Patents by Inventor Tzu-Hsiang Wang
Tzu-Hsiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9741699Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: GrantFiled: October 19, 2015Date of Patent: August 22, 2017Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Patent number: 9368483Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.Type: GrantFiled: November 25, 2013Date of Patent: June 14, 2016Assignee: Formosa Epitaxy IncorporationInventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Sheng-Hung Hsu, Wei-Kang Cheng, Shyi-Ming Pan
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Publication number: 20160043292Abstract: A light emitting device includes a substrate, a first group of light emitting diode (LED) structures, a second group of LED structures, and a connection port is provided. The substrate has a first surface and a second surface opposite to the first surface. The first group of LED structures is disposed on one side of the first surface. The second group of LED structures is disposed on another side of the first surface opposite to the first group of LED structures. The connection portion includes at least an opening, and a first connection pad and a second connection pad electrically coupled to at least a part of the LED structures. The connection port is adapted to be coupled to other device through the opening. A light emitting module and an illuminating apparatus are also provided.Type: ApplicationFiled: June 5, 2015Publication date: February 11, 2016Inventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
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Publication number: 20160043063Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: ApplicationFiled: October 19, 2015Publication date: February 11, 2016Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Patent number: 9166116Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: GrantFiled: March 15, 2013Date of Patent: October 20, 2015Assignee: Formosa Epitaxy IncorporationInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Patent number: 9123868Abstract: A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base.Type: GrantFiled: May 29, 2013Date of Patent: September 1, 2015Assignee: Formosa Epitaxy IncorporationInventors: Shyi-Ming Pan, Wei-Kang Cheng, Chih-Shu Huang, Chen-Hong Lee, Shih-Yu Yeh, Chi-Chih Pu, Cheng-Kuang Yang, Shih-Chieh Tang, Siang-Fu Hong, Tzu-Hsiang Wang
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Patent number: 9065022Abstract: The present invention relates to a light emitting apparatus comprising at least one light emitting device and a support mechanism. The light emitting device includes a transparent substrate which light can pass through; at least one LED chip emitting light omni-directionally is disposed on one surface of the substrate, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. The support mechanism is coupled to the light emitting device; a first angle is formed between the substrate and the support mechanism. According to the present invention, the light emitting apparatus using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: GrantFiled: March 18, 2013Date of Patent: June 23, 2015Assignee: Formosa Epitaxy IncorporationInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Patent number: 9029898Abstract: The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.Type: GrantFiled: February 6, 2014Date of Patent: May 12, 2015Assignee: Formosa Epitaxy IncorporationInventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Sheng-Hung Hsu, Wei-Kang Cheng, Shyi-Ming Pan
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Publication number: 20140153239Abstract: The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.Type: ApplicationFiled: February 6, 2014Publication date: June 5, 2014Applicant: FORMOSA EPITAXY INCORPORATIONInventors: CHI-CHIH PU, CHEN-HONG LEE, TZU-HSIANG WANG, SHENG-HUNG HSU, WEI-KANG CHENG, SHYI-MING PAN
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Publication number: 20140103369Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.Type: ApplicationFiled: November 25, 2013Publication date: April 17, 2014Applicant: Formosa Epitaxy IncorporationInventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Sheng-Hung Hsu, Wei-Kang Cheng, Shyi-Ming Pan
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Publication number: 20130320363Abstract: A sapphire substrate configured to form a light emitting diode (LED) chip providing light in multi-directions, a LED chip and an illumination device are provided in the present invention. The sapphire substrate includes a growth surface and a second main surface opposite to each other. A thickness of the sapphire substrate is thicker than or equal to 200 micrometers. The LED chip includes the sapphire substrate and at least one LED structure. The LED structure is disposed on the growth surface and forms a first main surface where light emitted from with a part of the growth surface without the LED structures. At least a part of light beams emitted from the LED structure pass through the sapphire substrate and emerge from the second main surface. The illumination device includes at least one LED chip and a supporting base. The LED chip is disposed on the supporting base.Type: ApplicationFiled: May 28, 2013Publication date: December 5, 2013Applicant: Formosa Epitaxy IncorporationInventors: Shyi-Ming Pan, Wei-Kang Cheng, Chih-Shu Huang, Chen-Hong Lee, Shih-Yu Yeh, Chi-Chih Pu, Cheng-Kuang Yang, Shih-Chieh Tang, Siang-Fu Hong, Tzu-Hsiang Wang
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Publication number: 20130322081Abstract: A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base.Type: ApplicationFiled: May 29, 2013Publication date: December 5, 2013Inventors: Shyi-Ming Pan, Wei-Kang Cheng, Chih-Shu Huang, Chen-Hong Lee, Shih-Yu Yeh, Chi-Chih Pu, Cheng-Kuang Yang, Shih-Chieh Tang, Siang-Fu Hong, Tzu-Hsiang Wang
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Publication number: 20130320373Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: ApplicationFiled: March 15, 2013Publication date: December 5, 2013Applicant: FORMOSA EPITAXY INCORPORATIONInventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Patent number: D731681Type: GrantFiled: July 30, 2013Date of Patent: June 9, 2015Assignee: Formosa Epitaxy IncorporationInventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Wei-Kang Cheng, Shyi-Ming Pan
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Patent number: D753321Type: GrantFiled: October 31, 2014Date of Patent: April 5, 2016Assignee: Formosa Epitaxy IncorporationInventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
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Patent number: D759854Type: GrantFiled: October 30, 2014Date of Patent: June 21, 2016Assignee: Formosa Epitaxy IncorporationInventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
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Patent number: D770398Type: GrantFiled: October 30, 2014Date of Patent: November 1, 2016Assignee: Formosa Epitaxy IncorporationInventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
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Patent number: D786458Type: GrantFiled: October 31, 2014Date of Patent: May 9, 2017Assignee: EPISTAR CORPORATIONInventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee