Patents by Inventor Tyler Pearson
Tyler Pearson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960548Abstract: Systems, methods, and other techniques for genealogical entity resolution. The systems obtain first tree data and second tree data, the first tree data corresponding to a first tree person and the second tree data corresponding to a second tree person. The systems extract a set of features from the first tree data and the second tree data. The systems further generate an individual-level similarity score for each possible pairing of tree persons based on the set of features to identify a set of most-similar tree persons based on the individual-level similarity score for each possible pairing. The systems also provide a plurality of individual-level similarity scores for the set of most-similar tree persons as input to a family-level ML model to determine that the first tree person and the second tree person correspond to a same individual.Type: GrantFiled: July 22, 2019Date of Patent: April 16, 2024Assignee: Ancestry.com Operations Inc.Inventors: Tyler Folkman, Rey Furner, Drew Pearson
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Publication number: 20240105698Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: December 7, 2023Publication date: March 28, 2024Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 11881475Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: June 22, 2022Date of Patent: January 23, 2024Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 11527691Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.Type: GrantFiled: July 9, 2021Date of Patent: December 13, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson
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Patent number: 11488943Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: September 23, 2020Date of Patent: November 1, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20220320061Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: June 22, 2022Publication date: October 6, 2022Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20210336114Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.Type: ApplicationFiled: July 9, 2021Publication date: October 28, 2021Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson
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Patent number: 11101417Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.Type: GrantFiled: August 6, 2019Date of Patent: August 24, 2021Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson
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Patent number: 11088121Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: GrantFiled: March 2, 2020Date of Patent: August 10, 2021Assignee: X Display Company Technology LimitedInventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Publication number: 20210151630Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: January 29, 2021Publication date: May 20, 2021Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 10944027Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: June 14, 2019Date of Patent: March 9, 2021Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20210043816Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.Type: ApplicationFiled: August 6, 2019Publication date: February 11, 2021Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson
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Publication number: 20210043618Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: September 23, 2020Publication date: February 11, 2021Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20200395510Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 10748793Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: GrantFiled: February 13, 2019Date of Patent: August 18, 2020Assignee: X Display Company Technology LimitedInventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Publication number: 20200258761Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: ApplicationFiled: February 13, 2019Publication date: August 13, 2020Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Publication number: 20200259057Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: ApplicationFiled: March 2, 2020Publication date: August 13, 2020Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Patent number: 10735386Abstract: Methods, systems, and apparatus for Internet Protocol security (IPsec) selector coalescing for per-host Security Associations (SAs) are disclosed. In one aspect, separate per-host SAs are assigned, by a network communications device including one or more processors, to each of two or more different source communication devices that each communicates with corresponding destination devices. While the separate per-host SAs are assigned to each of the two or more different source communication devices, a group SA is generated. The group SA is assigned, by the network communications device, to all of the two or more different source communication devices. The assignment of the separate per-host SAs is removed from each of the two or more different source communication devices.Type: GrantFiled: February 1, 2018Date of Patent: August 4, 2020Assignee: ADTRAN, Inc.Inventors: Michael Arnold, Tyler Pearson
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Publication number: 20200051482Abstract: A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.Type: ApplicationFiled: August 13, 2018Publication date: February 13, 2020Inventors: Ronald S. Cok, Erich Radauscher, Erik Paul Vick, Andrew Tyler Pearson, Christopher Andrew Bower, Matthew Alexander Meitl
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Publication number: 20190238522Abstract: Methods, systems, and apparatus for Internet Protocol security (IPsec) selector coalescing for per-host Security Associations (SAs) are disclosed. In one aspect, separate per-host SAs are assigned, by a network communications device including one or more processors, to each of two or more different source communication devices that each communicates with corresponding destination devices. While the separate per-host SAs are assigned to each of the two or more different source communication devices, a group SA is generated. The group SA is assigned, by the network communications device, to all of the two or more different source communication devices. The assignment of the separate per-host SAs is removed from each of the two or more different source communication devices.Type: ApplicationFiled: February 1, 2018Publication date: August 1, 2019Inventors: Michael Arnold, Tyler Pearson