Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Abstract: An IC card includes an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals. A semiconductor element is electrically connected to said innermost and outermost terminals, respectively. One of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated. The semiconductor element and the antenna are supported to maintain their form by a supporting material made of biodegradable resin.

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Abstract: An IC card includes an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals. A semiconductor element is electrically connected to said innermost and outermost terminals, respectively. One of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated. The semiconductor element and the antenna are supported to maintain their form by a supporting material made of biodegradable resin.

Abstract: An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.

Abstract: A corrosion-resistant article of a magnesium material having the gloss of the metal substrate surface comprises an anodic oxide film formed on the external surface of an article of magnesium or a magnesium alloy, which never changes the gloss of the metal substrate and a colorless or colored transparent electrodeposition coating film on the anodic film. Such an article can be prepared by immersing an article of magnesium or a magnesium alloy in an electrolyte containing a phosphate and an aluminate to thus form an anodic oxide film through anodization of the surface of the article and forming a colorless or colored transparent electrodeposition coating film on the anodic film through electrodeposition coating.

Abstract: A vacuum pump with dust collecting function is proposed to deal with the case where dust produced by a process of productions by reaction in a processing vessel under vacuum may to enter a vacuum pump. During evacuation of a processing vessel by a vacuum pump, an auxiliary dust collecting path is closed by a shut-off valve and evacuation through a main exhaust path is carried out. During a period in which evacuation by the vacuum pump is not necessary, the auxiliary dust collecting path is open to form a circulation path with the main exhaust path to carry out collection of the dust by a dust separator.

Abstract: A voltage supply circuit supplies an operational voltage to plural sense amplifier arrays and includes a plurality of MOS transistors. Each transistor is located between a power supply and one sense amplifier array. A stable operational voltage is supplied to the sense amplifier circuits in each sense amplifier array, whereby a high speed operation is realized.

Abstract: A semiconductor device includes a protection circuit and a guard ring. The guard ring is formed between a MOS transistor of a semiconductor substrate and internal circuits, to cut off a leak current from the MOS transistor to the internal circuits. The guard ring includes a well region and a pair of heavily doped impurity regions for med spaced apart from each other on the surface of the well region. The pair of doped regions have mutually different conductivity types and have substantially equal voltages applied to have potentials with respect to the source of the MOS transistor.

Abstract: A process for making a metal wall enclosure of a package for housing an electronic element. An elongated strip, to be formed as the metal sidewall of the enclosure, and a bottom plate, for closing an open end of the metal sidewall, are formed from a sheet of metal stock. At least one aperture is selectively provided in at least one of the bottom plate and the planar metal strip. The strip is prepared for folding, such as by transverse grooves formed in the strip along predetermined fold lines corresponding to corners of the metal sidewall, to facilitate folding of the strip into the desired configuration of the metal sidewall and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship.

Abstract: A multi-section Roots vacuum pump of the reverse flow cooling type with internal flow division arrangement includes a sequence of pump sections, casings for the pump sections including housings for accommodating pairs of rotor therein, inlet passages and outlet passages connected to the casing for pump sections, upper peripheral gas passages connected to the inlet passage formed around an upper portion of the housing, lower peripheral gas passages connected to a supply inlet of reverse flow cooling gas formed around a lower portion of the housing, partition walls between the upper and lower peripheral gas passages, and inter-section walls for separating adjacent pump sections.