Abstract: A memory system including a memory device of storage transistors organized in multiple memory banks where the memory device interacts with a controller device to perform read and write operations. In some embodiments, the controller device is configured to issue to the memory device a write command and a write termination command, where the write command causing the memory device to initiate a write operation in the memory device and the write termination command causing the memory device to terminate the write operation. In one embodiment, the controller device issues a write abort command as the write termination command to terminate a write operation in progress at a certain memory bank of the memory device in order to issue a read command to read data from the same memory bank. The terminated write operation can resume after the completion of the read operation.

Abstract: In some embodiments, a memory device implements a tile-based architecture including an arrangement of independently and concurrently operable arrays or tiles of memory transistors where each tile includes memory transistors that are arranged in a three-dimensional array and a localized modular control circuit operating the memory transistors in the tile. The tile-based architecture of the memory device enables concurrent memory access to multiple tiles, which enables independent and concurrent memory operations to be carried out across multiple tiles. The tile-based concurrent access to the memory device has the benefits of increasing the memory bandwidth and lowering the tail latency of the memory device by ensuring high availability of storage transistors.

Abstract: Magnetic random-access memory (MRAM) circuits are provided herein. In one example implementation, an MRAM circuit includes control circuitry coupled to a magnetic tunnel junction (MTJ) element in series with a selector element. This control circuitry is configured to adjust current through the selector element when the selector element is in a conductive state. The circuit also includes a compensation circuitry configured to compensate for a offset voltage across the selector element in the conductive state based on adjustments to the current through the selector element. An output circuit is also configured to report a magnetization state of the MTJ element.

Abstract: A circuit or associated system or apparatus includes a first transistor, a second transistor, a first switch, a second switch, a first current source, and a third switch. The first transistor is configured to sample a first current of a control line. The second transistor is configured to apply a second current to the control line. The second transistor is also configured to match the second current to the first current. The first switch is connected in series between a control terminal of the first transistor and a control terminal of the second transistor. The second switch is connected in series between the second transistor and the control line. The third switch is connected in series between the first current source and the control line.

Abstract: Magnetic random-access memory (MRAM) circuits are provided herein. In one example implementation, an MRAM circuit includes control circuitry coupled to a magnetic tunnel junction (MTJ) element in series with a selector element. This control circuitry is configured to adjust current through the selector element when the selector element is in a conductive state. The circuit also includes a compensation circuitry configured to compensate for a offset voltage across the selector element in the conductive state based on adjustments to the current through the selector element. An output circuit is also configured to report a magnetization state of the MTJ element.

Abstract: One or more control lines other than those used to activate a non-volatile memory cell may be used to sense a data value of the cell. For example, an apparatus may include a selection circuit that selects, based on an address corresponding to a non-volatile memory cell included an array of non-volatile memory cells, a word line coupled to the non-volatile memory cells to activate the non-volatile memory cell. An amplifier circuit may sense a data value stored in the non-volatile memory cell based on a sense signal having a voltage level based on voltage levels of one or more other word lines of the array of non-volatile memory cells. In another example, a data value of a non-volatile memory cell coupled to a word line may be sensed based on the voltage levels of one or more dummy sense lines within the array.

Abstract: A circuit or associated system or apparatus includes a first transistor, a second transistor, a first switch, a second switch, a first current source, and a third switch. The first transistor is configured to sample a first current of a control line. The second transistor is configured to apply a second current to the control line. The second transistor is also configured to match the second current to the first current. The first switch is connected in series between a control terminal of the first transistor and a control terminal of the second transistor. The second switch is connected in series between the second transistor and the control line. The third switch is connected in series between the first current source and the control line.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for a multicore on-die memory controller. An integrated circuit device includes an array of non-volatile memory cells and a microcontroller unit. A microcontroller unit includes a plurality of processing units. Different processing units perform different categories of tasks in parallel for an array of non-volatile memory cells.

Abstract: A sequencer circuit is configured to generate control signals for on-die memory control circuitry. The control signals may include memory operation pulses for implementing operations on selected non-volatile memory cells embodied within the same die as the sequencer (and other on-die memory control circuitry). The timing, configuration, and/or duration of the memory control signals are defined in configuration data, which can be modified after the design and/or fabrication of the die and/or on-die memory circuitry. As such, the timing, configuration, and/or duration of the memory control signals generated by the sequencer may be manipulated after the design and/or fabrication of the die, sequencer, and other on-die memory control circuitry.

Abstract: One or more control lines other than those used to activate a non-volatile memory cell may be used to sense a data value of the cell. For example, an apparatus may include a selection circuit that selects, based on an address corresponding to a non-volatile memory cell included an array of non-volatile memory cells, a word line coupled to the non-volatile memory cells to activate the non-volatile memory cell. An amplifier circuit may sense a data value stored in the non-volatile memory cell based on a sense signal having a voltage level based on voltage levels of one or more other word lines of the array of non-volatile memory cells. In another example, a data value of a non-volatile memory cell coupled to a word line may be sensed based on the voltage levels of one or more dummy sense lines within the array.

Abstract: Apparatuses, systems, and methods are disclosed for controlling a data path for non-volatile memory. An apparatus includes one or more memory die. A memory die includes a memory core. A memory core includes an array of non-volatile memory cells and an internal data pipeline. A memory die includes a buffer that stores data associated with storage operations for a memory core. A memory die includes an internal controller that communicates with a memory core to initiate storage operations. An internal controller may delay initiating a storage operation in response to determining that an internal data pipeline and a buffer are both full.

Abstract: A sequencer circuit is configured to generate control signals for on-die memory control circuitry. The control signals may include memory operation pulses for implementing operations on selected non-volatile memory cells embodied within the same die as the sequencer (and other on-die memory control circuitry). The timing, configuration, and/or duration of the memory control signals are defined in configuration data, which can be modified after the design and/or fabrication of the die and/or on-die memory circuitry. As such, the timing, configuration, and/or duration of the memory control signals generated by the sequencer may be manipulated after the design and/or fabrication of the die, sequencer, and other on-die memory control circuitry.

Abstract: A calibration circuit coupled to a sense amplifier circuit may be configured to determine a response time of the sense amplifier circuit relative to a pulse sequence. Based on the determined response time, the calibration circuit may be configured to set a level of a biasing current to a desired level in order to control the response time of the sense amplifier circuit.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for a multicore on-die memory controller. An integrated circuit device includes an array of non-volatile memory cells and a microcontroller unit. A microcontroller unit includes a plurality of processing units. Different processing units perform different categories of tasks in parallel for an array of non-volatile memory cells.

Abstract: A calibration circuit coupled to a sense amplifier circuit may be configured to determine a response time of the sense amplifier circuit relative to a pulse sequence. Based on the determined response time, the calibration circuit may be configured to set a level of a biasing current to a desired level in order to control the response time of the sense amplifier circuit.

Abstract: A method includes, in a data storage device including a resistive memory, receiving, from an external device, an erase command to erase a portion of the resistive memory. The method further includes storing shaped data at the portion of the resistive memory responsive to the erase command. Shaped data is configured to control an amount of leakage current during a read and/or write operation at one or more storage elements that are adjacent to at least one storage element of the portion of the resistive memory.

Abstract: Technology is described for keeping current (e.g., peak power supply current or ICC) in a non-volatile memory system within a target while maintaining high throughput. Programming conditions are adaptively changed at the sub-codeword level in order to keep power supply current of the memory system within a target. In one embodiment, a chunk of data that corresponds to a sub-codeword is written while consuming lower than normal programming current in order to keep power supply current within a target. The relatively low programming current may increase the expected raw BER. However, other portions of the codeword can be written with a higher than normal programming current, which results in a lower expected bit raw error rate for the memory cells that store that portion.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for redundancy mapping. A controller is configured to determine that one or more defects affect a subset of a first group of cells and a subset of a second group of cells of a non-volatile memory medium. A non-volatile memory medium may include a plurality of groups of cells, and redundant groups of cells may be available for replacing defective groups of cells. A controller is configured to store a mapping between affected subsets of first and second groups of cells and a redundant group of cells for a non-volatile memory medium. A controller is configured to read data for a first group and/or second group of cells by referencing a mapping and using a redundant group of cells.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for redundancy mapping. A controller is configured to determine that one or more defects affect a subset of a first group of cells and a subset of a second group of cells of a non-volatile memory medium. A non-volatile memory medium may include a plurality of groups of cells, and redundant groups of cells may be available for replacing defective groups of cells. A controller is configured to store a mapping between affected subsets of first and second groups of cells and a redundant group of cells for a non-volatile memory medium. A controller is configured to read data for a first group and/or second group of cells by referencing a mapping and using a redundant group of cells.

Abstract: A data storage device includes a memory die. The memory die includes a resistive random access memory (ReRAM) having a first portion and a second portion that is adjacent to the first portion. A method includes determining whether to access the second portion of the ReRAM in response to initiating a first operation targeting the first portion of the ReRAM. The method further includes initiating a second operation that senses information stored at the second portion to generate sensed information in response to determining to access the second portion. The method further includes initiating a third operation to rewrite the information at the ReRAM in response to detecting an indication of a disturb condition based on the sensed information.