Abstract: The present invention provides an interlayer for laminated glass which comprises at least one layer composed of an opaque ethylene-vinyl acetate copolymer resin composition or opaque polyvinyl acetal resin composition, and also provides the laminated glass using such interlayers. The interlayer for laminated glass and the laminated glass according to the present invention can offer excellent privacy protection.

Abstract: According to one embodiment, a package for housing semiconductor element includes: a base plate including a top surface and a recessed portion formed as a downwardly-recessed portion of the top surface; a peripheral wall provided on the top surface of the base plate; a lid provided on an upper side of the peripheral wall and forming a semiconductor element housing space in cooperation with the base plate and the peripheral wall; and a feed-through terminal including a bottom end and fixed to the recessed portion so that the bottom end is located at a lower position than the top surface of the base plate except the recessed portion.

Abstract: A millimeter wave imaging apparatus includes: an imaging device having a plurality of millimeter wave sensors that are arranged in a planar manner and receive millimeter waves radiated from a subject to detect signal levels thereof; an image data generation device that generates image data of the subject based on an output from each of the millimeter wave sensors constituting the imaging device; and a case that has a placement surface on which the subject can be placed and which permits transmission of the millimeter waves. The imaging device is arranged below the placement surface of the case, so that the millimeter waves, which are radiated from a bottom part of the subject placed on the placement surface of the case, are received by the plurality of millimeter wave sensors.

Abstract: An interference reduction receiver is disclosed. The interference reduction receiver includes a weight generating unit for obtaining weights by multiplying a signal correlation matrix of an input signal and a channel response vector. The input signal is despread at two or more predetermined timings, the despread signals are multiplied by the weights, the weight-multiplied signals are added, and an original signal is obtained.

Abstract: A wireless receiver receives a signal obtained by multiplexing a plurality of signals that include a synchronization signal that is spread using a non-orthogonal code not orthogonal to a code for spreading other signals other than the synchronization signal. Then, in a case when the signals other than the synchronization signal are the target signals for decoding, the wireless receiver performs despreading with respect to the received signal using the synchronization signal and estimates the signal amplitude of the non-orthogonal code. Subsequently, the wireless receiver eliminates the spread synchronization signal from the received signal using the estimated signal amplitude of the non-orthogonal code and using the synchronization signal. Eventually, the wireless receiver performs despreading and demodulation with respect to the signal having the spread synchronization signal eliminated therefrom and decodes the target signals for decoding.

Abstract: A semiconductor package includes a package main body having a base portion and a semiconductor device accommodating portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface, and a high heat transfer element disposed in the base portion to extend from a heat generation site corresponding position corresponding to a heat generating site of the semiconductor device to a position in an outside of the heat generation site corresponding position. The base portion is configured by bringing a plurality of thin plates in close contact with each other to bond them integrally, and the high heat transfer element includes at least one combination of fluid passage formed in the base portion and a heat transfer fluid sealed in the passage, or at least one heat pipe.

Abstract: The present invention relates to a transistor for selecting a storage cell and a switch using a solid electrolyte. In a storage cell, a metal is stacked on a drain diffusion layer of a field-effect transistor formed on a semiconductor substrate surface. The solid electrolyte using the metal as a carrier is stacked on the metal. The solid electrolyte contacts with the metal via a gap, and the metal is connected to a common grounding conductor. A source of the field-effect transistor is connected to a column address line, and a gate of the field-effect transistor is connected to a row address line.

Abstract: A semiconductor package includes a base plate having first and second surfaces both facing in opposite directions, and a plurality of anisotropic heat conducting members disposed in the base plate and spaced away from each other. A semiconductor element having a heat generating unit is mounted on the first surface, and the second surface is supported on a supporting member having a thermal conductivity. Each anisotropic heat conducting member has a sheet shape intersecting with the first and second surfaces, and orientates a direction of higher thermal conductivity than the thermal conductivity of the base plate in a direction from the first surface toward the second surface.

Abstract: A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a N—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C.

Abstract: A retransmission method in a mobile communication system includes performing a first transmission of data from a first wireless communication apparatus to a second wireless communication apparatus through at least one relay station by wireless relaying; and performing retransmission processing of retransmitting the data through fewer relay stations than the first transmission, or without using any relay station, where the second wireless communication apparatus receives data transmitted based on the retransmission processing.

Abstract: A laminated glass and an interlayer film for laminated glasses are provided, which have the high performance for mitigating the impact given externally and, particularly in the case of using it as glass for vehicles, and which have the high performance for mitigating the impact when a person's head comes into collision with the glass due to the occurrence of a personal accident. Also provided is a laminated glass, wherein at least an interlayer film for laminated glasses and a glass sheet are laminated and unified, Head Injury Criteria (HIC) values, measured according to regulations of European Enhanced Vehicle-safety Committee; EEVC/WG 17, being 1,000 or lower.

Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.

Abstract: The invention improves the heat radiation efficiency by improving the heat conduction efficiency after ensuring downsizing. A plurality of projections 15 are formed on a attaching surface of a base plate 10 and the base plate 10 is structured so as to be attached to a heat radiation member via a heat conduction sheet 18 formed by a softer material than that of the base plate 10.

Abstract: Disclosed are a coating material for metal wherein a thin coating film without pinholes having excellent corrosion resistance, retort resistance, impact resistance, processing resistance, abrasion resistance, adhesiveness to a metal, flavor preservability for contents etc can be formed when applying on a metal plate or a metallic container, and a metallic container on which the coating material is applied. The coating material for metal includes thermoplastic resin particles having an average primary particle size of 10 to 800 nm obtained by cooling a solution of the thermoplastic resin. A process for preparing the coating material for metal comprises steps of (a) obtaining a solution wherein a thermoplastic resin is dissolved into an organic solvent, (b) obtaining a dispersion of particles of the thermoplastic resin having an average primary particle size of 10 to 800 nm by cooling the solution, (c) separating particles from the dispersion and (d) dispersing the separated particles in a solvent.

Abstract: The present invention provides a solid electrolyte switching device, which can maintain an on or off state when the power source is removed, the resistance of which in on the state is low, and which is capable of integration and re-programming, and FPGA and a memory device using the same, and a method of manufacturing the same.

Abstract: A heat dissipation plate having a lamination of a copper layer, a molybdenum layer and a graphite layer, and outer copper layers each provided on a surface of the lamination, is disclosed. And also a semiconductor device using the heat dissipation plate is disclosed.

Abstract: In an OFDM transmitting apparatus, where m (where m is an integer of one or greater) adjacent subcarriers are adopted as a set, an orthogonal code generator generates orthogonal codes of each set in such a manner that the orthogonal codes will be orthogonal in the time direction in regard to m subcarriers of each set and orthogonal in the subcarrier direction in regard to m pilot symbols. An orthogonal code multiplier uses orthogonal codes of each set to multiply subcarrier components of the corresponding set, and an IFFT unit applies IFFT processing to the results of multiplication in each subcarrier.

Abstract: A semiconductor package is provided with a package main body including a base portion configured by joining thin plates integrally, and a semiconductor device accommodating portion provided on one surface of the base portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface of the accommodating portion, and a heat high-transfer element including at least one layer-like member provided in the base portion. The layer-like member is configured independent of the base portion by a material having a thermal conductivity higher than that of the base portion, and extends from a position corresponding to a heat-generation site of the semiconductor device to a position in an outside of the heat-generation site corresponding position.

Abstract: A receiving device and a receiving method enabling the high-speed and high-accuracy interference reducing process are provided. The interference reduction receiving device despreading digital signal at a plurality of timings, multiplying each of the signals after being despread by a weight and combining the signals, comprises an estimation unit estimating channel response vector having, as elements, channel estimation values corresponding to the respective timings based on the digital signal, a quantizing unit quantizing the digital signal in the vicinity of the respective timings, a signal correlation matrix generation unit generating a signal correlation matrix having, as the element, each signal correlation value calculated based on the respective quantized signals, and an weight calculating unit calculating the weight based on the channel response vector and the signal correlation matrix.

Abstract: A laminated glass and an interlayer film for laminated glasses are provided, which have the high performance for mitigating the impact given externally and, particularly in the case of using it as glass for vehicles, and which have the high performance for mitigating the impact when a person's head comes into collision with the glass due to the occurrence of a personal accident. Also provided is a laminated glass, wherein at least an interlayer film for laminated glasses and a glass sheet are laminated and unified, Head Injury Criteria (HIC) values, measured according to regulations of European Enhanced Vehicle-safety Committee; EEVC/WG 17, being 1,000 or lower.