management bus and to generate a noise cancellation signal based on the operating parameters. The speaker outputs the noise cancellation signal to cancel noise generated by the noise generating component.

Abstract: A method of decoding a video signal, apparatus, and a non-transitory computer-readable storage medium are provided. The method includes obtaining a video block from the video signal, obtaining spatial neighboring blocks based on the video block, obtaining up to one left non-scaled motion vector predictor (MVP) based on the multiple left spatial neighboring blocks, obtaining up to one above non-scaled MVP based on the multiple above spatial neighboring blocks, deriving, at the decoder and by reducing possibility of selecting scaled MVPs derived from the spatial neighboring blocks, an MVP candidate list based on the video block, the multiple left spatial neighboring blocks, the multiple above spatial neighboring blocks, receiving a best MVP based on the MVP candidate list, and obtaining a prediction signal of the video block based on the best MVP.

Abstract: The present invention provides a semiconductor memory device including a substrate, a plurality of capacitors and a supporting layer disposed on the substrate, wherein each of the capacitors is connected with at least one of the adjacent capacitors through the supporting layer. Each of the capacitors includes first electrodes, a high-k dielectric layer and a second electrode, and the high-k dielectric layer is disposed between the first electrodes and the second electrode. Due to the supporting layer directly contacts the high-k dielectric layer through a surface thereof, and the high-k dielectric layer completely covers the surface, the second electrode may be formed directly within openings with an enlarged dimension. Accordingly, the process difficulty of performing the deposition and etching processes within the openings may be reduced, and the capacitance of the capacitors is further increased.

Abstract: A method of manufacturing a semiconductor memory device is provided in the present invention, including steps of providing a substrate, forming word lines extending in a first direction in said substrate, forming bit lines extending in a second direction over said word lines, forming partition structures between said bit lines and right above said word lines, forming storage node contacts in spaces defined by said bit lines and said partition structures, wherein a portion of said storage node contact protruding from top surfaces of said bit lines and said partition structures is contact pad, forming a silicon nitride liner on said contact pads, said bit lines and said partition structures, and forming a silicon oxide layer on said silicon nitride liner.

Abstract: A semiconductor memory device is provided in the present invention, including a substrate, word lines in the substrate, bit lines over the word lines, partition structures between the bit lines and right above the word lines, storage node contacts in spaces defined by the bit lines and the partition structures and electrically connecting with the substrate, wherein a portion of the storage node contact protruding from top surfaces of the bit lines and the partition structures is contact pad, and contact pad isolation structures on the partition structures and between the contact pads, wherein the contact pad isolation structure includes outer silicon nitride layers and inner silicon oxide layers.

Abstract: The present invention provides a semiconductor memory device including a substrate, a plurality of capacitors and a supporting layer disposed on the substrate, wherein each of the capacitors is connected with at least one of the adjacent capacitors through the supporting layer. Each of the capacitors includes first electrodes, a high-k dielectric layer and a second electrode, and the high-k dielectric layer is disposed between the first electrodes and the second electrode. Due to the supporting layer directly contacts the high-k dielectric layer through a surface thereof, and the high-k dielectric layer completely covers the surface, the second electrode may be formed directly within openings with an enlarged dimension. Accordingly, the process difficulty of performing the deposition and etching processes within the openings may be reduced, and the capacitance of the capacitors is further increased.

Abstract: The present invention provides a semiconductor memory device and a fabricating method thereof. The semiconductor memory device includes a substrate, a plurality of capacitors and a supporting layer disposed on the substrate, wherein each of the capacitors is connected with at least one of the adjacent capacitors through the supporting layer. Each of the capacitors includes first electrodes, a high-k dielectric layer and a second electrode, and the high-k dielectric layer is disposed between the first electrodes and the second electrode. Due to the supporting layer directly contacts the high-k dielectric layer through a surface thereof, and the high-k dielectric layer completely covers the surface, the second electrode may be formed directly within openings with an enlarged dimension. Accordingly, the process difficulty of performing the deposition and etching processes within the openings may be reduced, and the capacitance of the capacitors is further increased.

Abstract: The present invention provides a semiconductor memory device and a fabricating method thereof. The semiconductor memory device includes a substrate, a plurality of capacitors and a supporting layer disposed on the substrate, wherein each of the capacitors is connected with at least one of the adjacent capacitors through the supporting layer. Each of the capacitors includes first electrodes, a high-k dielectric layer and a second electrode, and the high-k dielectric layer is disposed between the first electrodes and the second electrode. Due to the supporting layer directly contacts the high-k dielectric layer through a surface thereof, and the high-k dielectric layer completely covers the surface, the second electrode may be formed directly within openings with an enlarged dimension. Accordingly, the process difficulty of performing the deposition and etching processes within the openings may be reduced, and the capacitance of the capacitors is further increased.

Abstract: A semiconductor memory device is provided in the present invention, including a substrate, word lines in the substrate, bit lines over the word lines, partition structures between the bit lines and right above the word lines, storage node contacts in spaces defined by the bit lines and the partition structures and electrically connecting with the substrate, wherein a portion of the storage node contact protruding from top surfaces of the bit lines and the partition structures is contact pad, and contact pad isolation structures on the partition structures and between the contact pads, wherein the contact pad isolation structure includes outer silicon nitride layers and inner silicon oxide layers.

Abstract: The present invention discloses a kind of anti-pollen glasses includes a glass frame and a protection cover, the protection cover is detachably assembled at an outer side of the glass frame and has an accommodation groove adapting to the glass frame, a side wall of the accommodation groove encloses the whole glass frame and forms a protection ring surface, the protection cover is provided with relief windows corresponding to positions of the lenses. The structure of the present invention is simple, a protection cover is added on the basis of regular glasses, and the glasses can be used as the regular glasses after the protection cover is removed. It is convenient for assembling and disassembling, in an environment where anti-pollen is not required, a wearer can easily detach the protection cover to reduce pressure on a face, and can conveniently assemble the protection cover when necessary.

Abstract: Provided is a connection structure between a frame and legs of a pair of eyeglasses. A pivoting end of a leg is formed as a rotating shaft; correspondingly a pivoting end of a frame is formed as a rotating shaft base; an upper clip, an intermediate clip, and a lower clip extend from the rotating shaft base of the frame; the intermediate clip is staggered with the upper clip and the lower clip, the rotating shaft of the leg is clamped between the intermediate clip, the upper clip and the lower clip, and the rotating shaft of the leg rotates between the intermediate clip, the upper clip and the lower clip, enabling the leg to fold closed and open. The connection between the frame and the leg is screw-less, providing a simple structure, convenient installation, and comfortable wear.

Abstract: Disclosed is a connecting structure for spectacle temples. An axle slot and axle hole are formed coaxially on a spectacle frame and a preemptive groove transversely on the spectacle frame, with the preemptive groove being linked up with the axle slot at a position thereof close to the axle hole; a pivot and connecting section are formed on a spectacle temple, the connecting section is in connection with the middle of the pivot, an elastic cutting slot is respectively formed on the two ends of the pivot, the two ends of the pivot are inserted in the axle hole and axle slot, and the connecting section is aligned with the preemptive groove, allowing the spectacle temple to be coupled pivotally to the spectacle frame. Whereby, the connection is secure, and the operation feel of closing and opening the spectacle is better.

Abstract: Disclosed is a connecting structure for spectacle temples. An axle slot and axle hole are formed coaxially on a spectacle frame and a preemptive groove transversely on the spectacle frame, with the preemptive groove being linked up with the axle slot at a position thereof close to the axle hole; a pivot and connecting section are formed on a spectacle temple, the connecting section is in connection with the middle of the pivot, an elastic cutting slot is respectively formed on the two ends of the pivot, the two ends of the pivot are inserted in the axle hole and axle slot, and the connecting section is aligned with the preemptive groove, allowing the spectacle temple to be coupled pivotally to the spectacle frame. Whereby, the connection is secure, and the operation feel of closing and opening the spectacle is better.

Abstract: A pair of eyeglass with easily-installed and easily-changed eyeglass legs has a pivot stand and a pivot that are directly formed at the eyeglass frame and the eyeglass leg. The pivot has a vertical shaft as a first magnetic element and a horizontal connector to whose forward end a center portion of the vertical shaft is attached. The pivot stand has a vertical slot accommodating the vertical shaft and a recess, as physically extended through a center sector of the vertical slot, for accommodating the horizontal connector at an unfolded state. An upper end and a bottom end of the vertical slot are respectively provided with a second magnetic element and a notch for accommodating the vertical shaft as inserted.

Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.

Abstract: A pair of eyeglass with easily-installed and easily-changed eyeglass legs has a pivot stand and a pivot that are directly formed at the eyeglass frame and the eyeglass leg. The pivot has a vertical shaft as a first magnetic element and a horizontal connector to whose forward end a center portion of the vertical shaft is attached. The pivot stand has a vertical slot accommodating the vertical shaft and a recess, as physically extended through a center sector of the vertical slot, for accommodating the horizontal connector at an unfolded state. An upper end and a bottom end of the vertical slot are respectively provided with a second magnetic element and a notch for accommodating the vertical shaft as inserted.

Abstract: An illumination device capable of being controlled by blow includes a casing, a light emitting module, a driving circuit board and a blow sensing module. At least one air hole is formed on a periphery of the casing. The light emitting module is disposed on a top of the casing. The driving circuit board is disposed in the casing and electrically connected to the light emitting module. The blow sensing module is disposed in the casing, electrically connected to the driving circuit board and used for sensing blow through the at least one air hole. The driving circuit board controls the light emitting module to emit light in different brightness according to a number of blows sensed by the blow sensing module.

Abstract: An illumination device capable of being controlled by blow includes a casing, a light emitting module, a driving circuit board and a blow sensing module. At least one air hole is formed on a periphery of the casing. The light emitting module is disposed on a top of the casing. The driving circuit board is disposed in the casing and electrically connected to the light emitting module. The blow sensing module is disposed in the casing, electrically connected to the driving circuit board and used for sensing blow through the at least one air hole. The driving circuit board controls the light emitting module to emit light in different brightness according to a number of blows sensed by the blow sensing module.

Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.