Patents by Inventor Twan van Lippen

Twan van Lippen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11293821
    Abstract: In an embodiment, a pressure sensor module includes a base electrode surrounding at least a part of a bottom electrode, an anchor arrangement on top of the base electrode including at least two electrically conductive walls that both surround at least the part of the bottom electrode and an electrically conductive layer that covers at least the bottom electrode and the anchor arrangement such that a cavity is formed between the bottom electrode, the anchor arrangement and the electrically conductive layer, wherein, on at least one side of the cavity, a proportionate area of the electrically conductive walls in a cross section extending from a surface of an inner wall of the anchor arrangement facing the cavity to a surface of an outermost wall of the anchor arrangement facing away from the cavity in a plane parallel to a plane of the bottom electrode is equal to or less than 10%.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: April 5, 2022
    Assignee: SCIOSENSE B.V.
    Inventors: Roel Daamen, Kailash Vijayakumar, Hendrik Bouman, Remco Henricus Wilhelmus Pijnenburg, Twan Van Lippen
  • Publication number: 20210055177
    Abstract: A pressure sensor module comprises a base electrode surrounding at least a part of a bottom electrode, and an anchor arrangement on top of the base electrode comprising at least two electrically conductive walls that both surround at least a part of the bottom electrode. The pressure sensor module further comprises an electrically conductive layer that covers at least the bottom electrode and the anchor arrangement such that a cavity is formed between the bottom electrode, the anchor arrangement and the electrically conductive layer. The proportionate area of the electrically conductive walls in a cross section extending from the surface of the inner wall of the anchor arrangement facing the cavity to the surface of the outermost wall of the anchor arrangement facing away from the cavity in a plane parallel to the plane of the bottom electrode is equal to or less than 10%.
    Type: Application
    Filed: July 19, 2017
    Publication date: February 25, 2021
    Inventors: Roel DAAMEN, Kailash VIJAYAKUMAR, Hendrik BOUMAN, Remco Henricus Wilhelmus PIJNENBURG, Twan VAN LIPPEN
  • Patent number: 9344805
    Abstract: A capacitive micro-electromechanical system (MEMS) microphone includes a semiconductor substrate having an opening that extends through the substrate. The microphone has a membrane that extends across the opening and a back-plate that extends across the opening. The membrane is configured to generate a signal in response to sound. The back-plate is separated from the membrane by an insulator and the back-plate exhibits a spring constant. The microphone further includes a back-chamber that encloses the opening to form a pressure chamber with the membrane, and a tuning structure configured to set a resonance frequency of the back-plate to a value that is substantially the same as a value of a resonance frequency of the membrane.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: May 17, 2016
    Assignee: NXP B.V.
    Inventors: Franz Felberer, Remco Henricus Wilhelmus Pijnenburg, Twan van Lippen, Iris Bominaar-Silkens
  • Patent number: 9307319
    Abstract: A read out circuit for a sensor uses a feedback loop to bias the sensor to a desired operating point, such as the maximal possible sensitivity, but without the problem of an instable sensor position as known for the conventional read-out with constant charge. The reference bias to which the circuit is controlled is also varied using feedback control, but with a slower response than the main bias control feedback loop.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: April 5, 2016
    Assignee: NXP, B.V.
    Inventors: Klaus Reimann, Twan van Lippen, Remco Henricus Wilhelmus Pijnenburg, Iris Bominaar-Silkens, Robert Hendrikus Margaretha van Veldhoven
  • Patent number: 9070524
    Abstract: The present invention provides a capacitive MEMS device comprising a first electrode lying in a plane, and a second electrode suspended above the first electrode and movable with respect to the first electrode. The first electrode functions as an actuation electrode. A gap is present between the first electrode and the second electrode. A third electrode is placed intermediate the first and second electrode with the gap between the third electrode and the second electrode. The third electrode has one or a plurality of holes therein, preferably in an orderly or irregular array. An aspect of the present invention integration of a conductive, e.g. metallic grating as a middle (or third) electrode. An advantage of the present invention is that it can reduce at least one problem of the prior art. This advantage allows an independent control over the pull-in and release voltage of a switch.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: June 30, 2015
    Assignee: NXP, B.V.
    Inventors: Peter Gerard Steeneken, Hilco Suy, Rodolf Herfst, Twan Van Lippen
  • Patent number: 8913766
    Abstract: A MEMS device, such as a microphone, uses a fixed perforated plate. The fixed plate comprises an array of holes across the plate area. At least a set of the holes adjacent the outer periphery comprises a plurality of rows of elongate holes, the rows at different distances from the periphery. This design improves the mechanical robustness of the membrane and can additionally allow tuning of the mechanical behavior of the plate.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: December 16, 2014
    Assignee: NXP, B.V.
    Inventors: Iris Bominaar-Silkens, Andres Felipe Vasquez Quintero, Klaus Reimann, Twan Van Lippen, Remco Henricus Wilhelmus Pijnenburg
  • Patent number: 8901682
    Abstract: A MEMS device, such as a microphone, uses a perforated plate. The plate comprises an array of holes across the plate area. The plate has an area formed as a grid of polygonal cells, wherein each cell comprises a line of material following a path around the polygon thereby defining an opening in the center. In one aspect, the line of material forms a path along each side of the polygon which forms a track which extends at least once inwardly from the polygon perimeter towards the center of the polygon and back outwardly to the polygon perimeter. This defines a meandering hexagon side wall, which functions as a local spring suspension.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: December 2, 2014
    Assignee: NXP, B.V.
    Inventors: Klaus Reimann, Iris Bominaar-Silkens, Twan Van Lippen, Remco Henricus Wilhelmus Pijnenburg
  • Patent number: 8855337
    Abstract: The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2, the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6, covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7, covering the second layer 7 with a third layer 8, forming a plurality of trenches 9 in the third layer 8, removing a part 10 of the wafer 1 below a back side of the microphone layer 5, forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6, and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8. The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Twan van Lippen, Geert Langereis, Martijn Goossens
  • Patent number: 8822254
    Abstract: A MEMS manufacturing method and device in which a spacer layer is provided over a side wall of at least one opening in a structural layer which will define the movable MEMS element. The opening extends below the structural layer. The spacer layer forms a side wall portion over the side wall of the at least one opening and also extends below the level of the structural layer to form a contact area.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: September 2, 2014
    Assignee: NXP, B.V.
    Inventors: Jozef Thomas Martinus Van Beek, Klaus Reimann, Remco Henricus Wilhelmus Pijnenburg, Twan Van Lippen
  • Patent number: 8742517
    Abstract: A capacitive sensor is configured for collapsed mode, e.g. for measuring sound or pressure, wherein the moveable element is partitioned into smaller sections. The capacitive sensor provides increased signal to noise ratio.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 3, 2014
    Assignee: NXP, B.V.
    Inventors: Geert Langereis, Twan Van Lippen, Reinout Woltjer
  • Patent number: 8686519
    Abstract: A MEMS accelerometer uses capacitive sensing between two electrode layers. One of the electrode layers has at least four independent electrodes arranged as two pairs of electrodes, with one pair aligned orthogonally to the other such that tilting of the membrane can be detected as well as normal-direction movement of the membrane. In this way, a three axis accelerometer can be formed from a single suspended mass, and by sensing using a set of capacitor electrodes which are all in the same plane. This means the fabrication is simple and is compatible with other MEMS manufacturing processes, such as MEMS microphones.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: April 1, 2014
    Inventors: Geert Langereis, Iris Bominaar-Silkens, Twan Van Lippen
  • Patent number: 8588435
    Abstract: A microphone and a method for manufacturing the same. The microphones includes a substrate die; and a microphone and an accelerometer formed from the substrate die. The accelerometer is adapted to provide a signal for compensating mechanical vibrations of the substrate die.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: November 19, 2013
    Assignee: NXP B.V.
    Inventors: Iris Bominaar-Silkens, Sima Tarashioon, Remco Henricus Wilhelmus Pijnenburg, Twan van Lippen, Geert Langereis
  • Publication number: 20130285173
    Abstract: A MEMS device, such as a microphone, uses a perforated plate. The plate comprises an array of holes across the plate area. The plate has an area formed as a grid of polygonal cells, wherein each cell comprises a line of material following a path around the polygon thereby defining an opening in the centre. In one aspect, the line of material forms a path along each side of the polygon which forms a track which extends at least once inwardly from the polygon perimeter towards the centre of the polygon and back outwardly to the polygon perimeter. This defines a meandering hexagon side wall, which functions as a local spring suspension.
    Type: Application
    Filed: April 12, 2013
    Publication date: October 31, 2013
    Applicant: NXP B.V.
    Inventors: Klaus REIMANN, Iris BOMINAAR-SILKENS, Twan VAN LIPPEN, Remco Henricus Wilhelmus PIJNENBURG
  • Publication number: 20130279717
    Abstract: A read out circuit for a sensor uses a feedback loop to bias the sensor to a desired operating point, such as the maximal possible sensitivity, but without the problem of an instable sensor position as known for the conventional read-out with constant charge. The reference bias to which the circuit is controlled is also varied using feedback control, but with a slower response than the main bias control feedback loop.
    Type: Application
    Filed: April 10, 2013
    Publication date: October 24, 2013
    Applicant: NXP B.V.
    Inventors: Klaus REIMANN, Twan VAN LIPPEN, Remco Henricus Wilhelmus PIJNENBURG, Iris BOMINAAR-SILKENS, Robert Hendrikus Margaretha VAN VELDHOVEN
  • Patent number: 8401513
    Abstract: Proximity sensor, particularly for usage in an electronic mobile device, comprising at least one acoustic transducer adapted for receiving acoustic signals at least in parts of the frequency range of human audible sound and emitting and/or receiving ultrasonic signals for proximity estimation. The acoustic transducer preferably is a Micro-Electro-Mechanical-Systems (MEMS) microphone. Further, a method in an electronic device comprising an acoustic transducer is provided comprising the steps of generating at least one electric signal in the frequency range of ultrasonic sound, emitting at least one ultrasonic signal by means of the acoustic transducer; receiving at least one ultrasonic signal by means of the acoustic transducer; deducing from the at least one emitted ultrasonic signal and the at least one received ultrasonic signal at least the delay between emission of the emitted ultrasonic signal and reception of the corresponding ultrasonic signal.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: March 19, 2013
    Assignee: NXP B.V.
    Inventors: Geert Langereis, Twan van Lippen, Peter Dirksen, Frank Pasveer
  • Publication number: 20130056840
    Abstract: A MEMS device, such as a microphone, uses a fixed perforated plate. The fixed plate comprises an array of holes across the plate area. At least a set of the holes adjacent the outer periphery comprises a plurality of rows of elongate holes, the rows at different distances from the periphery. This design improves the mechanical robustness of the membrane and can additionally allow tuning of the mechanical behaviour of the plate.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 7, 2013
    Applicant: NXP B.V.
    Inventors: Iris BOMINAAR-SILKENS, Andres Felipe VASQUEZ QUINTERO, Klaus REIMANN, Twan VAN LIPPEN, Remco Henricus Wilhelmus PIJNENBURG
  • Publication number: 20120299130
    Abstract: A MEMS accelerometer uses capacitive sensing between two electrode layers. One of the electrode layers has at least four independent electrodes arranged as two pairs of electrodes, with one pair aligned orthogonally to the other such that tilting of the membrane can be detected as well as normal-direction movement of the membrane. In this way, a three axis accelerometer can be formed from a single suspended mass, and by sensing using a set of capacitor electrodes which are all in the same plane. This means the fabrication is simple and is compatible with other MEMS manufacturing processes, such as MEMS microphones.
    Type: Application
    Filed: January 25, 2011
    Publication date: November 29, 2012
    Applicant: NXP B.V.
    Inventors: Geert Langereis, Iris Bominaar-Silkens, Twan Van Lippen
  • Publication number: 20120139065
    Abstract: A MEMS manufacturing method and device in which a spacer layer is provided over a side wall of at least one opening in a structural layer which will define the movable MEMS element. The opening extends below the structural layer. The spacer layer forms a side wall portion over the side wall of the at least one opening and also extends below the level of the structural layer to form a contact area.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 7, 2012
    Applicant: NXP B.V.
    Inventors: Jozef Thomas Martinus van Beek, Klaus Reimann, Remco Henricus Wilhelmus Pijnenburg, Twan Van Lippen
  • Publication number: 20120133005
    Abstract: A capacitive sensor is configured for collapsed mode, e.g. for measuring sound or pressure, wherein the moveable element is partitioned into smaller sections. The capacitive sensor provides increased signal to noise ratio.
    Type: Application
    Filed: June 30, 2010
    Publication date: May 31, 2012
    Applicant: NXP B.V.
    Inventors: Geert Langeries, Twan Van Lippen, Reinout Woltjer
  • Publication number: 20120099753
    Abstract: A microphone has a membrane (20) mounted to vibrate in response to pressure fluctuations, a backplate (30) facing the membrane and being more rigid than the membrane, and circuitry (95) for sensing the vibrations relative to the backplate, the backplate being prestressed and having a geometry such that a response of the backplate to structure borne vibration matches a corresponding response of the membrane. This can help reduce or minimize relative movement between these surfaces caused by structure borne vibration and hence improve the signal-to-noise ratio of the microphone. The geometry can be a hub and spoke arrangement.
    Type: Application
    Filed: April 6, 2010
    Publication date: April 26, 2012
    Applicant: KNOWLES ELECTRONICS ASIA PTE. LTD.
    Inventors: Casper van der Avoort, Andreas Bernardus Maria Jansman, Geert Langereis, Twan van Lippen, Hilco Suy