Abstract: A semiconductor device includes a first nonvolatile storage area including a plurality of sectors, a second nonvolatile storage area, a third nonvolatile storage area located in the first nonvolatile storage area, a fourth nonvolatile storage area located in the second nonvolatile storage area, and a control portion selecting one of a first mode and a second mode. In first mode, sectors where the third nonvolatile storage area is not located in the first nonvolatile storage area are used as a main storage area, and the second nonvolatile storage area is used to store a program or data that is read before the first nonvolatile storage area is accessed, the third nonvolatile storage area being used to store control information that controls writing, reading, and erasing of data involved in the first nonvolatile storage area or the second nonvolatile storage area.

Abstract: A semiconductor device has a plurality of bit lines BL provided in a memory cell area 101, a plurality of word lines WL provided crossing the plurality of bit lines BL, a plurality of diffusion source lines VSL provided along the plurality of word lines WL, a plurality of non-volatile active cells AC storing data, the plurality of non-volatile active cells AC being provided at cross sections of the plurality of bit lines BL and the plurality of word lines WL and being connected to the plurality of bit lines BL, the plurality of word lines WL, and the plurality of diffusion source lines VSL, and a controller simultaneously writes or reads data to and from at least two active cells AC among the plurality of active cells AC, in which the number of the plurality of active cells AC is less than that of the cross sections.

Abstract: Structures, methods, and systems for enhanced erasing operation for non-volatile memory are disclosed. In one embodiment, a semiconductor device which comprises a memory cell array having a plurality of non-volatile memory cells, a negative voltage generating circuit for applying a negative voltage to a word line of the memory cell array during an erasing operation of the memory cell array, and a positive voltage generating circuit for applying a positive voltage to a well of the memory cell array when the negative voltage reaches a predetermined voltage.

Abstract: A semiconductor device has a plurality of bit lines BL provided in a memory cell area 101, a plurality of word lines WL provided crossing the plurality of bit lines BL, a plurality of diffusion source lines VSL provided along the plurality of word lines WL, a plurality of non-volatile active cells AC storing data, the plurality of non-volatile active cells AC being provided at cross sections of the plurality of bit lines BL and the plurality of word lines WL and being connected to the plurality of bit lines BL, the plurality of word lines WL, and the plurality of diffusion source lines VSL, and a controller simultaneously writes or reads data to and from at least two active cells AC among the plurality of active cells AC, in which the number of the plurality of active cells AC is less than that of the cross sections.

Abstract: A semiconductor device includes a first nonvolatile storage area including a plurality of sectors, a second nonvolatile storage area, a third nonvolatile storage area located in the first nonvolatile storage area, a fourth nonvolatile storage area located in the second nonvolatile storage area, and a control portion selecting one of a first mode and a second mode. In first mode, sectors where the third nonvolatile storage area is not located in the first nonvolatile storage area are used as a main storage area, and the second nonvolatile storage area is used to store a program or data that is read before the first nonvolatile storage area is accessed, the third nonvolatile storage area being used to store control information that controls writing, reading, and erasing of data involved in the first nonvolatile storage area or the second nonvolatile storage area.

Abstract: A semiconductor nonvolatile memory device for storing multi-bit data has a memory cell having a source region S and a drain region D formed at the surface of a semiconductor substrate, a gate insulator film and a control gate CG formed on a channel region CH between the source region S and the drain region D and a nonconductive trap gate in the gate insulator film. An indentation is provided at the surface of the semiconductor substrate covering a region from a position in the vicinity of the drain region in the channel region to the drain region. By providing the indentation on the drain region side of the channel region, the trap gate is positioned in the direction of a channel current flowing from the source region S to the drain region D. Then, a charge having run through the channel region CH is injected efficiently into the trap gate on the indentation.

Abstract: Structures, methods, and systems for enhanced erasing operation for non-volatile memory are disclosed. In one embodiment, a semiconductor device which comprises a memory cell array having a plurality of non-volatile memory cells, a negative voltage generating circuit for applying a negative voltage to a word line of the memory cell array during an erasing operation of the memory cell array, and a positive voltage generating circuit for applying a positive voltage to a well of the memory cell array when the negative voltage reaches a predetermined voltage.

Abstract: The present invention provides a semiconductor device and a method for controlling a semiconductor device having a memory cell array having a plurality of nonvolatile memory cells, the method including detecting the number of bits to be written as division data that is divided from data to be programmed into the memory cell array, comparing the number of bits with a predetermined number of bits, inverting or not inverting the division data to produce inversion data in accordance with a result of comparing the number of bits with the predetermined number of bits, and programming the inversion data into the memory cell array. The method further includes detecting the number of bits to be written as next division data and comparing the number of bits of next division data with the predetermined number of bits, while concurrently programming the inversion data into the memory cell array.

Abstract: A semiconductor device includes a program voltage supply circuit that supplies a drain of a memory cell with a program voltage, and a pull-down circuit that pulls down a potential of an output of the program voltage supply circuit in accordance with a current that flows in a data bus line connected to the memory cell. The semiconductor device may include a program voltage restrain circuit that restrains an intensity of supply of the program voltage by the program voltage supply circuit.

Abstract: The present invention provides a semiconductor device and a method for controlling a semiconductor device having a memory cell array having a plurality of nonvolatile memory cells, the method including detecting the number of bits to be written as division data that is divided from data to be programmed into the memory cell array, comparing the number of bits with a predetermined number of bits, inverting or not inverting the division data to produce inversion data in accordance with a result of comparing the number of bits with the predetermined number of bits, and programming the inversion data into the memory cell array. The method further includes detecting the number of bits to be written as next division data and comparing the number of bits of next division data with the predetermined number of bits, while concurrently programming the inversion data into the memory cell array.

Abstract: A semiconductor device includes a first cascode circuit having a first current mirror amplifying a reference current flowing through a data line of a reference cell, and a second current mirror generating a first potential from an amplified reference current; and a second cascode circuit having a third current mirror amplifying a core current flowing through a data line of a core cell, and a transistor receiving a gate voltage corresponding to the amplified reference current and generating a second potential based on a difference between an amplified core cell current and the amplified reference current. Since the second potential is generated by the difference between the core cell current and the reference cell current, the second potential swings in the full range of the ground power supply voltage to the ground potential, and the range of the amplitude of the power supply voltage can be efficiently utilized. Sensing is enabled for a fine current margin.

Abstract: A semiconductor nonvolatile memory device for storing multi-bit data has a memory cell having a source region S and a drain region D formed at the surface of a semiconductor substrate, a gate insulator film and a control gate CG formed on a channel region CH between the source region S and the drain region D and a nonconductive trap gate in the gate insulator film. An indentation is provided at the surface of the semiconductor substrate covering a region from a position in the vicinity of the drain region in the channel region to the drain region. By providing the indentation on the drain region side of the channel region, the trap gate is positioned in the direction of a channel current flowing from the source region S to the drain region D. Then, a charge having run through the channel region CH is injected efficiently into the trap gate on the indentation.

Abstract: A semiconductor nonvolatile memory device for storing multi-bit data has a memory cell having a source region S and a drain region D formed at the surface of a semiconductor substrate, a gate insulator film and a control gate CG formed on a channel region CH between the source region S and the drain region D and a nonconductive trap gate in the gate insulator film. An indentation 4 is provided at the surface of the semiconductor substrate covering a region from a position in the vicinity of the drain region in the channel region to the drain region. By providing the indentation 4 on the drain region side of the channel region, the trap gate is positioned in the direction of a channel current flowing from the source region S to the drain region D. Then, the a charge having run through the channel region CH is injected efficiently into the trap gate on the indentation.

Abstract: A semiconductor device includes a program voltage supply circuit that supplies a drain of a memory cell with a program voltage, and a pull-down circuit that pulls down a potential of an output of the program voltage supply circuit in accordance with a current that flows in a data bus line connected to the memory cell. The semiconductor device may include a program voltage restrain circuit that restrains an intensity of supply of the program voltage by the program voltage supply circuit.

Abstract: A semiconductor device includes a first cascode circuit having a first current mirror amplifying a reference current flowing through a data line of a reference cell, and a second current mirror generating a first potential from an amplified reference current; and a second cascode circuit having a third current mirror amplifying a core current flowing through a data line of a core cell, and a transistor receiving a gate voltage corresponding to the amplified reference current and generating a second potential based on a difference between an amplified core cell current and the amplified reference current. Since the second potential is generated by the difference between the core cell current and the reference cell current, the second potential swings in the full range of the ground power supply voltage to the ground potential, and the range of the amplitude of the power supply voltage can be efficiently utilized. Sensing is enabled for a fine current margin.

Abstract: A memory circuit has a plurality of blocks which further comprises a plurality of regular sectors and a spare sector, wherein each sector further comprises a plurality of memory cells, and when a regular sector in a first block is defective, this defective regular sector is replaced with a spare sector in a second block. And responding to an address to be supplied, the regular sector corresponding to the supplied address in the first block and the spare selector in the second block are selected simultaneously during a first period, and after the first period, selection of one of the regular sector and the spare sector is maintained according to the result of redundancy judgment on whether the supply address matches with the redundant address.

Abstract: A memory circuit has a plurality of blocks which further comprises a plurality of regular sectors and a spare sector, wherein each sector further comprises a plurality of memory cells, and when a regular sector in a first block is defective, this defective regular sector is replaced with a spare sector in a second block. And responding to an address to be supplied, the regular sector corresponding to the supplied address in the first block and the spare selector in the second block are selected simultaneously during a first period, and after the first period, selection of one of the regular sector and the spare sector is maintained according to the result of redundancy judgment on whether the supply address matches with the redundant address.

Abstract: A memory circuit capable of salvaging defective cells, comprises a plurality of memory blocks each having a plurality of memory cells, a region which stores a block address of defective memory block that has defective cell, and a comparator circuit which compares the block address that is an object of access with the block address of the defective memory block, and detects access to the defective memory block, wherein in case where the comparator circuit detects access to the defective memory block, this defective memory block is replaced by the memory block that has the uppermost address (or lowermost address) among the plurality of memory blocks. In case where a plurality of defective memory blocks are present, the defective memory blocks are replaced with substitutive memory blocks having block addresses in order from the uppermost bit (or lowermost bit).

Abstract: The present invention provides a semiconductor nonvolatile memory device for storing multi-bit data comprising a memory cell having a source region S and a drain region D formed at the surface of a semiconductor substrate, a gate insulator film and a control gate CG formed on a channel region CH between the source region S and the drain region D and a nonconductive trap gate in the gate insulator film. Furthermore, an indentation 4 is provided at the surface of the semiconductor substrate covering a region from a position in the vicinity of the drain region in the channel region to the drain region. By providing the indentation 4 on the drain region side of the channel region, the trap gate is positioned in the direction of a channel current flowing from the source region S to the drain region D. Then, the a charge having run through the channel region CH is injected efficiently into the trap gate on the indentation.

Abstract: A memory circuit capable of salvaging defective cells, comprises a plurality of memory blocks each having a plurality of memory cells, a region which stores a block address of defective memory block that has defective cell, and a comparator circuit which compares the block address that is an object of access with the block address of the defective memory block, and detects access to the defective memory block, wherein in case where the comparator circuit detects access to the defective memory block, this defective memory block is replaced by the memory block that has the uppermost address (or lowermost address) among the plurality of memory blocks. In case where a plurality of defective memory blocks are present, the defective memory blocks are replaced with substitutive memory blocks having block addresses in order from the uppermost bit (or lowermost bit).