Patents by Inventor Tung-Ching Tseng

Tung-Ching Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030148615
    Abstract: A chemical mechanical polishing apparatus that is equipped with a chilled retaining ring and a method for using the apparatus are described. The retaining ring is mounted therein a heat transfer means such as a metal tube and flowing therethrough a heat exchanging fluid for carrying away heat from the wafer mounted in the retaining ring, resulting in a temperature reduction in the slurry solution that contacts the wafer. The present invention apparatus and method therefore reduces the delamination problem for low k dielectric materials during polishing and the wafer scratching problem.
    Type: Application
    Filed: February 6, 2002
    Publication date: August 7, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Wei Chung, Tung-Ching Tseng, Tsu Shih, Syun-Ming Jang
  • Patent number: 6579151
    Abstract: A polishing head for holding a wafer during a polishing process without the edge-effect or the edge peeling defect and a method for improving edge profile on a wafer during a polishing process are described. The polishing head is constructed by a carrier head, a retaining ring, and at least three piezoelectric actuator/sensors mounted in-between a recessed peripheral edge portion of the carrier head and a top surface of the retaining ring.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: June 17, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Tung-Ching Tseng, Sheng Yung Liu
  • Patent number: 6579150
    Abstract: A dual detection method for end point in a chemical mechanical polishing process is described. The dual detection method utilizes both an optical detection device and an acoustical detection device. The acoustical detection device may also be used independently in certain applications without the optical detection device. The acoustical detection device determines an end point and stops the CMP process when a volume of the acoustical emission changes by at least 30% from its initial volume, or preferably changes by at least 50% from its initial volume.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: June 17, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventor: Tung-Ching Tseng
  • Publication number: 20030027498
    Abstract: A polishing head for holding a wafer during a polishing process without the edge-effect or the edge peeling defect and a method for improving edge profile on a wafer during a polishing process are described. The polishing head is constructed by a carrier head, a retaining ring, and at least three piezoelectric actuator/sensors mounted in-between a recessed peripheral edge portion of the carrier head and a top surface of the retaining ring.
    Type: Application
    Filed: August 2, 2001
    Publication date: February 6, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Ching Tseng, Sheng Yung Liu
  • Publication number: 20030008597
    Abstract: A dual detection method for end point in a chemical mechanical polishing process is described. The dual detection method utilizes both an optical detection device and an acoustical detection device. The acoustical detection device may also be used independently in certain applications without the optical detection device. The acoustical detection device determines an end point and stops the CMP process when a volume of the acoustical emission changes by at least 30% from its initial volume, or preferably changes by at least 50% from its initial volume.
    Type: Application
    Filed: July 5, 2001
    Publication date: January 9, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co.,Ltd.
    Inventor: Tung-Ching Tseng
  • Patent number: 6176930
    Abstract: An apparatus and method for controlling a flow of process material to a deposition chamber. The apparatus comprises an injector valve, disposed between the process material source and the deposition chamber. The injector valve controls the flow of precursor material by repeatedly opening and closing the injector valve with a predetermined duty cycle. The apparatus further comprises an evaporator coupled to the injector valve for evaporating the precursor.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: January 23, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Keith K. Koai, Tung-Ching Tseng, James J. Chen, Mark S. Johnson, John Schmitt, Sean Li