Abstract: A sulfonyloxime compound is provided which is represented by a general formula (1): 1

Abstract: A pattern forming method comprising forming a coating of a radiation-sensitive resin composition, which contains an acid-dissociable group-containing polysiloxane, alkali-insoluble or scarcely alkali-soluble but becoming alkali-soluble when the acid-dissociable group dissociates, on a film containing a polymer with a carbon content of 80 wt % or more and a polystyrene-reduced weight average molecular weight of 500-100,000, an applying radiation to the coating is provided. The method can form minute patterns with a high aspect ratio by suitably selecting a specific etching gas in the dry etching process, without being affected by standing waves.

Abstract: A radiation sensitive refractive index changing composition comprising (A) a decomposable compound, (B) a non-decomposable compound having a lower refractive index than the decomposable compound (A), (C) a radiation sensitive decomposer and (D) a stabilizer.

Abstract: A novel polysiloxane having the following structural units (I) and/or (II) and the structural unit (III), wherein A1 and A2 are an acid-dissociable monovalent organic group, R1 is hydrogen, monovalent (halogenated) hydrocarbon, halogen, or amino, R2 is monovalent (halogenated) hydrocarbon group, or halogen. A method of preparing such a polysiloxane, a silicon-containing alicyclic compound providing this polysiloxane, and a radiation-sensitive resin composition comprising this polysiloxane are also provided. The polysiloxane is useful as a resin component for a resist material, effectively senses radiation with a short wavelength, exhibits high transparency to radiation and superior dry etching properties, and excels in basic resist properties required for resist materials such as high sensitivity, resolution, developability, etc.

Abstract: An N-sulfonyloxyimide compound having the formula (1): wherein X represents a single bond or a double bond, Y and Z represent a hydrogen atom or others and may combine to form a cyclic structure; and R is a group having the formula (2): wherein X1 represents an organic group having an ester linkage, R1 represents an alkyl group or an alkoxyl group; and m is an integer of 1 to 11 and n is an integer of 0 to 10, satisfying m+n≦11; and chemically amplified positive and negative radiation-sensitive resin compositions using the compound are provided. The N-sulfonyloxyimide compound is a good radiation-sensitive acid-generating agent, has no problem of volatilization or side reaction, can keep dark reaction from taking place during the storage. The compound is useful as a component of radiation-sensitive chemically amplified resists.

Abstract: A radiation-sensitive resin composition comprising (A) a compound of the following formula (1), 1

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

Abstract: An anti-reflection coating-forming composition is provided. This composition includes a polymer and a solvent.

Abstract: A chemically amplified radiation-sensitive resin composition comprising a specific copolymer and a photoacid generator, wherein the copolymer contains the following recurring unit (1) and/or the recurring unit (2), and the recurring unit (3-1), 1

Abstract: A radiation-sensitive resin composition used as a chemically amplified positive tone resist responsive to short wavelength active radiation such as KrF excimer laser and ArF excimer laser is disclosed.

Abstract: A radiation-sensitive resin composition comprising an acid-labile group-containing resin and a photoacid generator is disclosed.

Abstract: A novel polysiloxane having the following structural units (I) and/or (II) and the structural unit (III), 1

Abstract: A process for the preparation of an electrode, which comprises: (1) transferring a conductive paste layer supported on a base film to a substrate to form the conductive paste layer on the substrate; (2) forming a resist film on the conductive paste layer transferred to the substrate; (3) exposing the resist film through a mask to form a resist pattern latent image; (4) developing the exposed resist film to form a resist pattern; (5) etching exposed portions of the conductive paste layer to form a conductive paste layer pattern corresponding to the resist pattern; and (6) thermosetting the pattern to form a conductive layer pattern.

Abstract: A positive-tone radiation-sensitive resin composition comprising: (A) a low molecular weight compound having at least one amino group in which the nitrogen atom has at least one hydrogen atom bonded thereto and at least one of the hydrogen atoms is replaced by a t-butoxycarbonyl group, (B) a photoacid generator, and (C-1) a resin insoluble or scarcely soluble in alkali which is protected by an acid-dissociable group and becomes soluble in alkali when the acid-dissociable group dissociates or (C-2) an alkali-soluble resin and an alkali solubility control agent is disclosed. Also disclosed is a negative-tone radiation-sensitive resin composition comprising the low molecular weight compound (A), the photoacid generator (B), an alkali-soluble resin (D), and a compound capable of crosslinking with the alkali-soluble resin in the presence of an acid(E).

Abstract: A radiation sensitive resin composition for microlens comprising (a) an alkali-soluble resin, (b) a 1,2-quinonediazide compound, (c) a compound having at least 2 epoxy groups in the molecule, (d) a melamine and (e) a trihalomethyltriazine or an onium salt, which composition exhibits high sensitivity, high resolution and high yield of residual film thickness in the formation of a lens pattern and is small in dependency on heating conditions in the preparation of a microlens.

Abstract: A radiation-sensitive resin composition comprises (a) an alkali-soluble resin, (b) a 1,2-quinone diazide compound, and (c) an aromatic compound having a specified molecular structure, as essential constituents. The composition is extremely useful for forming a positive type photoresist on a substrate having a high reflectance.