Abstract: A heat dissipation substrate includes heat dissipation blocks, an insulation filling structure, a first insulating layer, and a first circuit layer. Each heat dissipation block includes a first surface and a second surface opposite to the first surface. The insulation filling structure is disposed between the heat dissipation blocks to laterally connect the heat dissipation blocks. A first insulating surface of the insulation filling structure is substantially coplanar with the first surface of the heat dissipation block. A second insulating surface of the insulation filling structure is substantially coplanar with the second surface of the heat dissipation block. The first insulating layer is disposed on the first surface. The first circuit layer is disposed on the first insulating layer and penetrates the first insulating layer to be connected with the heat dissipation blocks. A thickness of the heat dissipation blocks is greater than a thickness of the first circuit layer.

Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.

Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface.

Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.

Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface.

Abstract: An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.

Abstract: An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.

Abstract: A process of fabricating a heat dissipation substrate is provided. A metal substrate having an upper surface, a lower surface, first recesses located on the upper surface and second recesses located on the lower surface is provided. The metal substrate is divided into carrier units and connecting units connecting the carrier units. A first and a second insulating materials are respectively filled into the first and the recesses. A first conductive layer is formed on the upper surface and the first insulating material. A second conductive layer is formed on the lower surface and the second insulating material. The first and the second conductive layers are patterned to form a first and a second patterned conductive layers. The first and the second insulating materials are taken as an etching mask to etch the connecting units of the metal substrate so as to form a plurality of individual heat dissipation substrates.

Abstract: A process of fabricating a heat dissipation substrate is provided. A metal substrate having an upper surface, a lower surface, first recesses located on the upper surface and second recesses located on the lower surface is provided. The metal substrate is divided into carrier units and connecting units connecting the carrier units. A first and a second insulating materials are respectively filled into the first and the recesses. A first conductive layer is formed on the upper surface and the first insulating material. A second conductive layer is formed on the lower surface and the second insulating material. The first and the second conductive layers are patterned to form a first and a second patterned conductive layers. The first and the second insulating materials are taken as an etching mask to etch the connecting units of the metal substrate so as to form a plurality of individual heat dissipation substrates.

Abstract: Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material.

Abstract: A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. A metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first shallow trench with a first depth is then formed on the first surface. A second shallow trench with a second depth is formed on the second surface, and a deep trench penetrating the first shallow trench and the second shallow trench is formed, where the metallic substrate is separated into many thermal conduction blocks by the deep trench. At least one metallic layer and at least one insulating material are laminated on the thermal conduction blocks, and the insulating material is filled into the deep trench and covers the thermal conduction blocks.

Abstract: A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. First, a metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first shallow trench with a first depth is then formed on the first surface. A second shallow trench with a second depth is formed on the second surface, and a deep trench penetrating the first shallow trench and the second shallow trench is formed, where the metallic substrate is separated into many thermal conduction blocks by the deep trench. At least one metallic layer and at least one insulating material are laminated on the thermal conduction blocks, and the insulating material is filled into the deep trench and covers the thermal conduction blocks.

Abstract: A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. A metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first shallow trench with a first depth is then formed on the first surface. A second shallow trench with a second depth is formed on the second surface, and a deep trench penetrating the first shallow trench and the second shallow trench is formed, where the metallic substrate is separated into many thermal conduction blocks by the deep trench. At least one metallic layer and at least one insulating material are laminated on the thermal conduction blocks, and the insulating material is filled into the deep trench and covers the thermal conduction blocks.

Abstract: A thermal enhanced substrate having a non-cylinder via structure includes at least a metal layer disposed on an insulating base material and a number of thermal channels respectively constituted by at least a trough pattern penetrating the insulating base material and a conductive material deposited in the trough pattern. The trough pattern serves as a non-cylinder via structure having at least an elongated hole for heat dissipations so as to reduce a working temperature of an electronic device.

Abstract: A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. First, a metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first shallow trench with a first depth is then formed on the first surface. A second shallow trench with a second depth is formed on the second surface, and a deep trench penetrating the first shallow trench and the second shallow trench is formed, where the metallic substrate is separated into many thermal conduction blocks by the deep trench. At least one metallic layer and at least one insulating material are laminated on the thermal conduction blocks, and the insulating material is filled into the deep trench and covers the thermal conduction blocks.