Abstract: Adjacent to an opening portion 10 in an FIMS system is provided an enclosure that encloses the operation space of a door and has a second opening portion 31 opposed to the opening portion 10. A curtain nozzle is provided above the upper edge of the opening portion 10 in the upper portion in the enclosure. A purge gas is supplied from the curtain nozzle along a direction from the upper edge to the lower edge of the opening portion. In addition, a gas outlet through which the purge gas flows from the interior of the enclosure out into the exterior is provided on the wall of the enclosure to which the purge gas flowing in the above described direction is directed, whereby an increase in the partial pressure of oxidizing gases in the interior of the FOUP is prevented.

Abstract: A curtain nozzle is located above an opening portion (10) in a FIMS. A gas curtain formed of inert gas for closing the opening portion is formed. A cover is so provided as to cover a part of the curtain nozzle so as to prevent peripheral gas around an opening of the curtain nozzle from being involved in the gas curtain of the inert gas emitted from the curtain nozzle.

Abstract: The FIMS system is for use with a pod composed of a lid having an engaged portion provided on the outer surface thereof and a pod body having a latch mechanism including an engagement portion that engages the engaged portion as it moves along a predetermined axis to fix the lid to the pod. The FIMS system has a latch mechanism drive means for driving the latch mechanism along a certain axis and an engagement portion position sensor that can generate a signal indicating whether the engagement portion is at an engagement position or non-engagement position when the latch mechanism drive means drives the latch mechanism. The latch mechanism drive means and the engagement portion position sensor are provided in the vicinity of a first opening portion of the FIMS system.

Abstract: A curtain nozzle is located above an opening portion (10) in a FIMS. A gas curtain formed of inert gas for closing the opening portion is formed, and at the same time, the inert gas is also supplied to an inside of a FOUP. Here, the direction of supply of the inert gas supplied to the inside of the FOUP is such that it does not have a flow component directing toward the gas flow forming the gas curtain. The above-mentioned structure prevents increase over time in a partial pressure of oxidizing gas in the FOUP fixed by a FIMS system in an open state.

Abstract: In a pod used in an FIMS system, an engaged portion is provided on the outer surface of the lid of a pod. A through hole is provided in a flange portion that is provided around the pod opening and in which the lid is to be received. The through-hole allows access to the engaged portion from the external space. A latch mechanism is supported on the pod body side surface of the flange portion in such a way that it can slide in a direction parallel to the side wall of the flange. The engagement portion of the latch mechanism reaches the engaged portion through the aforementioned through-hole. Movement of the latch mechanism brings the engagement portion into an engaging state and a disengaged state.

Abstract: In a pod used in an FIMS system, diffusion of dust particles or the like adhering on the lid of the pod to the interior of the system is reduced. An engaged portion is provided inside the outer surface of the lid of the pod, and a flange portion provided around a pod opening to which the lid can be fitted is provided with an insertion hole that allows access to the engaged portion from the exterior space. A latch mechanism is supported on the pod body side surface of the flange portion in such a way that the latch mechanism can slide along a direction parallel to the side wall of the flange. An engagement portion of the latch mechanism reaches the engaged portion through the insertion hole, and the state of the latch mechanism changes between an engaged state and a disengaged state with movement of the latch mechanism.

Abstract: The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

Abstract: A transfer chamber is partitioned into a second chamber in which a transfer robot moving through an opening portion which can be opened/closed by a door is arranged, and a minute first chamber which serves as a FIMS system and includes a door capable of retaining a lid of a pod. The second chamber maintains a state in which an inert gas constantly circulates owing to minute nitrogen while having a pressure higher than that inside the first chamber. The first chamber is normally sealed while an oxide gas is suppressed in advance. In addition, at a time of transferring wafers, a partial pressure of the oxide gas is lowered with use of a downflow which is caused by the inert gas. Further, the first chamber and the second chamber are communicated with each other after a level of the partial pressure is confirmed with use of an oxygen level meter.

Abstract: An object of the present invention is to provide a clamping mechanism and the like, which have no likelihood of contacting the under surface of a pod when the pod is mounted on a mounting board at a loading port. To achieve the object, as an unit for clamping the pod, it is configured to comprise a clamp arm capable of nipping a clamped portion of the pod in its top end portion, a clamp member drive mechanism for performing the nipping and releasing operations of the clamp arm, and a lifting mechanism for moving up and down each clamp arm together the clamp member drive mechanism for the mounting board surface. At that time, an inclined surface having a predetermined angle for up and down directions is formed in the lower part end portion of the top end in at least one from among the clamp arms.

Abstract: The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

Abstract: The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

Abstract: The invention provides a purge apparatus that purges the gas in the interior of a FOUP with a high purging efficiency and an apparatus for opening/closing the lid of a FOUP for use in the purge apparatus. The purge apparatus has a cabinet having an opening portion through with the lid of the FOUP can pass, a door that can close the opening portion and hold the lid, and a gas supply nozzle provide in the cabinet. In this apparatus, a seal member is provided in such a way as to surround an element that is provided on the surface of the door and adapted to actuate a latch mechanism of the lid. The seal member spatially separates the element that is adapted to actuate the latch mechanism from the external space in a state in which the door is holding the lid.

Abstract: A seal member has a configuration including a ring-shaped main body portion, an inner peripheral lip portion protruding from a ring inner peripheral portion of the main body portion and an outer peripheral lip portion protruding from a ring outer peripheral portion of the main body portion. The inner peripheral lip portion takes an O-ring shape deformable in a protruding direction. The outer peripheral lip portion takes a structure deformable in a direction different from an extending direction, corresponding to a pressure in a sealed area. The member preferably sealing, when communicating a plurality of spaces separated from an external space, these spaces from an external environment, is thereby provided.

Abstract: A so-called transfer chamber in a semiconductor processing apparatus in which an FIMS system is secured is separated into a second chamber in which a transfer robot is disposed and a first chamber that is minute and includes a door capable of holding a cap of a pod as the FIMS system. In the second chamber, higher pressure than in the first chamber is maintained by a minute amount of nitrogen. In the first chamber, usually, a down flow of clean air is used via the FFU. When the wafer is transferred, a down flow of nitrogen is used. Thus, oxidation gas in the transfer chamber and released substances caused the FFU can be decreased.

Abstract: The wafer processing apparatus includes a chamber that is pressurized to a pressure that is higher than the pressure of the exterior thereof, an opening portion through which the interior and the exterior of the chamber are in communication with each other, and a door that closes the opening portion. When the opening portion is closed by the door, a portion of the opening remains as an aperture uncovered by the door. In conventional semiconductor wafer processing apparatus, the interior of the apparatus is sealed and pressurized in order to keep a high degree of cleanness in the wafer processing portion, and therefore airflow is generated due to a pressure difference between the interior and the exterior of the apparatus. With the above feature of the invention, it is possible to suppress creation of such airflow and prevent dust from entering the wafer processing apparatus to eliminate wafer contamination.

Abstract: A partial pressure of oxidizing gas in an opened state FOUP fixed in a FIMS system is reduced when the FOUP is closed. Purge gas supply nozzles are placed outside of two vertical sides of an opening portion (10) within the FIMS. A curtain nozzle is additionally installed which can form a gas curtain from purge gas above the top side of the opening portion (10). When a pod (2) is closed with a lid (4), a door opening/closing mechanism keeps the lid (4) at a given angle with respect to the flowing direction of curtain gas for a given period of time, and hence purge gas supplied to the gas curtain is additionally put into use for the purging of the interior of the pod by the lid 4.

Abstract: Adjacent to an opening portion 10 in an FISM system is provided an enclosure that encloses the operation space of a door and has a second opening portion 31 opposed to the opening portion 10. A curtain nozzle is provided above the upper edge of the opening portion 10 in the upper portion in the enclosure. A purge gas is supplied from the curtain nozzle along a direction from the upper edge to the lower edge of the opening portion. In addition, a gas outlet through which the purge gas flows from the interior of the enclosure out into the exterior is provided on the wall of the enclosure to which the purge gas flowing in the above described direction is directed, whereby an increase in the partial pressure of oxidizing gases in the interior of the FOUP is prevented.

Abstract: Provided is a detecting device for an FIMS system, for easily and simply detecting a slip-out of a glass wafer from an FOUP or detective storage thereof. The detecting device includes a light transmission sensor and a light reflection sensor. A light emitting portion of the light reflection sensor, a light receiving portion thereof, and one of a light emitting portion of the light transmission sensor and a light receiving portion thereof are disposed on one surface side of a substrate to be detected in a position in which the substrate is located. The other of the light emitting portion of the light transmission sensor and the light receiving portion thereof is disposed on the other surface side of the substrate to be detected in the position in which the substrate is located.

Abstract: The semiconductor wafer processing apparatus includes a clean box having an opening, a lid for closing the opening, a door to be in contact with the lid and to detach the lid from the clean box, a first stopper adapted to move in conjunction with movement of the clean box without a change in its relative positional relationship with the clean box, and an unmoved second stopper. With this structure, it is possible to prevent the clean box moved on the semiconductor wafer processing apparatus from colliding with the apparatus, even if the clean box manufactured by molding using a reinforced plastic in accordance with a prescribed standard includes a manufacturing error in its size.

Abstract: A seal member has a configuration including a ring-shaped main body portion, an inner peripheral lip portion protruding from a ring inner peripheral portion of the main body portion and an outer peripheral lip portion protruding from a ring outer peripheral portion of the main body portion. The inner peripheral lip portion takes an O-ring shape deformable in a protruding direction. The outer peripheral lip portion takes a structure deformable in a direction different from an extending direction, corresponding to a pressure in a sealed area. The member preferably sealing, when communicating a plurality of spaces separated from an external space, these spaces from an external environment, is thereby provided.