Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.

Abstract: A light emitting diode apparatus comprises a substrate having a circuit pattern, a reflection layer disposed on the substrate, at least one light emitting element disposed on the reflection layer, a reflector disposed around the at least one light emitting element, a sealing material formed over the at least one light emitting element and a phosphor layer disposed over the sealing material. The light emitting element comprises a conductive portion electrically coupled to the circuit pattern. In one embodiment, a plurality of light emitting elements are linearly arrayed, and a spacer is disposed between every two adjacent light emitting elements.

Abstract: A backlight module having replaceable lamp module is provided. The backlight module includes a replaceable lamp module, a light-guiding plate, a frame and a positioning and protecting mechanism. The light-guiding plate is disposed over the bottom surface among four sides of the frame, wherein one side of the light-guiding plate and a corresponding side of the frame form a sliding groove. The replaceable lamp module is set in the sliding groove and slidably along the sliding groove. The positioning and protecting mechanism comprises a protecting device set on the replaceable lamp module and a positioning device set on the frame. The protecting device is capable of forming a gap between the replaceable lamp module and the bottom of the sliding groove in order to protect the replaceable lamp module from scraped by the structures of the backlight module while the replaceable lamp module is inserting into the sliding groove.

Abstract: A lamp module for use in a liquid crystal display includes a lamp tube, a reflector, a dismantling mechanism disposed on the reflector. The reflector comprises a first side, a second side, and a third side forming a sink, for accommodating the lamp tube and reflecting light from the lamp tube. The dismantling mechanism disposed on the reflector and outside a bezel of the liquid crystal display when the lamp module is assembled to the liquid crystal display. The lamp module is capable of being disassembled from the bezel of the liquid crystal display by applying a force on the dismantling mechanism.

Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.

Abstract: A backlight module having replaceable lamp module is provided. The backlight module includes a replaceable lamp module, a light-guiding plate, a frame and a positioning and protecting mechanism. The light-guiding plate is disposed over the bottom surface among four sides of the frame, wherein one side of the light-guiding plate and a corresponding side of the frame form a sliding groove. The replaceable lamp module is set in the sliding groove and slidably along the sliding groove. The positioning and protecting mechanism comprises a protecting device set on the replaceable lamp module and a positioning device set on the frame. The protecting device is capable of forming a gap between the replaceable lamp module and the bottom of the sliding groove in order to protect the replaceable lamp module from scraped by the structures of the backlight module while the replaceable lamp module is inserting into the sliding groove.

Abstract: A lamp module for use in a liquid crystal display includes a lamp tube, a reflector, a dismantling mechanism disposed on the reflector. The reflector comprises a first side, a second side, and a third side forming a sink, for accommodating the lamp tube and reflecting light from the lamp tube. The dismantling mechanism disposed on the reflector and outside a bezel of the liquid crystal display when the lamp module is assembled to the liquid crystal display. The lamp module is capable of being disassembled from the bezel of the liquid crystal display by applying a force on the dismantling mechanism.

Abstract: A method of forming a bump on a wafer is provided. A thick photoresist having a plurality of openings is formed on the wafer to expose the bonding pads. A solder paste is filled in the openings of the thick photoresist. A stencil that has a plurality of openings corresponding to those of the photoresist is applied over the wafer. After the stencil is removed, a reflow process is carried out to form bumps. The thick photoresist is then removed. The bumps are formed in two steps using a thick photoresist and a stencil, resulting in an increased height and uniformity after reflow.

Abstract: A wafer-level packaging process. A wafer having a plurality of bonding pads thereon exposed through a passivation layer formed on the wafer is provided, and an under bump metal (UBM) is formed on each bonding pad. A stress buffer layer is formed through which are formed a plurality of first openings that expose the under bump metals (UBM). Solder material is filled in the first openings of the stress buffer layer. Either a stencil or a patterned photoresist having a plurality of second openings is arranged on the stress buffer layer such that the second openings expose the first openings. A solder material is filled in the second openings. The solder material is reflowed, wherein if the stencil is used, it is removed before the reflow process while if the patterned photoresist is used, it is removed after the reflow process.