Patents by Inventor Tzu-Ching Hung

Tzu-Ching Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140370263
    Abstract: A plasticizable heat-insulating composition compatible with polyvinyl acetal resins and mixed with polyvinyl acetal resin for forming a mixture for a plasticizing process for making a transparent intermediate heat-insulating sheet, as well as a transparent heat-insulating sandwich-structured panel that demonstrates high transparency, high wide-range near infrared absorbance and high heat-insulation index, so as to improve their heat-insulating and energy-saving functions.
    Type: Application
    Filed: September 5, 2013
    Publication date: December 18, 2014
    Applicant: Taiflex Scientific Co., Ltd.
    Inventors: Chen-Kuo LU, Yu-Chih KAO, Chia-Che CHUANG, Tzu-Ching HUNG
  • Patent number: 8415004
    Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: April 9, 2013
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Yu-Hsien Lee, Chen-Hsin Huang, Feng-Jung Tien, Tzu-Ching Hung
  • Publication number: 20110111191
    Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
    Type: Application
    Filed: November 12, 2009
    Publication date: May 12, 2011
    Inventors: Yu-Hsien Lee, Chen-Hsin Huang, Feng-Jung Tien, Tzu-Ching Hung
  • Patent number: 6709741
    Abstract: The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R2 and R3 each represents a hydrogen atom and a methyl group; R4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: March 23, 2004
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Fu-Le Lin, Ching-Ping Chen, Tzu-Ching Hung, Sung-Chen Huang, Kuo-Hua Yu, Kuo-Hsiung Hsia, Yen-Chi Liu