Abstract: A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component.

Abstract: A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.

Abstract: An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

Abstract: A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged portion at one end thereof and an engaging portion at the other end thereof. An engaging member is provided to engage with the engaging portions of the pins that pass though the holes in the heat sink and the holes in the substrate and protrude from the substrate. Springs are arranged between the enlarged portions of the pins and the heat sink. In assembling the semiconductor device, the pins are held collectively by a holding member, and after the semiconductor device is assembled, the holding member is removed from the pins.

Abstract: An electronic device comprises a semiconductor device having a package substrate with bumps. The semiconductor device is bonded to a mounting substrate by flip-chip bonding. A standoff member supports the package substrate on the mounting substrate with a predetermined standoff between the package substrate and the mounting substrate. The standoff member comprises a hole provided in the mounting substrate, an insertion portion provided to be contained in the hole, and a standoff portion provided to contact and support the package substrate such that the standoff portion has a height, equivalent to the predetermined standoff, on the mounting substrate and enables relative displacement of the package substrate to the mounting substrate.

Abstract: A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged portion at one end thereof and an engaging portion at the other end thereof. An engaging member is provided to engage with the engaging portions of the pins that pass though the holes in the heat sink and the holes in the substrate and protrude from the substrate. Springs are arranged between the enlarged portions of the pins and the heat sink. In assembling the semiconductor device, the pins are held collectively by a holding member, and after the semiconductor device is assembled, the holding member is removed from the pins.

Abstract: A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.