Abstract: The invention relates to a composite substrate for light emitting device and a LED module equipped with the composite substrate for light emitting device. The composite substrate for light emitting device includes a metal substrate, an insulating carrier and an electrode, the metal substrate and the insulating carrier respectively have a front side and a back side that are opposite, the insulating carrier is disposed on the periphery of the metal substrate and connected to the metal substrate, the electrode is disposed on the insulating carrier, the electrode penetrates the insulating carrier, the electrode has a front side and a back side that are opposite, the heights of the back sides of the insulating carrier and the electrode are less than that of the back side of the metal substrate. The present invention also provides a LED module. The composite substrate for light emitting device can reduce costs.

Abstract: Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.

Abstract: Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.

Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.

Abstract: A light emitting device includes a base, a first light emitting unit, a second light emitting unit, a light conversion layer and a lens. The base has a first side slot, a second side slot, and a central slot separated from the first side slot and the second side slot, and the first side slot is formed in a separated recess configuration with a long axis and a short axis. The first light emitting unit is installed in the central slot, and the second light emitting unit is installed in the first side slot. The light conversion layer is covered onto the first light emitting unit or the second light emitting unit, and the lens covers the light conversion layer, the central slot, the first side slot, and the second side slot. The first slot and the lens have first similar contour lines in a top view.

Abstract: A LED bulb includes a circuit board, a lighting module, an electrical connector, and a lamp shade. The circuit board includes a slot. The lighting module includes a transmissive substrate having a first surface and a second surface opposite to the first surface. The lighting module includes a circuit layer arranged on the first surface, an electrode component arranged on the first surface and electrically connected to the circuit layer, a plurality of LED dies arranged on the first surface and electrically connected to the circuit layer and the electrode component, and the phosphor layer covering the first surface and the second surface. The electrical connector is electrically connected to the circuit board. The lamp shade is associated with the electrical connector.

Abstract: A LED bulb includes a circuit board, a lighting module, a conductive connector, and a lamp shade. The circuit board includes a slot. The lighting module is arranged on the circuit board and includes a transmissive substrate. The lighting module includes a circuit layer attached to the transmissive substrate, an electrode component arranged on one end of the transmissive substrate and inserted into the slot and electrically connected to the circuit layer, and a plurality of LED dies placed on the transmissive substrate and electrically connected to the circuit layer. The conductive connector is arranged on the other side of the circuit board and electrically connected to the circuit. The lamp shade is assembled with the conductive connector such that the circuit board and the lighting module are arranged between the conductive connector and the lamp shade.

Abstract: LED assemblies and related LED light bulbs. An LED assembly has a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip, and a second wavelength conversion layer formed on the second surface. The flexible, transparent substrate has first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.

Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate, LED chips, and first and second electrode plates. The transparent substrate comprises first and second surfaces facing to opposite orientations respectively. The transparent substrate has a via hole tunneling therethrough, which is formed with conductive material to provide a conductive via. The LED chips are mounted on the first surface. The first and second electrode plates are formed on the first and second surfaces respectively. The light emitting diode chips and the conductive via are electrically connected in series between the first and second electrode plates.

Abstract: An LED assembly, comprising: a light-transmissive substrate comprising a surface, a central region and a peripheral region surrounding the central region; a heat dissipation element, wherein a portion of the heat dissipation element is corresponding to the central region of the light-transmissive substrate; a first wavelength conversion layer arranged on the surface of the light-transmissive substrate and corresponding to the peripheral region of the light-transmissive substrate; a plurality of LED elements arranged on the first wavelength conversion layer; a second wavelength conversion layer arranged on the surface of the light-transmissive substrate and covering the plurality of LED elements and the first wavelength conversion layer; a plurality of conductive structures surrounding the plurality of LED elements and electrically connected thereto, wherein the plurality of conductive structures is formed on the surface and separated from each other; and a plurality of electrical contacts electrically connect

Abstract: A light-emitting lamp has a bulb shell, a convective accelerator, a light-emitting filament and a bulb base. The bulb shell defines an interior volume filled with a filling gas, and comprises a first transparent material. The convective accelerator is disposed within the interior volume, and comprises a second transparent material. The convective accelerator contains a flue with first and second openings. The light-emitting filament is disposed within the flue, comprising a plurality of semiconductor light-emitting elements. When the light-emitting filament emits light to generate heat, the flue allows a convection flow of the filling gas to pass into one of the first and second openings. The bulb base supports the bulb shell and the light-emitting filament, and has electrical conductors in electrical communication with the light-emitting filament. The first and the second openings have different distances apart from the bulb base.

Abstract: Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.

Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.

Abstract: Disclosure has LED assemblies and related LED light bulbs. An LED assembly comprises a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, and a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip. The flexible, transparent substrate comprises first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.

Abstract: Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.

Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate, LED chips, and first and second electrode plates. The transparent substrate comprises first and second surfaces facing to opposite orientations respectively. The transparent substrate has a via hole tunneling therethrough, which is formed with conductive material to provide a conductive via. The LED chips are mounted on the first surface. The first and second electrode plates are formed on the first and second surfaces respectively. The light emitting diode chips and the conductive via are electrically connected in series between the first and second electrode plates.

Abstract: A light-emitting lamp has a bulb shell, a convective accelerator, a light-emitting filament and a bulb base. The bulb shell defines an interior volume filled with a filling gas, and comprises a first transparent material. The convective accelerator is disposed within the interior volume, and comprises a second transparent material. The convective accelerator contains a flue with first and second openings. The light-emitting filament is disposed within the flue, comprising a plurality of semiconductor light-emitting elements. When the light-emitting filament emits light to generate heat, the flue allows a convection flow of the filling gas to pass into one of the first and second openings. The bulb base supports the bulb shell and the light-emitting filament, and has electrical conductors in electrical communication with the light-emitting filament. The first and the second openings have different distances apart from the bulb base.

Abstract: A LED bulb includes a circuit board, a lighting module, a conductive connector, and a lamp shade. The circuit board includes a slot. The lighting module is arranged on the circuit board and includes a transmissive substrate. The lighting module includes a circuit layer attached to the transmissive substrate, an electrode component arranged on one end of the transmissive substrate and inserted into the slot and electrically connected to the circuit layer, and a plurality of LED dies placed on the transmissive substrate and electrically connected to the circuit layer. The conductive connector is arranged on the other side of the circuit board and electrically connected to the circuit. The lamp shade is assembled with the conductive connector such that the circuit board and the lighting module are arranged between the conductive connector and the lamp shade.

Abstract: A Multi-Cavities light emitting device includes a base, a blue light emitting unit, at least two red light emitting units, a light conversion layer and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the blue light emitting unit is installed in the central slot, and the two red light emitting units are installed in the two side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and at least two side slots, so as to achieve the effects of improving the light extraction efficiency of an LED chip and the yield rate of the product and reducing the overall assembling time and cost.