Patents by Inventor Tsuyoshi Sugihara

Tsuyoshi Sugihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9401319
    Abstract: A semiconductor device is provided, in which a first lead (11) is joined with the bottom electrode (23) of a MOS-FET (21) with first solder (51), the top electrode (22) of the MOS-FET is joined with an internal lead (31) with second solder (52), the internal lead is joined with a projection (61) of a second lead with third solder (53), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (41), wherein the first solder and second solder include support members (54) and (55), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: July 26, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Oga, Kazuyasu Sakamoto, Tsuyoshi Sugihara, Masaki Kato, Daisuke Nakashima, Tsuyoshi Jida, Gen Tada
  • Patent number: 9117688
    Abstract: Provided is a semiconductor device including: a first MOS-FET (21) joined to a first base plate (11) via solder (61); a second MOS-FET (22) joined to a second base plate (12) via solder (64); a first lead (31) joining the first base plate (11) and the second MOS-FET (22); and a second lead (32) joining the second MOS-FET (22) and a current path member (13) that gives and receives current flowing through the MOS-FETs (21, 22) to and from the outside. The second base plate (12) is more rigid than both the leads (31, 32), a boundary line (D-D) intersects the second base plate (12) without intersecting both the leads (31, 32), the boundary line including a gap portion (52) along which both the MOS-FETs (21, 22) are opposed to each other, extending in the direction in which both the MOS-FETs (21, 22) are not opposed to each other.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: August 25, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Oga, Masaki Kato, Tsuyoshi Sugihara
  • Patent number: 8967672
    Abstract: In a vehicle-body structure of a vehicle, where suspension forming members are attached to a vehicle body, there are provided a first face portion, through which the suspension forming member extends, a second face portion provided to face to the first face portion, and a support member provided between the first face portion and the second face portion and supporting the suspension forming members, and the support member is joined to said second face portion via a reinforcing member which is formed integrally with the support member or formed separately from the support member. Accordingly, vibrations of the support member can be properly restrained.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 3, 2015
    Assignee: Mazda Motor Corporation
    Inventors: Osamu Kurogi, Tsuyoshi Sugihara, Kohya Nakagawa, Kuniaki Nagao, Sakayu Terada, Miho Kowaki, Akira Iyoshi, Shigeaki Watanabe
  • Patent number: 8720984
    Abstract: In a vehicle-body structure of a vehicle which comprises at least one vehicle-body forming member forming a closed-section portion continuously in a specified direction, a partition member extending in the specified direction and partitioning an inside of the closed-section portion, and a bulkhead provided in the closed-section portion and joined to the vehicle-body forming member, the bulkhead is joined to an inner face of the vehicle-body forming member at specified positions which are located on both sides of the partition member, and the bulkhead is joined to a specified portion of the partition member which is located in the vicinity of opening portions formed at the partition member or to an end portion of the partition member in the specified direction.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: May 13, 2014
    Assignee: Mazda Motor Corporation
    Inventors: Osamu Kurogi, Tsuyoshi Sugihara, Kohya Nakagawa, Kuniaki Nagao, Sakayu Terada, Miho Kowaki, Akira Iyoshi, Shigeaki Watanabe
  • Patent number: 8708390
    Abstract: In a vehicle-body structure of a vehicle which comprises vehicle-body forming members forming a closed-section portion and having a dent portion which dents toward an inside of the closed-section portion, and a reinforcing member provided in the closed-section portion and joined to the vehicle-body forming members, a joint portion of the vehicle-body forming members and the reinforcing member includes a rigid joint portion where the vehicle-body forming members and the reinforcing member are joined with a direct contact thereof and a flexible joint portion where the vehicle-body forming members and the reinforcing member are joined via a damping member provided therebetween, and this joint portion is provided at or in the vicinity of the dent portion.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: April 29, 2014
    Assignee: Mazda Motor Corporation
    Inventors: Osamu Kurogi, Tsuyoshi Sugihara, Kohya Nakagawa, Kuniaki Nagao, Sakayu Terada, Miho Kowaki, Akira Iyoshi, Shigeaki Watanabe
  • Patent number: 8702160
    Abstract: In a frame having a closed-section portion which is formed by joining a first member having a U-shaped section and a second member having a flat-plate shape, a bulkhead is provided in the closed-section portion as a reinforcing member, flanges of the bulkhead and the first and second members are joined with a rigid joint portion where they are joined by a spot welding and a flexible joint portion where they are joined via a damping member. Thereby, transmission of vibrations can be properly restrained, improving the rigidity of the portion having the closed-section portion.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: April 22, 2014
    Assignee: Mazda Motor Corporation
    Inventors: Osamu Kurogi, Tsuyoshi Sugihara, Kohya Nakagawa, Kuniaki Nagao, Sakayu Terada, Miho Kowaki, Akira Iyoshi, Shigeaki Watanabe
  • Publication number: 20130320818
    Abstract: Provided is a semiconductor device including: a first MOS-FET (21) joined to a first base plate (11) via solder (61); a second MOS-FET (22) joined to a second base plate (12) via solder (64); a first lead (31) joining the first base plate (11) and the second MOS-FET (22); and a second lead (32) joining the second MOS-FET (22) and a current path member (13) that gives and receives current flowing through the MOS-FETs (21, 22) to and from the outside. The second base plate (12) is more rigid than both the leads (31, 32), a boundary line (D-D) intersects the second base plate (12) without intersecting both the leads (31, 32), the boundary line including a gap portion (52) along which both the MOS-FETs (21, 22) are opposed to each other, extending in the direction in which both the MOS-FETs (21, 22) are not opposed to each other.
    Type: Application
    Filed: April 18, 2011
    Publication date: December 5, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takuya Oga, Masaki Kato, Tsuyoshi Sugihara
  • Publication number: 20130307130
    Abstract: A semiconductor device is provided, in which a first lead (11) is joined with the bottom electrode (23) of a MOS-FET (21) with first solder (51), the top electrode (22) of the MOS-FET is joined with an internal lead (31) with second solder (52), the internal lead is joined with a projection (61) of a second lead with third solder (53), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (41), wherein the first solder and second solder include support members (54) and (55), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.
    Type: Application
    Filed: June 9, 2011
    Publication date: November 21, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takuya Oga, Kazuyasu Sakamoto, Tsuyoshi Sugihara, Masaki Kato, Daisuke Nakashima, Tsuyoshi Jida, Gen Tada
  • Publication number: 20130049393
    Abstract: In a vehicle-body structure of a vehicle, where suspension forming members are attached to a vehicle body, there are provided a first face portion, through which the suspension forming member extends, a second face portion provided to face to the first face portion, and a support member provided between the first face portion and the second face portion and supporting the suspension forming members, and the support member is joined to said second face portion via a reinforcing member which is formed integrally with the support member or formed separately from the support member. Accordingly, vibrations of the support member can be properly restrained.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Osamu KUROGI, Tsuyoshi SUGIHARA, Kohya NAKAGAWA, Kuniaki NAGAO, Sakayu TERADA, Miho KOWAKI, Akira IYOSHI, Shigeaki WATANABE
  • Publication number: 20130049391
    Abstract: In a frame having a closed-section portion which is formed by joining a first member having a U-shaped section and a second member having a flat-plate shape, a bulkhead is provided in the closed-section portion as a reinforcing member, flanges of the bulkhead and the first and second members are joined with a rigid joint portion where they are joined by a spot welding and a flexible joint portion where they are joined via a damping member. Thereby, transmission of vibrations can be properly restrained, improving the rigidity of the portion having the closed-section portion.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Osamu KUROGI, Tsuyoshi SUGIHARA, Kohya NAKAGAWA, Kuniaki NAGAO, Sakayu TERADA, Miho KOWAKI, Akira IYOSHI, Shigeaki WATANABE
  • Publication number: 20130049408
    Abstract: In a vehicle-body structure of a vehicle which comprises at least one vehicle-body forming member forming a closed-section portion continuously in a specified direction, a partition member extending in the specified direction and partitioning an inside of the closed-section portion, and a bulkhead provided in the closed-section portion and joined to the vehicle-body forming member, the bulkhead is joined to an inner face of the vehicle-body forming member at specified positions which are located on both sides of the partition member, and the bulkhead is joined to a specified portion of the partition member which is located in the vicinity of opening portions formed at the partition member or to an end portion of the partition member in the specified direction.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Osamu KUROGI, Tsuyoshi SUGIHARA, Kohya NAKAGAWA, Kuniaki NAGAO, Sakayu TERADA, Miho KOWAKI, Akira IYOSHI, Shigeaki WATANABE
  • Publication number: 20130049392
    Abstract: In a vehicle-body structure of a vehicle which comprises vehicle-body forming members forming a closed-section portion and having a dent portion which dents toward an inside of the closed-section portion, and a reinforcing member provided in the closed-section portion and joined to the vehicle-body forming members, a joint portion of the vehicle-body forming members and the reinforcing member includes a rigid joint portion where the vehicle-body forming members and the reinforcing member are joined with a direct contact thereof and a flexible joint portion where the vehicle-body forming members and the reinforcing member are joined via a damping member provided therebetween, and this joint portion is provided at or in the vicinity of the dent portion.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Osamu KUROGI, Tsuyoshi SUGIHARA, Kohya NAKAGAWA, Kuniaki NAGAO, Sakayu TERADA, Miho KOWAKI, Akira IYOSHI, Shigeaki WATANABE
  • Publication number: 20130049405
    Abstract: In a vehicle-body structure of a vehicle which comprises a frame comprised of vehicle-body forming members forming a closed-section portion, a reinforcing member provided in the closed-section portion and joined to the frame, and another vehicle-body forming member joined to an outer face of the frame, which is different from the vehicle-body forming members of the frame, a joint portion of the frame and the reinforcing member includes a rigid joint portion where the frame and the reinforcing member are joined with a direct contact thereof and a flexible joint portion where the frame and the reinforcing member are joined via a damping member provided therebetween, and the joint portion is provided at a specified position on an inner face of the frame located in the vicinity of a portion where the forming member is joined to the frame.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Osamu KUROGI, Tsuyoshi SUGIHARA, Kohya NAKAGAWA, Kuniaki NAGAO, Sakayu TERADA, Miho KOWAKI, Akira IYOSHI, Shigeaki WATANABE
  • Patent number: 7909140
    Abstract: There is provided a lubricating structure of a planetary gear mechanism which can simplify the outer shape of an introducing section formed by an oil catch plate, for introducing lubricating oil, and ensure a high degree of design freedom. In a double pinion type planetary gear mechanism, the distance from the axis of a carrier to the outermost edge of an opening in the direction of the carrier's diameter in an lubricating oil introducing hole formed in an outer diameter side pinion shaft and the distance from the axis of the carrier to the outermost edge of an opening in the direction of the carrier's diameter in an lubricating oil introducing hole formed in an inner diameter side pinion shaft are equal to each other. Therefore, lubricating oil can be supplied to the inner diameter side pinion shaft through the introducing section irrespective of the amount of lubricating oil that can be supplied to the outer diameter side pinion shaft.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: March 22, 2011
    Assignee: Jatco Ltd
    Inventors: Tsuyoshi Sugihara, Takamitsu Niibune, Tooru Koyama
  • Patent number: 7808031
    Abstract: The present fabrication method includes the steps of: providing a nitride film in a main surface of a semiconductor substrate; providing an upper trench, with the nitride film used as a mask; filling the upper trench with an oxide film introduced therein; removing the oxide film to expose at least a portion of a bottom of the upper trench and allowing a remainder of the oxide film to serve as a sidewall; providing a lower trench in a bottom of the upper trench, with the sidewall used as a mask; and with the upper trench having the sidewall remaining therein, providing an oxide film in the upper trench and the lower trench. This can provide a semiconductor device fabrication method and a semiconductor device preventing a contact from penetrating the device in an interconnection process.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: October 5, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Jun Sumino, Satoshi Shimizu, Tsuyoshi Sugihara
  • Patent number: 7789196
    Abstract: Disclosed is a sound-absorbing material, which has a flow resistivity R of 3.3×104 N·s/m4 or more, a Young's modulus E of 1.2×103 to 2.0×104 N/m2, and a loss factor ? of 0.12 or less. The sound-absorbing material of the present invention can enhance a sound absorption capability in a wide range of a low/intermediate-frequency region to a high-frequency region at a higher level as compared with conventional sound-absorbing materials.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: September 7, 2010
    Assignee: Mazda Motor Corporation
    Inventors: Chie Fukuhara, Naoko Yorozu, Eiji Murasawa, Tsuyoshi Sugihara
  • Publication number: 20090038881
    Abstract: Disclosed is a sound-absorbing material, which has a flow resistivity R of 3.3×104 N·s/m4 or more, a Young's modulus E of 1.2×103 to 2.0×104 N/m2, and a loss factor ? of 0.12 or less. The sound-absorbing material of the present invention can enhance a sound absorption capability in a wide range of a low/intermediate-frequency region to a high-frequency region at a higher level as compared with conventional sound-absorbing materials.
    Type: Application
    Filed: July 30, 2008
    Publication date: February 12, 2009
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Chie FUKUHARA, Naoko YOROZU, Eiji MURASAWA, Tsuyoshi SUGIHARA
  • Patent number: 7326627
    Abstract: The present fabrication method includes the steps of: providing a nitride film in a main surface of a semiconductor substrate; providing an upper trench, with the nitride film used as a mask; filling the upper trench with an oxide film introduced therein; removing the oxide film to expose at least a portion of a bottom of the upper trench and allowing a remainder of the oxide film to serve as a sidewall; providing a lower trench in a bottom of the upper trench, with the sidewall used as a mask; and with the upper trench having the sidewall remaining therein, providing an oxide film in the upper trench and the lower trench. This can provide a semiconductor device fabrication method and a semiconductor device preventing a contact from penetrating the device in an interconnection process.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: February 5, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Jun Sumino, Satoshi Shimizu, Tsuyoshi Sugihara
  • Publication number: 20080017903
    Abstract: The present fabrication method includes the steps of: providing a nitride film in a main surface of a semiconductor substrate; providing an upper trench, with the nitride film used as a mask; filling the upper trench with an oxide film introduced therein; removing the oxide film to expose at least a portion of a bottom of the upper trench and allowing a remainder of the oxide film to serve as a sidewall; providing a lower trench in a bottom of the upper trench, with the sidewall used as a mask; and with the upper trench having the sidewall remaining therein, providing an oxide film in the upper trench and the lower trench. This can provide a semiconductor device fabrication method and a semiconductor device preventing a contact from penetrating the device in an interconnection process.
    Type: Application
    Filed: July 6, 2007
    Publication date: January 24, 2008
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Jun Sumino, Satoshi Shimizu, Tsuyoshi Sugihara
  • Publication number: 20070269949
    Abstract: The present fabrication method includes the steps of: providing a nitride film in a main surface of a semiconductor substrate; providing an upper trench, with the nitride film used as a mask; filling the upper trench with an oxide film introduced therein; removing the oxide film to expose at least a portion of a bottom of the upper trench and allowing a remainder of the oxide film to serve as a sidewall; providing a lower trench in a bottom of the upper trench, with the sidewall used as a mask; and with the upper trench having the sidewall remaining therein, providing an oxide film in the upper trench and the lower trench. This can provide a semiconductor device fabrication method and a semiconductor device preventing a contact from penetrating the device in an interconnection process.
    Type: Application
    Filed: July 6, 2007
    Publication date: November 22, 2007
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Jun Sumino, Satoshi Shimizu, Tsuyoshi Sugihara