Abstract: A wiring circuit block is produced by forming a release layer on one of planarized principal surfaces of a mother substrate, forming an insulating layer on the release layer, patterning the insulating layer and forming a wiring layer on the patterned insulating layer, and separating the insulating layer and wiring layer from the release layer on the mother substrate. The circuit block has components, and deposited on the wiring layer, and is mounted on a base circuit board to provide a wiring device. Also, semiconductor chips are mounted on the circuit block, and the circuit block is mounted on a base circuit board to provide a semiconductor device.

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

Abstract: Reduction of parasitic capacitance originated between semiconductor chip and optical chip by reducing the connection distance thereof by means of interlayer connecting the semiconductor chip mounted on a surface of a resin layer and the optical chip buried on another surface of the resin layer with an interlayer via.

Abstract: A high frequency module device having a high frequency circuit block unit including a passive device. A plural number of unit wiring layers, each formed by an insulating layer, having a passive device unit in its portion, and by a pattern wiring, are layered on a dummy substrate, and are released from the dummy substrate to form the high frequency circuit block unit (2), which is mounted on a motherboard (3). The major surfaces of the respective unit wiring layers are planarized. The passive device unit and the pattern wiring, formed on the major surface of each unit wiring layer in the high frequency circuit block unit (2), can be formed with high accuracy to improve high frequency characteristics. The high frequency circuit block unit (2) is not in need of a base substrate, thus achieves reduction in size and cost.

Abstract: The invention provides a map display unit including a first memory for storing map data and a drawing memory for drawing the map data and displaying display-area data and a display. The map display unit includes a unit to read and decompress compressed map data stored in blocks in a data storage medium and to store the decompressed map data in the first memory; a unit to draw the stored map data in the drawing memory; and a unit to determine the display area and to display the display-area data of the drawing area in the drawing memory on the display. When there is no display-area data in the first memory, compressed map data is read and decompressed from the data storage medium by the data decompression unit. The map display unit further includes an environmental change sensor and controllers to vary the color tone of the map data with the environmental change, thereby displaying easily viewable map data.

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.

Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Abstract: The present invention relates to a thin film circuit board device having passive elements in wiring layers. The thin film circuit board device includes a base board (2) and a circuit part (3) including insulating layers (11) and (16) and pattern wiring (14) and (17) formed on a build-up forming surface (2a). On the first insulating layer (11), a receiving electrode part (21) is formed and the passive elements electrically connected to the receiving electrode part (21) are formed. In the circuit part (3), a substrate titanium film and a substrate film are laminated so as to cover the receiving electrode part (21) and the passive elements respectively. The substrate film and the substrate titanium film in areas in which a metallic film is not formed are etched through the metallic film serving as the first pattern wiring (14) formed on the substrate film as a mask. Thus, a substrate layer (23) and a substrate titanium layer (22) are formed.

Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

Abstract: Disclosed is a method of manufacturing an optical waveguide, capable of easily manufacturing an optical waveguide which can hold an excellent light propagating characteristic irrespective of the kind of a supporting substrate. On a transparent substrate, a peelability promoting film obtained by setting silicone oil and an optical waveguide made of an epoxy resin are sequentially formed. The peelability promoting film promotes the peelability between the transparent substrate and the optical waveguide with sufficient adhesion that it is not peeled off from the transparent substrate during formation of the optical waveguide. Subsequently, after adhering a multilayer wiring board to the optical waveguide via an adhering layer made of a photosetting resin, the adhering layer is irradiated with light so as to be set, thereby fixing the multilayer wiring board to the optical waveguide.

Abstract: A wiring circuit block (2) is produced by forming a release layer (6) on one of planarized principal surfaces of a mother substrate (1), forming an insulating layer (7) on the release layer (6), patterning the insulating layer (7) and forming a wiring layer (8) on the patterned insulating layer (7), and separating the insulating layer (7) and wiring layer (8) from the release layer (6) on the mother substrate (1). The circuit block (2) has components (12), (13) and (17) deposited on the wiring layer (8), and is mounted on a base circuit board (3) to provide a wiring device. Also, semiconductor chips (62) are mounted on the circuit block (2), and the circuit block (2) is mounted on a base circuit board (64) to provide a semiconductor device.

Abstract: Disclosed are a material for an optical waveguide, which has high polymerizability and high solvent resistance, an optical waveguide made of the material, and a method for manufacturing the optical waveguide. When a material for an optical waveguide from which organic material layers are made is irradiated with an energy beam, it is activated to make a cladding and a core. The material comprises an oxetane compound, an oxirane compound, and a cationic polymerization initiator. Since the oxetane compound has an oxetane ring, it has a high repeated reactivity in a chain reaction. Thus, the material has high polymerizability at the time of a chain reaction, so that a polymer having an increased mechanical strength and a high solvent resistance is produced. The oxetane compound and the oxirane compound have high compatibility with each other and the refractive index of each of the compounds is reflected in the refractive index of a cured mixture.

Abstract: Disclosed is a method of manufacturing an optical waveguide, capable of easily manufacturing an optical waveguide which can hold an excellent light propagating characteristic irrespective of the kind of a supporting substrate. On a transparent substrate, a peelability promoting film obtained by setting silicone oil and an optical waveguide made of an epoxy resin are sequentially formed. The peelability promoting film promotes the peelability between the transparent substrate and the optical waveguide with sufficient adhesion that it is not peeled off from the transparent substrate during formation of the optical waveguide. Subsequently, after adhering a multilayer wiring board to the optical waveguide via an adhering layer made of a photosetting resin, the adhering layer is irradiated with light so as to be set, thereby fixing the multilayer wiring board to the optical waveguide.

Abstract: Distinction data for distinguishing handling products of a stamp supplier from products offered to the stamp supplier is stored in a handling product database. An information image data creating portion extracts the handling products from all products, based on the distinction data. Only the extracted products are displayed as products that the stamp supplier handles, on a Web browser of a purchaser computer. Therefore, a purchaser can readily buy a product that the purchaser desires in, for example, an electronic shopping mall using the Internet.

Abstract: Templates common to stamp suppliers are stored in a common template database and stamp supplier's original templates are stored in an original template database. Templates offered in common to the stamp suppliers and the original templates of a stamp supplier stored in the original template database are seamlessly displayed together on Web browsers of purchaser computers. Therefore, the suppliers who open virtual stores in an electronic shopping mall can readily construct the virtual stores, and further be differentiated from other suppliers.

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: This invention provides optical waveguide, transmitting, and receiving devices and methods that enables bidirectional communication. Formed on an optical waveguide near a first end (A-side) to cross a direction of light propagation may be a trench-shaped space having a first boundary surface and a second boundary surface. The first boundary surface may internally reflect the light propagating through the optical waveguide from a second end (B-side) so that the reflected light may exit outward through a side surface of the optical waveguide. The transmitting light entering through an end surface on the A-side of the optical waveguide may pass through the second boundary surface and enter through the first boundary surface. In the optical waveguide formed on a substrate, the optical signal may be bidirectionally transmitted and received by a relatively simple constitution to achieve an increase in density of optical wiring.

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.