Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.

Abstract: A light emitting diode (LED) package structure includes a substrate, at least one enclosure made of a transparent material, an LED, a first package material, and a second package material. The enclosure is disposed on a surface of the substrate, and forms a configuration area for disposing the LED therein. The first package material made of a transparent material is disposed in the configuration area and covers the LED. The second package material containing a fluorescent material covers the enclosure, the LED, and the first package material.

Abstract: A method for fabricating a self assembling light emitting diode lens is disclosed. The method includes providing a first fluid with a first viscosity and a second fluid with a second viscosity. The refractive index of the first fluid is the same as the refractive index of the second fluid. Then the first fluid and the second fluid are blended in a predetermined ratio to obtain a third fluid with a third viscosity. Then the third fluid is dispended on a light emitting diode, which is disposed on a substrate. The third fluid is cured to form a lens on the light emitting diode. The shape of the lens is controlled by the third viscosity.

Abstract: A light emitting diode (LED) package structure includes a substrate, at least one enclosure made of a transparent material, an LED, a first package material, and a second package material. The enclosure is disposed on a surface of the substrate, and forms a configuration area for disposing the LED therein. The first package material made of a transparent material is disposed in the configuration area and covers the LED. The second package material containing a fluorescent material covers the enclosure, the LED, and the first package material.

Abstract: A light-emitting diode (LED) package structure includes a substrate, a first LED, a second LED, and a resin material. At least one enclosure made of a transparent material forms on a surface of the substrate, and encloses and forms at least one area on the substrate. The first LED and the second LED are disposed in the area and adjacent to each other, and the resin material is disposed in the area, and covers the first LED and the second LED. The LED package structure obtains desired illuminating lights by mixing lights respectively emitted by the first LED and the second LED.

Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.

Abstract: A light emitting diode manufacturing method introduces a transparent enclosure to improve the uniformity of coating phosphor, so as to achieve the purposes of enhancing the uniform color temperature and the light emitting efficiency. The manufacturing method is used extensively for packaging various types of light emitting diode chips and mass production.

Abstract: An assembly device for a sidelight light source module and liquid crystal panel, comprising: a liquid crystal panel; a light guide panel; a light reflecting plate; a light source module installed at a side of the light guide panel; wherein the light source module comprises: a circuit board, on top of is soldered blue light chips and red light chips; a luminescence fluorescent layer positioned on top of the blue light chips and the red light chips. Mixed light consisting of the excited light, the blue light and the red light is transmitted out the fluorescent layer and forms a white light that passes through the light guide panel, the light reflecting plate, and is finally transmitted out the liquid crystal panel.

Abstract: An assembled device of a light module and a liquid crystal panel is composed of a liquid crystal panel whose bottom surface is provided with a light module which includes a circuit board on which are welded at least more than one blue light chip, which is next to a red light chip, as a blue light emitting source, and more than one red light chip as a red light emitting source. A light emitting illumination layer, which is made by uniformly mixing an illumination powder with a transparent glue, is located above the blue light chip and the red light chip, so as to develop into a white light as a back light source whose rendering effect and uniformity are of a good quality and can be easily controlled.

Abstract: A white light emitting device is composed of at least more than one blue light LED which can emit a blue light, at least more than one red light LED which can emit a red light, and an illuminator made by uniformly mixing a greenish yellow illumination material, a blue illumination material, and a transparent glue, wherein the illuminator can absorb the blue light, such that the illuminator will be excited to a first mixed light having a wavelength different than that of the blue light. The first mixed light is mixed with a red light emitted from the red light LED to release a second mixed light which is provided with a high rendering effect and saturation of color.

Abstract: A light emitting device including three light emitting sources and a phosphor, with the three light sources consisted of following light emitting diodes (LED) emitting lights having different wavelengths. Wherein, two light sources are used to excite the phosphor to produce a distinct wavelength different from those of the two light sources. The distinct wavelength is blended with portions of the two light sources and a light source from another independent light source, and a blended light is released to obtain a white light.

Abstract: A white light emitting device includes a device having at least one light emitting diode (LED) serving as a light source and being capable of emitting a light between blue and green in color; and a phosphor consisted of first and second phosphors each made of a compound from different materials. The phosphor is excited by the light from the light source to emit a first-color light and a second-color light, which are both blended with a portion of the light and altogether release to obtain a white light having enhanced color rendering effects, thereby offering the white light with illuminant contrast.

Abstract: A light emitting device includes at least three light emitting source and a phosphor, with the three light sources consisted of following light emitting diodes (LED) emitting lights having different wavelengths. Wherein, two light sources are used to excite the phosphor to produce a distinct wavelength different from those of the two light sources. The distinct wavelength is blended with portions of the two light sources and a light source from another independent light source, and a blended light is released to obtain a white light having an excellent color rendering index.