Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-gold-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract: A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.

Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.

Abstract: A conductor removal process is described, which is applied to a substrate that has thereon a plurality of patterns and a blanket conductor layer covering the patterns. An upper portion of the blanket conductor layer entirely over the patterns is oxidized to form a dielectric layer. A CMP step is performed to remove the dielectric layer and a portion of the remaining conductor layer in turn and thereby expose the patterns.

Abstract: A conductor removal process is described, which is applied to a substrate that has thereon a plurality of patterns and a blanket conductor layer covering the patterns. An upper portion of the blanket conductor layer entirely over the patterns is oxidized to form a dielectric layer. A CMP step is performed to remove the dielectric layer and a portion of the remaining conductor layer in turn and thereby expose the patterns.

Abstract: A heat sink and heat spreader bonding structure includes a metal heat sink, a metal heat spreader, and an eutectic structure formed between the heat sink and the heat spreader by heating the heat sink and the heat spreader to a specific temperature of the eutectic temperature of the heat sink and the heat spreader but below the respective melting point of the heat sink and the heat spreader to cause the internal metal atoms of the heat sink and heat spreader to be rearranged. This bonding structure maintains the heat transfer efficiency of the bonding layer between the heat sink and the heat spreader, eliminates formation of crevice, heat resistance, and oxidation in the bonding layer.

Abstract: The present invention provides a novel process for making a radially arranged aluminum foil-filled plastic pellet for shielding against electromagnetic interference, comprising sandwiching a plastic matrix in between two layers of aluminum foil to form an aluminum/plastic/aluminum laminated sheet; slicing the laminated sheet into a plurality of aluminum/plastic/aluminum laminated strips; dividing the plurality of laminated strips into at least one group, each group containing 3 to 20 radially arranged strips; moisturizing and binding at least one group of laminated strips with a molten plastic matrix to form at least one radially arranged aluminum foil-filled plastic bar; and cutting at least one plastic bar into radially arranged aluminum foil-filled plastic pellets. By the present invention, the cost of making the conductive plastic pellets can be decreased, the amount of aluminum foil in the pellet can be greatly increased, and the breakage of the aluminum foil in the die can be prevented.

Abstract: The present invention provides a process and apparatus for manufacturing an electromagnetic interference shielding metallic foil cladded plastic product.

Abstract: The present invention provides a process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic outer shell product. A first side of a superplastic alloy foil is coated with an adhesive and then the foil is placed foil in a first half mold to allow the foil to be initially superplastically formed. A second half mold attached to a nozzle of an injection machine is covered onto the first half mold, and the two half molds are closed to further deform superplastic alloy foil. Softened plastic is introduced from the injection machine to a mold cavity between the foil and the second half mold, such that the superplastic alloy foil covered on the first half mold is completely formed and the softened plastic adheres on the adhesive-coated side of the superplastic alloy foil to form an electromagnetic interference shielding metallic foil cladded plastic outer shell product.

Abstract: The present invention provides a superplastic alloy-containing conductive plastic article for shielding electromagnetic interference. The conductive plastic article is a three-layer structure, in which the outer layers are plastic material, and the inner layer is a superplastic alloy. The requirements for the raw materials are that the melting point of the superplastic alloy is higher than the softening point of the plastic, and the superplastic alloy has superplasticity at a temperature higher than the softening point of the plastic. The conductive plastic article can be manufactured in one processing stage, has the same shielding effectiveness as that of a conventional metal plate article, and can take a delicate and complicated form as that of a conventional plastic article. Moreover, the superplastic alloy contained therein has a uniform thickness and good adherence to plastic.

Abstract: The present invention provides novel kind of aluminum laminally filled plastic pellets and a process and apparatus for manufacturing the plastic pellets. The process includes coating the upper and lower surfaces of each of the substantially parallel lined aluminum foil layers with a coupling agent; drying the aluminum foil layers; introducing a molten plastic matrix to the space between each two aluminum foil layers and the outer surfaces of the most outside two aluminum foil layers to moisturize and bind the aluminum foil layers; reducing the thickness of the aluminum foil layers to form a continuous laminally filled plastic composite plate; and cooling and cutting the composite plate into aluminum laminally filled plastic pellets of a predetermined size.

Abstract: A process for making metallized plastic molding pellets comprising: first metallizing a laminated plastic sheet by sandwiching an electrically conductive metal foil in between two plastic films; secondly slicing the metallized laminated plastic sheet into a plurality of metallized plastic strips; thirdly wetting and binding the metallized plastic strips, which are radially arranged, with a thermoplastic resin matrix to form a metallized plastic bar by pultrusion processing; and finally cutting the pultruded metallized bar to obtain homogeneously metallized plastic pellets for making effective EMI shields.

Abstract: A high gas pressure material capable of producing 50-300 psi gas pressure at forming temperature is placed in an enclosed area surrounding and sealing the blanks to be superplastically formed, without the use of argon gas. The blanks are formed under tensile stress by the internal pressure produced by the high gas pressure material. The method can be performed concurrently with diffusion bonding to obtain a metallic structure from a plurality of workpieces, and also can be used to manufacture perfectly spherical hollow bodies by a dieless method.