Abstract: A semiconductor apparatus includes a semiconductor device configured to include a first pad, and a socket provided over a first pad side of the semiconductor device, and configured to include, a base configured to face the semiconductor device, a first terminal provided over a semiconductor device side of the base, configured to include flexibility against a load in a direction from the semiconductor device toward the base, and coupled to the first pad, a first tubular barrier provided over the semiconductor device side and configured to surround the first terminal, and a first elastic body provided over the semiconductor device side, and configured to support the first tubular barrier and energize the first tubular barrier in a direction from the base toward the semiconductor device.

Abstract: An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

Abstract: An information processing device includes: a first distributing layer distributer configured to distribute a coolant for cooling electronic devices; and a second distributing layer distributer coupled to the first distributing layer distributer and configured to distribute the coolant, wherein the first distributing layer distributer includes a first distributing pipe and first distributing connecting pipes branched from the first distributing pipe, the first distributing pipe is disposed so that an axis of the first distributing pipe is parallel with the height direction, and the first distributing connecting pipes are arranged in the height direction, wherein the second distributing layer distributer includes second distributing pipes which are coupled to the respective first distributing connecting pipes, each of the second distributing pipes is disposed so that an axis of the second distributing pipe is parallel with the height direction, and the second distributing pipes are arranged in the height direct

Abstract: A liquid immersion cooling device for information processing apparatuses. The liquid immersion cooling device includes an immersion tank, a refrigerant liquid that is retained in the immersion tank, and a plurality of fillers that are filled in the immersion tank and that float on a surface of the refrigerant liquid to cover the surface of the refrigerant liquid.

Abstract: An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.

Abstract: An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

Abstract: A manifold includes: a branch pipe including an inflow port and a plurality of outflow ports; and a partition wall that partitions an inside of the branch pipe into a side of the inflow port and a side of the plurality of outflow ports and includes: a plurality of through-holes that have a total opening area greater than an opening area of the inflow port; and a plurality of first facing portions that face the respective outflow ports.

Abstract: An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.

Abstract: An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.

Abstract: A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.

Abstract: A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.

Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.

Abstract: A cooling system includes an immersion tank that includes a liquid coolant sealed therein, a housing that includes through-holes formed in a top portion and a bottom portion thereof, respectively, and disposed within the immersion tank, an electronic device disposed in the housing in a state of being immersed in the coolant, a coolant flow path formed between an inner surface of the immersion tank and an outer surface of the housing to couplet he through-hole in the top portion of the housing to the through-hole in the bottom portion of the housing so that the coolant flows therethrough, and a heat transfer member that transports heat of the coolant in the coolant flow path to an outside of the immersion tank.

Abstract: A device for cooling electronic components includes: a main body including the electronic components; an air blower configured to introduce air into the main body; a heat exchanger configured to cool air introduced into the main body; an evaporator with which air discharged from the main body comes into contact. The device further includes a pump configured to draw up water generated by dew condensation in the heat exchanger and to supply the water to a top portion of the evaporator.

Abstract: An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.

Abstract: An information processing apparatus includes a plurality of processors, a manifold that collects refrigerant liquid discharged from the plurality of processors, a first pipe that is coupled to the manifold and discharges the refrigerant liquid collected in the manifold, a throttle portion that is disposed in the first pipe and forms a throttle hole penetrating in an axis direction of the first pipe inside the first pipe, and a narrow tube that extends from an inside upper portion of the manifold to inside of the first pipe and is inserted into the throttle hole.

Abstract: A liquid immersion cooling device for information processing apparatuses. The liquid immersion cooling device includes an immersion tank, a refrigerant liquid that is retained in the immersion tank, and a plurality of fillers that are filled in the immersion tank and that float on a surface of the refrigerant liquid to cover the surface of the refrigerant liquid.

Abstract: A liquid immersion bath includes: a liquid immersion bath main body in which liquid coolant and an electronic device to be immersed in the coolant are placed; a coolant inlet and a coolant outlet provided to the liquid immersion bath main body; a coolant discharge port which floats on a liquid surface of the liquid coolant in the liquid immersion bath main body; and a hose which couples the coolant outlet and the coolant discharge port and bends in accordance with a movement of the coolant discharge port due to variation in a height of the liquid surface.

Abstract: An information processing device includes: a first distributing layer distributer configured to distribute a coolant for cooling electronic devices; and a second distributing layer distributer coupled to the first distributing layer distributer and configured to distribute the coolant, wherein the first distributing layer distributer includes a first distributing pipe and first distributing connecting pipes branched from the first distributing pipe, the first distributing pipe is disposed so that an axis of the first distributing pipe is parallel with the height direction, and the first distributing connecting pipes are arranged in the height direction, wherein the second distributing layer distributer includes second distributing pipes which are coupled to the respective first distributing connecting pipes, each of the second distributing pipes is disposed so that an axis of the second distributing pipe is parallel with the height direction, and the second distributing pipes are arranged in the height direct

Abstract: A cooling system includes an immersion tank that includes a liquid coolant sealed therein, a housing that includes through-holes formed in a top portion and a bottom portion thereof, respectively, and disposed within the immersion tank, an electronic device disposed in the housing in a state of being immersed in the coolant, a coolant flow path formed between an inner surface of the immersion tank and an outer surface of the housing to couplet he through-hole in the top portion of the housing to the through-hole in the bottom portion of the housing so that the coolant flows therethrough, and a heat transfer member that transports heat of the coolant in the coolant flow path to an outside of the immersion tank.