Abstract: Methods of fabricating solid-state imaging devices having a flat microlens array are provided. The method includes providing a semiconductor substrate having a plurality of photoelectric conversion elements. A color filter layer is formed above the semiconductor substrate. A lens material layer is formed on the color filter layer. A hard mask having a lens-shaped pattern is formed on the lens material layer. The method further includes etching both the hard mask and the lens material layer to form a microlens with a flat top surface that is formed from the lens material layer, and to leave a portion of the hard mask on the flat top surface of the microlens. The method also includes removing the portion of the hard mask that remains on the microlens.

Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.

Abstract: A polymer coated cathode material not subject to catastrophic failure through local overheating comprises cathode active material particles and a polymer layer. The polymer layer wraps each cathode active material particle. The polymer coated cathode material has a core-shell structure. The core-shell structure comprises a core and a shell, the core is formed by the cathode active material particle, the shell is formed by the polymer layer. A battery made by the polymer coated cathode material is safer, in that when there is a short circuit, the short circuit only happens locally and a chain reaction is avoided. Only a part of the battery may reach high temperature, preventing an explosion of the battery. A cathode using the polymer coated cathode material, and a battery using the cathode are also provided.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract: An image sensor is provided. The image sensor includes a red (R) pixel, a green (G) pixel, a blue (B) pixel and an infrared (IR) pixel, and R, G and B filters respectively disposed at the R, G and B pixels. The image sensor also includes an IR pass filter disposed at the IR pixel and an IR filter stacked with the R, G and B filters, wherein the IR filter cuts off at least IR light with a specific wavelength. Furthermore, a method of forming an image sensor is also provided.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

Abstract: An image sensor is provided. The image sensor includes a semiconductor substrate containing a plurality of photoelectric conversion elements. A color filter array is disposed above the semiconductor substrate. The color filter array includes a first color filter, a second color filter and a third color filter. The image sensor further includes an isolated partition disposed in the color filter array to surround one of the first, second and third color filters. The isolated partition has a refractive index that is lower than the refractive indexes of the first, second and third color filters.

Abstract: In one embodiment, the present invention is directed to a method implemented on a computer system of database retrieval including organizing and suggesting search results by style, not just product category. In one embodiment, a computer implemented smoothing algorithm is used to adjust the ranking feature calculations from insufficient data. The use of smoothing improves the statistical confidence of the ranking features, creating a product ranking that is robust to small sample bias.

Abstract: An image sensor is provided. The image sensor includes a red (R) pixel, a green (G) pixel, a blue (B) pixel and an infrared (IR) pixel, and R, G and B filters respectively disposed at the R, G and B pixels. The image sensor also includes an IR pass filter disposed at the IR pixel and an IR filter stacked with the R, G and B filters, wherein the IR filter cuts off at least IR light with a specific wavelength. Furthermore, a method of forming an image sensor is also provided.

Abstract: A verification method applied to remote connection includes a server generating a first key and a second key matched with each other, an IP camera connecting to the server to acquire the first key, the server transmitting a token encrypted or signed by the second key to a first user program which successfully logins the server, the IP camera receiving a connection request with the token from a second user program, and the IP camera utilizing the first key to verify the token and responding the connection request according to a verification result.

Abstract: A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided. A surface treatment is performed on the first and second copper foil layers so as to form a first and second roughened surfaces. A laser beam is irradiated on the first roughened surface so as to form at least one first blind hole extending from the first copper foil layer to the second surface. An etching process is performed on the second copper foil layer so as to form at least one second blind hole extending from the second copper foil layer to the second surface. A conductive layer fills up a through hole defined by the first and second blind holes and covers the first and second copper foil layers.

Abstract: A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The first copper foil layer and the second copper foil layer are respectively disposed on two opposite side surfaces of the insulation layer. The first blind via extends from the upper surface toward the second copper foil layer and exposes a portion of the second copper foil layer. The second blind via extends from the lower surface toward the first copper foil layer and exposes a portion of the first copper foil layer. The filling material is filled inside of the first blind via and the second blind via and covers the upper surface and the lower surface of the substrate.

Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: A packaging process is provided. A package mother board having an upper surface, a lower surface, a device disposing area and a peripheral area surrounding the device disposing area is provided. Multiple semiconductor devices are disposed on the upper surface. The semiconductor devices are located in the device disposing area. A carrier having a center area and an edge area surrounding the center area is provided. An adhesive layer is formed between the peripheral area and the edge area. The center area of the carrier is disposed corresponding to the device disposing area of the package mother board. The edge area of the carrier is disposed corresponding to the peripheral area of the package mother board. The adhesive layer is in a state of semi-curing, and the package mother board is bonded to the carrier via the adhesive layer. A baking process is performed to completely cure the adhesive layer.

Abstract: A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided. A surface treatment is performed on the first and second copper foil layers so as to form a first and second roughened surfaces. A laser beam is irradiated on the first roughened surface so as to form at least one first blind hole extending from the first copper foil layer to the second surface. An etching process is performed on the second copper foil layer so as to form at least one second blind hole extending from the second copper foil layer to the second surface. A conductive layer fills up a through hole defined by the first and second blind holes and covers the first and second copper foil layers.

Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.