Abstract: A device includes a semiconductor substrate, an active region over the semiconductor substrate extending lengthwise in a first direction, a gate structure over the active region extending lengthwise in a second direction perpendicular to the first direction, a source feature and a drain feature on the active region and interposed by the gate structure, a source contact on the source feature, a drain contact on the drain feature, and a via rail over the substrate spaced from the active region. The via rail includes a main portion extending lengthwise in the first direction having a sidewall surface facing opposite the end surface of the drain contact, and a jog via extending from the main portion along the second direction and having a sidewall surface facing the second direction, each of the main portion and the jog via contacting the source contact.

Abstract: An IC includes a first standard cell (SC1) having a first circuit area (CA1) and a first transition area (TA1) placed on an edge of the CA1; and a SC2 having a CA2 and a TA2 placed on an edge of CA2?. CA1 includes a first and a second active region (AR1 and AR2) longitudinally oriented along a first direction (D1), and a first gate stack (G1) along a D2?D1 and extending over AR1 and AR2. G1 includes a first gate segment (GS1) contacting AR1 and a GS2 contacting AR2. GS1 and GS2 are different in composition. GS1 and GS2 are associated with a pFET and a nFET, respectively. TA1 includes a G2 longitudinally oriented along D2 and spans between opposite cell edges of the SC1. G2 is a lengthwise uniform gate stack. SC2 is placed in abutment with the SC1 such that TA1 and TA2 share a common edge.

Abstract: A semiconductor structure includes a substrate having a first well of a first conductivity type and a second well of a second conductivity type. From a top view, the first well includes first and seconds edges extending along a first direction. The second edge has multiple turns, resulting in the first well having a protruding section and a recessed section. The semiconductor structure further includes a first source/drain feature over the protruding section and a second source/drain feature over a main body of the first well. The first source/drain feature is of the first conductivity type. The second source/drain feature is of the second conductivity type. The first and the second source/drain features are generally aligned along a second direction perpendicular to the first direction from the top view.

Abstract: A method includes forming a fin structure over a substrate, forming a first source/drain feature and a second source/drain feature over the fin structure, forming a dielectric material over the first source/drain feature and the second source/drain feature, patterning the dielectric layer into insulating features, and forming a first contact plug on the first source/drain feature and a second contact plug on the second source/drain feature. The insulating features include a first insulating feature and a second insulating feature on opposite sides of the first source/drain feature, and a third insulating feature and a fourth insulating feature on opposite sides of the second source/drain feature. The first insulating feature is longer than the third insulating feature. The distance between the first and second insulating features is greater than the distance between the third and fourth insulating features.

Abstract: Electrostatic discharge (ESD) structures are provided. An ESD structure includes a semiconductor substrate, a first epitaxy region with a first type of conductivity over the semiconductor substrate, a second epitaxy region with a second type of conductivity over the semiconductor substrate, and a plurality of semiconductor layers. The semiconductor layers are stacked over the semiconductor substrate and between the first and second epitaxy regions. A first conductive feature is formed over the first epitaxy region and outside an oxide diffusion region. A second conductive feature is formed over the second epitaxy region and outside the oxide diffusion region. A third conductive feature is formed over the first epitaxy region and within the oxide diffusion region. A fourth conductive feature is formed over the second epitaxy region and within the oxide diffusion region. The oxide diffusion region is disposed between the first and second conductive features.

Abstract: An array of poly lines on an active device area of an integrated chip is extended to form a dummy device structure on an adjacent isolation region. The resulting dummy device structure is an array of poly lines having the same line width, line spacing, and pitch as the array of poly lines on the active device area. The poly lines of the dummy device structure are on grid with the poly lines on the active device area. Because the dummy device structure is formed of poly lines that are on grid with the poly lines on the active device area, the dummy device structure may be much closer to the active device area than would otherwise be possible. The resulting proximity of the dummy device structure to the active device area improves anti-dishing performance and reduces empty space on the integrated chip.

Abstract: A device includes a semiconductor substrate, an active region over the semiconductor substrate extending lengthwise in a first direction, a gate structure over the active region extending lengthwise in a second direction perpendicular to the first direction, a source feature and a drain feature on the active region and interposed by the gate structure, a source contact on the source feature, a drain contact on the drain feature, and a via rail over the substrate spaced from the active region. The via rail includes a main portion extending lengthwise in the first direction having a sidewall surface facing opposite the end surface of the drain contact, and a jog via extending from the main portion along the second direction and having a sidewall surface facing the second direction, each of the main portion and the jog via contacting the source contact.

Abstract: A semiconductor device includes a substrate. A first nanosheet structure and a second nanosheet structure are disposed on the substrate. Each of the first and second nanosheet structures have at least one nanosheet forming source/drain regions and a gate structure including a conductive gate contact. A first oxide structure is disposed on the substrate between the first and second nanosheet structures. A conductive terminal is disposed in or on the first oxide structure. The conductive terminal, the first oxide structure and the gate structure of the first nanosheet structure define a capacitor.

Abstract: An integrated circuit (IC) layout design is received that includes a first circuit cell and a second circuit cell abutted to one another. The first circuit cell contains a first IC component, and the second circuit cell contains a second IC component. A determination is made that a distance between the first IC component and the second IC component is less than a predefined threshold when the first circuit cell and the second circuit cell are abutted together. The IC layout design is revised such that the distance between the first IC component and the second IC component is eliminated in the revised IC layout design.

Abstract: A method that includes receiving an integrated circuit (IC) design layout including a layout block, where the layout block has a corner, adding first patterns along a first edge of the corner, adding second patterns along a second edge of the corner, moving a first column of the first patterns closest to the second edge horizontally toward the second edge, moving a second column of second patterns closest to the second edge horizontally toward the second edge, extending lengths of the first and second patterns in the first and second columns, and outputting a pattern layout in a computer-readable format, where the pattern layout includes the first patterns and the second patterns.

Abstract: An analog standard cell is provided. An analog standard cell according to the present disclosure includes a first active region and a second active region extending along a first direction, and a plurality of conductive lines in a first metal layer over the first active region and the second active region. The plurality of conductive lines includes a first conductive line and a second conductive line disposed directly over the first active region, a third conductive line and a fourth conductive line disposed directly over the second active region, a middle conductive line disposed between the second conductive line and the third conductive line, a first power line spaced apart from the middle conductive line by the first conductive line and the second conductive line, and a second power line spaced apart from the middle conductive line by the third conductive line and the fourth conductive line.

Abstract: In an embodiment, a method includes: forming a first fin extending from a substrate; forming a second fin extending from the substrate, the second fin being spaced apart from the first fin by a first distance; forming a metal gate stack over the first fin and the second fin; depositing a first inter-layer dielectric over the metal gate stack; and forming a gate contact extending through the first inter-layer dielectric to physically contact the metal gate stack, the gate contact being laterally disposed between the first fin and the second fin, the gate contact being spaced apart from the first fin by a second distance, where the second distance is less than a second predetermined threshold when the first distance is greater than or equal to a first predetermined threshold.

Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a fin of semiconductor material protruding outward from an upper surface of a substrate. A doped region is arranged within the fin of semiconductor material and laterally between a first region and a second region of the fin of semiconductor material. A first gate structure is over the first region of the fin of semiconductor material, a second gate structure is over the second region of the fin of semiconductor material, and a third gate structure is over the doped region. Source/drain regions are between the first gate structure, the second gate structure, and the third gate structure.

Abstract: A method includes receiving an integrated circuit (IC) design layout including a layout block, where the layout block including first line patterns disposed along a first direction, extending lengths of the first line patterns, connecting portions of the first line patterns disposed within a distance less than a preset value, forming second line patterns disposed outside the layout block parallel to the first line patterns, forming mandrel bar patterns overlapping edges of the layout block, where the mandrel bar patterns oriented along a second direction perpendicular to the first direction, and outputting a pattern layout for mask fabricating, where the pattern layout includes the layout block, the first and second line patterns, and the mandrel bar patterns.

Abstract: A fuse structure includes first and second transistors where each of the first and the second transistors has a source terminal, a drain terminal, and a gate terminal; a first source/drain contact disposed on the source terminal of the first transistor; a second source/drain contact disposed on the drain terminal of the second transistor; an insulator disposed laterally between the first and the second source/drain contacts; a source/drain contact via disposed on the first source/drain contact; and a program line connected to the source/drain contact via, wherein a width of the insulator is configured such that a programming potential applied across the source/drain contact via and the drain terminal of the second transistor causes the insulator to break down.

Abstract: The present disclosure provides a method for fabricating an integrated circuit (IC). The method includes receiving an IC layout having a first pattern layer that includes first source/drain (S/D) contacts and second S/D contacts, the first and second S/D contacts are spaced away from each other by a spacing along a first direction, and each of the first and second S/D contacts have elongated shapes extending lengthwise in a second direction perpendicular to the first direction. The method includes constructing a conductive feature on a second pattern layer of the IC layout, the conductive feature having an initial rectangular shape with a length and a width, the length extending along the first direction. And the method includes modifying the conductive feature to form a modified conductive feature that is overlapped with the first S/D contacts and distanced away from the second S/D contacts.

Abstract: A semiconductor device includes a substrate. A first nanosheet structure and a second nanosheet structure are disposed on the substrate. Each of the first and second nanosheet structures have at least one nanosheet forming source/drain regions and a gate structure including a conductive gate contact. A first oxide structure is disposed on the substrate between the first and second nanosheet structures. A conductive terminal is disposed in or on the first oxide structure. The conductive terminal, the first oxide structure and the gate structure of the first nanosheet structure define a capacitor.

Abstract: In some embodiments, the present disclosure relates to a method that includes removing portions of a substrate to form a continuous fin protruding from an upper surface of the substrate. A doping process is performed to selectively increase a dopant concentration of a first portion of the continuous fin. A first gate electrode is formed over a second portion of the continuous fin, and a second gate electrode is formed over a third portion of the continuous fin. The first portion of the continuous fin is between the second and third portions of the continuous fin. A dummy gate electrode is formed over the first portion of the continuous fin. Upper portions of the continuous fin that are arranged between the first gate electrode, the second gate electrode, and the dummy gate electrode are removed, and source/drain regions are formed between the first, the second, and the dummy gate electrodes.

Abstract: An analog standard cell is provided. An analog standard cell according to the present disclosure includes a first active region and a second active region extending along a first direction, and a plurality of conductive lines in a first metal layer over the first active region and the second active region. The plurality of conductive lines includes a first conductive line and a second conductive line disposed directly over the first active region, a third conductive line and a fourth conductive line disposed directly over the second active region, a middle conductive line disposed between the second conductive line and the third conductive line, a first power line spaced apart from the middle conductive line by the first conductive line and the second conductive line, and a second power line spaced apart from the middle conductive line by the third conductive line and the fourth conductive line.

Abstract: A method that includes receiving an integrated circuit (IC) design layout including a layout block, where the layout block has a corner, adding first patterns along a first edge of the corner, adding second patterns along a second edge of the corner, moving a first column of the first patterns closest to the second edge horizontally toward the second edge, moving a second column of second patterns closest to the second edge horizontally toward the second edge, extending lengths of the first and second patterns in the first and second columns, and outputting a pattern layout in a computer-readable format, where the pattern layout includes the first patterns and the second patterns.