Patents by Inventor Tung Lok Li
Tung Lok Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9806006Abstract: Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages which utilize carriers in strip format, wherein the leads (or terminals) are formed to be electrically isolated from one another within each unit and in which the units are formed to be electrically isolated from one another within the strip using chemical etching techniques.Type: GrantFiled: September 20, 2007Date of Patent: October 31, 2017Assignee: UTAC HEADQUARTERS PTD. LTD.Inventors: Tung Lok Li, Kin Pui Kwan
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Patent number: 9337095Abstract: A method of manufacturing a leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.Type: GrantFiled: June 27, 2013Date of Patent: May 10, 2016Assignee: Kaixin, Inc.Inventor: Tung Lok Li
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Publication number: 20130288432Abstract: A method of manufacturing a leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.Type: ApplicationFiled: June 27, 2013Publication date: October 31, 2013Applicant: Kaixin, Inc.Inventor: Tung Lok Li
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Patent number: 8569110Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.Type: GrantFiled: May 20, 2011Date of Patent: October 29, 2013Assignee: QPL LimitedInventors: John Robert McMillan, Xiao Yun Chen, Tung Lok Li
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Patent number: 8513786Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.Type: GrantFiled: May 20, 2011Date of Patent: August 20, 2013Assignee: QPL LimitedInventors: John Robert McMillan, Xiao Yun Chen, Tung Lok Li
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Patent number: 8497159Abstract: A method of manufacturing a leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.Type: GrantFiled: November 2, 2011Date of Patent: July 30, 2013Assignee: Kaixin, Inc.Inventor: Tung Lok Li
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Patent number: 8338924Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.Type: GrantFiled: October 6, 2011Date of Patent: December 25, 2012Assignee: QPL LimitedInventors: John Robert McMillan, Xiao Yun Chen, Tung Lok Li
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Publication number: 20120146200Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.Type: ApplicationFiled: May 20, 2011Publication date: June 14, 2012Inventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
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Publication number: 20120146199Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.Type: ApplicationFiled: October 6, 2011Publication date: June 14, 2012Applicant: QPL LIMITEDInventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
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Publication number: 20120149154Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.Type: ApplicationFiled: May 20, 2011Publication date: June 14, 2012Inventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
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Patent number: 8124462Abstract: A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.Type: GrantFiled: May 23, 2011Date of Patent: February 28, 2012Assignee: Blondwich LimitedInventor: Tung Lok Li
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Publication number: 20120045870Abstract: A method of manufacturing a leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.Type: ApplicationFiled: November 2, 2011Publication date: February 23, 2012Inventor: Tung Lok Li
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Patent number: 8072053Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.Type: GrantFiled: June 5, 2009Date of Patent: December 6, 2011Assignee: Kaixin Inc.Inventor: Tung Lok Li
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Publication number: 20110284495Abstract: Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages which utilize carriers in strip format, wherein the leads (or terminals) are formed to be electrically isolated from one another within each unit and in which the units are formed to be electrically isolated from one another within the strip using chemical etching techniques.Type: ApplicationFiled: September 20, 2007Publication date: November 24, 2011Applicant: ASAT LIMITEDInventors: Tung Lok Li, Kwok Cheung Tsang, Kin Pui Kwan
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Publication number: 20110219611Abstract: A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.Type: ApplicationFiled: May 23, 2011Publication date: September 15, 2011Applicant: BLONDWICH LIMITEDInventor: Tung Lok LI
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Patent number: 7973394Abstract: A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.Type: GrantFiled: July 29, 2009Date of Patent: July 5, 2011Assignee: Blondwich LimitedInventor: Tung Lok Li
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Publication number: 20110092027Abstract: In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a portion of the IC chip and a portion of the heatspreader such that a top portion of the heatspreader is exposed to the surroundings of the IC package. In another embodiment, the heatspreader comprises at least one castellation to improve adhesion to the encapsulation compound. A method of manufacturing such IC package is also disclosed.Type: ApplicationFiled: December 21, 2010Publication date: April 21, 2011Applicant: GREEN ARROW ASIA LIMITEDInventor: Tung Lok LI
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Patent number: 7875970Abstract: In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a portion of the IC chip and a portion of the heatspreader such that a top portion of the heatspreader is exposed to the surroundings of the IC package. In another embodiment, the heatspreader comprises at least one castellation to improve adhesion to the encapsulation compound. A method of manufacturing such IC package is also disclosed.Type: GrantFiled: July 29, 2009Date of Patent: January 25, 2011Assignee: Green Arrow Asia LimitedInventor: Tung Lok Li
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Publication number: 20100314728Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The leadframe having a spiral inductor etched therein.Type: ApplicationFiled: June 16, 2010Publication date: December 16, 2010Inventor: Tung Lok Li
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Publication number: 20100314732Abstract: A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.Type: ApplicationFiled: July 29, 2009Publication date: December 16, 2010Applicant: Blondwich LimitedInventor: Tung Lok LI