Abstract: A pressing portion of a fixture is put on a lid of a semiconductor package, and anchor portions on the opposite sides of the pressing portion are opposed to a baseplate. Two screw members are passed individually through opening parts formed spanning the pressing portion and anchor portions and threadedly engage with a heat sink through the baseplate. If the screw members are tightened in this state, the anchor portions are pressed by the baseplate, and the pressing portion presses the lid of the semiconductor package, whereby the baseplate is fixed to the heat sink in pressure contact with it.

Abstract: A package includes a conductive base plate; a ceramic wall configured to house a semiconductor device and a circuit board disposed adjoining of the semiconductor device, the ceramic wall configured to be disposed on the conductive base plate, the ceramic wall configured to include a frame shape having a screw hole in four corners; a metal seal ring configured to include a framed shape and be disposed on the ceramic wall; and a ceramic cap configured to be disposed on the metal seal ring, and the ceramic wall is screwed to the conductive base plate through the screw hole, and the package can radiate heat satisfactory in the heat generation from the semiconductor device, and can improve reliability, and can be applied to the high frequency of the microwave/millimeter wave/sub-millimeter wave band.

Abstract: In an OFDM receiving apparatus for receiving a signal that has undergone Orthogonal Frequency Division Multiplexing (OFDM) and applying FFT processing to the receive signal to demodulate transmit data, an OFDM symbol comprising a fixed number of items of sample data is extracted from a receive signal, a position at which FFT processing of the OFDM symbol starts is shifted based upon the state of multipath and FFT processing is executed from the position to which the shift has been made. For example, a channel estimation value is obtained from result of FFT processing of known data contained in the receive signal, a multipath delay profile is obtained by applying FFT processing to this channel estimation value, and the position at which the FFT processing begins is decided based upon the position of a path for which power is maximized among the delay profiles.

Abstract: To reduce the influence of Doppler shift, with the sub-carrier interval being widened in a high-frequency band, transmission timings of frames for every frequency band are matched each other. By matching the frame transmission timings, at the receiving side, once the modulation timing in one frequency band is detected, the modulation timing at another frequency band can be obtained. Therefore, demodulation can be simplified. To match the frame transmission timings, the CP length is adjusted, for example.

Abstract: A channel estimation value of each path timing is determined, a path timing, the channel estimation value of which is to be set to zero, is determined based on a reception power of each path timing and a predetermined power threshold (P0), and a channel estimation value of the detected path timing to zero.

Abstract: A mobile station provided with first and second antennas with a distance therebetween includes a reception quality measurement unit that measures, when the mobile station moves in a direction from a location of the first antenna toward a location of the second antenna, a reception quality of a radio signal provided by a base station via the second antenna; a notification unit that notifies the base station of the reception quality measured by the reception quality measurement unit; and a reception processing unit that performs a reception process of a radio signal that is transmitted by the base station, which performs adaptive modulation based on the reception quality notified by the reception unit, and is received by the first antenna.

Abstract: Even when the number of paths is increased, interfering noises can be effectively reduced by a rake receiver for use in a spread spectrum communication system. The rake receiver includes a timing detecting unit detecting a reception timing ti (i=1 to N) of each of N paths when direct spread spectrum signals of the N paths are received; an inverse spreading timing setting unit setting, as a timing for inverse spreading, a timing ti,j,k (k=1 to N, k?j) at which an inverse spread value is obtained that has interference and correlation from the jth (j=1 to N, j?i) path included in the inverse spread value of the ith path counted from the reception timing ti (i=1 to N) detected by the timing detecting unit; a plurality of correlators each obtaining an inverse spread signal of the received signal corresponding to each timing set by the inverse spreading timing setting unit; and a signal composing unit composing outputs of the plurality of correlators.

Abstract: In an equalizer arranged in a wireless communication device: information on correlation in one or more first wireless signals is generated; a channel vector is generated on the basis of the one or more first wireless signals; an extended correlation matrix which contains a correlation matrix indicating the information on correlation and is extended so as to become a circulant matrix is generated; an extended channel vector is generated by extending the channel vector so that the extended channel vector contains elements of the channel vector and has rows the number of which is identical to the number of rows of the extended correlation matrix; and weight coefficients are calculated as a solution, in the frequency domain, of an equation expressed by the extended correlation matrix and the extended channel vector, where the solution is obtained by solving the equation.

Abstract: A semiconductor package is provided with a package body including a base part and a semiconductor device housing part housing a semiconductor device. An electric terminal electrically connected to the device is provided in the housing part and is exposed to an outer surface. A high heat transfer element is arranged from a heat generating part corresponding position corresponding to a heat generating part of the device to a position outside the corresponding position in the base part. The base part is configured by contacting a plurality of thin sheets mutually closely with each other and by bonding integrally with each other. The high heat transfer element includes particles configured by a material having a thermal conductivity higher than that of the base part and dispersed in the base part. The particles are dispersed between two mutually adjacent thin sheets among the thin sheets.

Abstract: A novel compound which is useful as an agent for treating and/or preventing emesis, vomiting and/or constipation. A compound represented by the formula (I): wherein R1 and R2 are each independently hydrogen, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted cycloalkyl, optionally substituted aryl etc., R3 is hydrogen, hydroxy, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted lower alkynyl, optionally substituted lower alkoxy etc., R4 is hydrogen or lower alkyl, R5 is hydrogen, lower alkyl, cycloalkyl lower alkyl or lower alkenyl, or a pharmaceutically acceptably salt, or a solvate thereof is provided.

Abstract: Even when the number of paths is increased, interfering noises can be effectively reduced by a rake receiver for use in a spread spectrum communication system. The rake receiver includes a timing detecting unit detecting a reception timing ti (i=1 to N) of each of N paths when direct spread spectrum signals of the N paths are received; an inverse spreading timing setting unit setting, as a timing for inverse spreading, a timing ti,j,k (k=1 to N, k?j) at which an inverse spread value is obtained that has interference and correlation from the jth (j=1 to N, j?i) path included in the inverse spread value of the ith path counted from the reception timing ti (i=1 to N) detected by the timing detecting unit; a plurality of correlators each obtaining an inverse spread signal of the received signal corresponding to each timing set by the inverse spreading timing setting unit; and a signal composing unit composing outputs of the plurality of correlators.

Abstract: A autocorrelation peak detector (54) and a interference-reducing timing generator (55) decide interference-reducing timings ?±(?2??1) for eliminating interference components that arrive from an adjacent base station, and a path searcher (53) decides the path timing ? of multipath from a base station with which communication is currently in progress. A despreading timing decision unit (56) decides a plurality of despreading timings ?, ?±(?2??1) from the above-mentioned timings, fingers (571 to 573) despread a receive spread-spectrum signal at respective ones of the despreading timings, and a RAKE combiner (58) weights and combines a plurality of results of despreading to thereby diminish interference components.

Abstract: There are provided a point contact array, in which a plurality of point contacts are arranged, each point contact electrically and reversibly controlling conductance between electrodes and being applicable to an arithmetic circuit, a logic circuit, and a memory device, a NOT circuit, and an electronic circuit using the same. A circuit includes a plurality of point contacts each composed of a first electrode made of a compound conductive material having ionic conductivity and electronic conductivity and a second electrode made of a conductive substance. The conductance of each point contact is controlled to realize the circuit. Ag2S, Ag2Se, Cu2S, or Cu2Se is preferably used as the compound conductive material. When a semiconductor or insulator material is interposed between the electrodes, a crystal or an amorphous material of GeSx, GeSex, GeTex, or WOx (0<x<100) is preferably used as the semiconductor or insulator material.

Abstract: A semiconductor package includes a package main body having a base portion and a semiconductor device accommodating portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface, and a high heat transfer element disposed in the base portion to extend from a heat generation site corresponding position corresponding to a heat generating site of the semiconductor device to a position in an outside of the heat generation site corresponding position. The base portion is configured by bringing a plurality of thin plates in close contact with each other to bond them integrally, and the high heat transfer element includes at least one combination of fluid passage formed in the base portion and a heat transfer fluid sealed in the passage, or at least one heat pipe.

Abstract: A semiconductor package includes a main body having a semiconductor device accommodating portion accommodating a basic circuit including a semiconductor device, external connection terminal members protruding outside the main body, and a cooling structure reducing heat generated by the device from the main body. The cooling structure includes a coolant flowing portion including a coolant supply port to which coolant is supplied, a coolant moving space which is positioned adjacent to the accommodating portion and in which the coolant moves in a back side of the basic circuit of the accommodating portion, and a coolant discharge port which discharges the coolant from the moving space. The semiconductor package assembly includes a package support body which supports the package and which includes a coolant circulation structure supplying coolant to the flowing portion of the main body through the supply port and collecting the supplied coolant through the discharge port.

Abstract: A semiconductor package includes a base plate having first and second surfaces both facing in opposite directions, and a plurality of anisotropic heat conducting members disposed in the base plate and spaced away from each other. A semiconductor element having a heat generating unit is mounted on the first surface, and the second surface is supported on a supporting member having a thermal conductivity. Each anisotropic heat conducting member has a sheet shape intersecting with the first and second surfaces, and orientates a direction of higher thermal conductivity than the thermal conductivity of the base plate in a direction from the first surface toward the second surface.

Abstract: A heat dissipation plate having a lamination of a copper layer, a molybdenum layer and a graphite layer, and outer copper layers each provided on a surface of the lamination, is disclosed. And also a semiconductor device using the heat dissipation plate is disclosed.

Abstract: A receiver including: a delay profile generating unit to generate a delay profile from a received signal; combining unit operable to combine multiple received signals with different timings; a determining unit to determine whether or not the propagation environment of the received signals is multi-path, based on the delay profile; and a control unit operable to exclude any signal with timing whose power is equal to or lower than a predetermined threshold in the delay profile from the combining, upon the determination not being multi-path.

Abstract: A NOT circuit realized using an atomic switch serving as a two terminal device and including a first electrode made of a compound conductive material having ionic conductivity and electronic conductivity and a second electrode made of a conductive substance. Ag2S, Ag2Se, Cu2S, or Cu2Se is preferably used as the compound conductive material.

Abstract: A heat conductor that improves heat conductivity is provided. The heat conductor has a first heat conductive region and a second heat conductive region. The first heat conductive region is configured by lamination of a first metal member and a graphite member. The second heat conductive region is configured by lamination of the first metal member and a second metal member.