Abstract: A portable electronic device includes a first body, a second body, a hinge mechanism, a spring, and a cable extending from the first body to the second body. The second body is connected to the first body through the hinge mechanism. The first body has a first pillar, a second pillar, and a third pillar. The second pillar is located between the first pillar and the third pillar. The spring is disposed in the first body as corresponding to the second pillar. The cable includes a first winding segment extending through a gap between the first pillar and the second pillar, a second winding segment extending through a gap between the second pillar and the spring, and a third winding segment extending through a gap between the second pillar and the third pillar. Two ends of the spring are respectively connected to the first body and the second winding segment.

Abstract: A portable electronic device includes a first body, a second body, a hinge mechanism, a spring, and a cable extending from the first body to the second body. The second body is connected to the first body through the hinge mechanism. The first body has a first pillar, a second pillar, and a third pillar. The second pillar is located between the first pillar and the third pillar. The spring is disposed in the first body as corresponding to the second pillar. The cable includes a first winding segment extending through a gap between the first pillar and the second pillar, a second winding segment extending through a gap between the second pillar and the spring, and a third winding segment extending through a gap between the second pillar and the third pillar. Two ends of the spring are respectively connected to the first body and the second winding segment.

Abstract: A portable electronic apparatus includes a first body having a pivoting side and a heat dissipating hole located at the pivoting side, a second body, and a hinge mechanism. The second body is rotatably and slidably connected to the first body through the hinge mechanism including a rack fixed in the first body as corresponding to the pivoting side, a rotating shaft connected to the second body, and a driving component connected to the rotating shaft and mechanically coupled to the rack. When the second body rotates and unfolds with respect to the first body, the rotating shaft rotates together with the second body, the driving component rotates with the rotating shaft, and the driving component rotates and slides with respect to the rack and drives the second body to slide away from the pivoting side to increase a distance between the second body and the heat dissipating hole.

Abstract: An integrated circuit die includes a FinFET transistor. The FinFET transistor includes an anti-punch through region below a channel region. Undesirable dopants are removed from the anti-punch through region during formation of the source and drain regions. When source and drain recesses are formed, a layer of dielectric material is deposited in the recesses. An annealing process is then performed. Undesirable dopants diffuse from the anti-punch through region into the layer of dielectric material during the annealing process. The layer of dielectric material is then removed. The source and drain regions are then formed by depositing semiconductor material in the recesses.

Abstract: A portable electronic device includes a first body, a second body, a hinge mechanism, a spring, and a cable extending from the first body to the second body. The second body is connected to the first body through the hinge mechanism. The first body has a first pillar, a second pillar, and a third pillar. The second pillar is located between the first pillar and the third pillar. The spring is disposed in the first body as corresponding to the second pillar. The cable includes a first winding segment extending through a gap between the first pillar and the second pillar, a second winding segment extending through a gap between the second pillar and the spring, and a third winding segment extending through a gap between the second pillar and the third pillar. Two ends of the spring are respectively connected to the first body and the second winding segment.

Abstract: An integrated circuit die includes a FinFET transistor. The FinFET transistor includes an anti-punch through region below a channel region. Undesirable dopants are removed from the anti-punch through region during formation of the source and drain regions. When source and drain recesses are formed, a layer of dielectric material is deposited in the recesses. An annealing process is then performed. Undesirable dopants diffuse from the anti-punch through region into the layer of dielectric material during the annealing process. The layer of dielectric material is then removed. The source and drain regions are then formed by depositing semiconductor material in the recesses.

Abstract: A processor employs a plurality of fetch and decode pipelines by dividing an instruction stream into instruction blocks with identified boundaries. The processor includes a branch predictor that generates branch predictions. Each branch prediction corresponds to a branch instruction and includes a prediction that the corresponding branch is to be taken or not taken. In addition, each branch prediction identifies both an end of the current branch prediction window and the start of another branch prediction window. Using these known boundaries, the processor provides different sequential fetch streams to different ones of the plurality of fetch and decode states, which concurrently process the instructions of the different fetch streams, thereby improving overall instruction throughput at the processor.

Abstract: A processor employs a plurality of op cache pipelines to concurrently provide previously decoded operations to a dispatch stage of an instruction pipeline. In response to receiving a first branch prediction at a processor, the processor selects a first op cache pipeline of the plurality of op cache pipelines of the processor based on the first branch prediction, and provides a first set of operations associated with the first branch prediction to the dispatch queue via the selected first op cache pipeline.

Abstract: Branch prediction circuitry predicts an outcome of a branch instruction. A pipeline circuitry processes instructions along a first path from a predicted branch of the branch instruction. The instructions along the first path are processed concurrently with processing instructions along a second path from an unpredicted branch of the branch instruction. Information representing the state of the second portion while processing the second path is stored in one or more buffers. The instructions are processed along the second path using the information stored in the buffers in response to a misprediction of the outcome of the branch instruction. In some cases, the branch prediction circuitry determines a confidence level for the predicted outcome and the instructions along the second path from the unpredicted branch are processed in response to the confidence level being below a threshold confidence.

Abstract: The present disclosure provides a crosslinking agent, the preparation process and uses thereof, a hydrogel and a biodegradable cryogel including the crosslinking agent.

Abstract: A dip coating apparatus includes a liquid tank containing paint and a hanging tool for dipping into or removal from the liquid tank. The hanging tool includes a hollow frame, a first and second rack, and two first hanging frames. The hollow frame has a first and second strip. The first and the second racks are disposed in the hollow frame and connected to the first and the second strips. Each of the first hanging frames includes a first top strip connected to the first rack, a first bottom strip connected to the second rack, and a first lateral strip connected to the first top strip and the first bottom strip. Each first lateral strip forms an obtuse angle with the corresponding first top strip and an acute angle with the corresponding first bottom strip. Each first lateral strip includes a first top hook and a first bottom hook.

Abstract: A dip coating apparatus includes a liquid tank containing paint and a hanging tool for dipping into or removal from the liquid tank. The hanging tool includes a hollow frame, a first and second rack, and two first hanging frames. The hollow frame has a first and second strip. The first and the second racks are disposed in the hollow frame and connected to the first and the second strips. Each of the first hanging frames includes a first top strip connected to the first rack, a first bottom strip connected to the second rack, and a first lateral strip connected to the first top strip and the first bottom strip. Each first lateral strip forms an obtuse angle with the corresponding first top strip and an acute angle with the corresponding first bottom strip. Each first lateral strip includes a first top hook and a first bottom hook.

Abstract: An integrated circuit die includes a FinFET transistor. The FinFET transistor includes an anti-punch through region below a channel region. Undesirable dopants are removed from the anti-punch through region during formation of the source and drain regions. When source and drain recesses are formed, a layer of dielectric material is deposited in the recesses. An annealing process is then performed. Undesirable dopants diffuse from the anti-punch through region into the layer of dielectric material during the annealing process. The layer of dielectric material is then removed. The source and drain regions are then formed by depositing semiconductor material in the recesses.

Abstract: A casing includes a substrate, a protective layer, a plurality of conductive shielding components and a plurality of waterproof layers. The substrate has a first surface and a second surface. The protective layer encapsulates the first surface and the second surface, wherein the protective layer has a plurality of openings and a part of the first surface is exposed from the openings. The conductive shielding components contact the protective layer encapsulating the first surface, and the conductive shielding components respectively cover the openings. The waterproof layers respectively cover edges of the conductive shielding components and contact the protective layer. A manufacturing method of casing is also provided.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding will extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.

Abstract: In a flat panel display having integral frame structure, features of a metal frame and a plastic support, which support, position, and fix each component, are incorporated as an integral frame structure, such that no additional structure component is needed for the flat panel display to assemble the backlight module and the panel module. The frame structure is assembled to the bottom cover via screw that can reduce defectiveness of repetitive processing. A concave section at the bottom of the frame structure can contain a control circuit board for the panel cell such that the control circuit board can be rerouted downward to the bottom of the frame structure. The space required at the light source side of the flat panel display can be reduced, hence leading to the flat panel display with thin frame at the light source side.

Abstract: The invention provides an electronic device housing with solar paint and a manufacturing method thereof. Solar-powered paint layers are transferred onto the housing by the IMD technology. Therefore, the housing of the electronic device can generate electric energy via solar power to prolong the operation time of the electronic device and achieve environmental protection and energy conservation effects.

Abstract: In a flat panel display having a first housing and a second housing, features of a frame and a plastic support and a top support, which support, position, and fix each component, are incorporated into the outer top and bottom case, such that no additional structure component is needed for the flat panel display. The first housing has supportive parts and side portions for assembling and supporting each component of the flat panel display and the second housing is then assembled to the first housing for completion of the assembling of the flat panel display.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.