Patents by Inventor Tzyy-Chyi Tsai

Tzyy-Chyi Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9761469
    Abstract: An unloading mechanism for removing workpieces from a transporting film can include a bottom plate, a picking assembly, and a storage assembly. The picking assembly can include a driving member coupled to the bottom plate, a pressing member coupled to the driving member, and a picking member coupled to the pressing member. The pressing member can define a receiving hole along an axis. The picking member can include a connecting rod coupled to the bottom plate, and a suction member coupled to the connecting rod. The suction member can be coupled to the second end and protruding out of the pressing member. The storage assembly can include a base plate configured to support the transporting film, and a pressing plate stacked on the base plate and the transporting film.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: September 12, 2017
    Assignee: ANHUI HONGQING PRECISION MACHINE CO., LTD.
    Inventors: Li-Cai Yuan, Tzyy-Chyi Tsai, Dong-Sheng Lin
  • Publication number: 20150174764
    Abstract: An unloading mechanism for removing workpieces from a transporting film can include a bottom plate, a picking assembly, and a storage assembly. The picking assembly can include a driving member coupled to the bottom plate, a pressing member coupled to the driving member, and a picking member coupled to the pressing member. The pressing member can define a receiving hole along an axis. The picking member can include a connecting rod coupled to the bottom plate, and a suction member coupled to the connecting rod. The suction member can be coupled to the second end and protruding out of the pressing member. The storage assembly can include a base plate configured to support the transporting film, and a pressing plate stacked on the base plate and the transporting film.
    Type: Application
    Filed: December 17, 2014
    Publication date: June 25, 2015
    Inventors: LI-CAI YUAN, TZYY-CHYI TSAI, DONG-SHENG LIN
  • Patent number: 8851134
    Abstract: A vacuum device includes a main body and an adjustment assembly connected to the main body. The main body includes a frame, a loading member, and an elastic film. The loading member and the elastic film are arranged at opposite end surfaces of the frame. A chamber is cooperatively formed by the frame, the loading member, and the elastic film. The adjustment assembly adjusts the inner air pressure of the chamber. The loading member includes an absorption area connecting the chamber to outside the main body. The absorption area changes the air pressure inside the chamber. Also provided is a bonding apparatus using the vacuum device.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: October 7, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Jian-Jun Li
  • Patent number: 8720878
    Abstract: A positioning device includes a base, a supporting member, a fixing member, a first electromagnetic clutch, an engaging member, and at least one guide member. The base defines at least one hole. The supporting member is configured to support a workpiece. The supporting member and the fixing member are at the opposite sides of the base. The first electromagnetic clutch is disposed on a side of the base adjacent to the fixing member. The engaging member configured to be attracted by the first electromagnetic clutch is disposed on a side of the fixing member adjacent to the base and corresponds to the first electromagnetic clutch. An end of the at least one guide member is fixed to the fixing member, and an opposite end of the fixing member passes through the at least one hole and is fixed to the supporting member.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: May 13, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Yun-Qing Jiang
  • Patent number: 8561806
    Abstract: A measurement apparatus includes a support frame to support a feed mechanism, an orientation mechanism, a measurement mechanism, a transfer mechanism, and an unloading mechanism. The feed mechanism includes a first holding assembly, a first elevation assembly, a second elevation assembly, and a first clipping assembly. The first elevation assembly and the second elevation assembly are positioned under the holding assembly, and the first clipping assembly is positioned over the holding assembly. The measurement mechanism includes a support stage and at least one calibration head. The transfer mechanism includes at least one pickup head. The orientation mechanism includes a driving member and a securing assembly driven by the driving member. The unloading mechanism has the same structure as the feed mechanism. The disclosure further provides a measuring method using the measurement apparatus.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: October 22, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Jian-Jun Li
  • Patent number: 8296934
    Abstract: A bonding apparatus includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of first air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. Each of the holding seats defines a plurality of second air holes. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: October 30, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Jia-Jie Chen
  • Patent number: 8291956
    Abstract: A bonding apparatus for bonding a first substrate and a second substrate includes a base body, a first stripping device, a second stripping device, at least two vacuum bonding devices, and a loading mechanism. The first stripping device removes a film from the first substrate, and the second stripping device removes a film from the second substrate. The at least two vacuum bonding devices are arranged on the base body and aligned with each other. The loading mechanism includes a slide-rail on the base body and an adjustment assembly slidably connected to the slide-rail. The loading mechanism transfers a first substrate and a second substrate into one vacuum bonding device, and then, sliding on the slider, transfers another first substrate and another second substrate to another vacuum bonding device.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: October 23, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Jian-Jun Li
  • Patent number: 8256108
    Abstract: A bonding method uses a bonding apparatus, which includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: September 4, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Jia-Jie Chen
  • Publication number: 20120175041
    Abstract: A bonding method uses a bonding apparatus, which includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.
    Type: Application
    Filed: March 22, 2012
    Publication date: July 12, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: DONG-SHENG LIN, TZYY-CHYI TSAI, JIA-JIE CHEN
  • Patent number: 8100267
    Abstract: A sorting device includes a feed mechanism, a plurality of unloading mechanisms, a support mechanism, a measurement mechanism, a marking mechanism, and a plurality of transfer mechanisms. The plurality of transfer mechanisms is between the support mechanism and the feed mechanism or the plurality of unloading mechanisms, the measurement mechanism and the marking mechanism are on one side of the support mechanism and aim at different stations of the support mechanism.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: January 24, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Hai-Xia Zeng, Yun-Qing Jiang
  • Publication number: 20110285068
    Abstract: A positioning device includes a base, a supporting member, a fixing member, a first electromagnetic clutch, an engaging member, and at least one guide member. The base defines at least one hole. The supporting member is configured to support a workpiece. The supporting member and the fixing member are at the opposite sides of the base. The first electromagnetic clutch is disposed on a side of the base adjacent to the fixing member. The engaging member configured to be attracted by the first electromagnetic clutch is disposed on a side of the fixing member adjacent to the base and corresponds to the first electromagnetic clutch. An end of the at least one guide member is fixed to the fixing member, and an opposite end of the fixing member passes through the at least one hole and is fixed to the supporting member.
    Type: Application
    Filed: December 29, 2010
    Publication date: November 24, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: DONG-SHENG LIN, TZYY-CHYI TSAI, YUN-QING JIANG
  • Patent number: 7980284
    Abstract: An vacuum laminator for laminating workpieces includes a grasping assembly, an alignment assembly, a pickup head, and a sealed body. The grasping assembly is configured for grasping one workpiece. The alignment assembly is connected to the grasping assembly for adjusting a position of the workpiece on the grasping assembly. The pickup head is configured for picking up another workpiece. The grasping assembly and pickup head are received in the sealed body opposite to each other. The grasping assembly includes two grasping members grasping and releasing the workpiece.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: July 19, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Zhi-Bin Wang
  • Publication number: 20110017405
    Abstract: A bonding apparatus for bonding a first substrate and a second substrate includes a base body, a first stripping device, a second stripping device, at least two vacuum bonding devices, and a loading mechanism. The first stripping device removes a film from the first substrate, and the second stripping device removes a film from the second substrate. The at least two vacuum bonding devices are arranged on the base body and aligned with each other. The loading mechanism includes a slide-rail on the base body and an adjustment assembly slidably connected to the slide-rail. The loading mechanism transfers a first substrate and a second substrate into one vacuum bonding device, and then, sliding on the slider, transfers another first substrate and another second substrate to another vacuum bonding device.
    Type: Application
    Filed: September 28, 2009
    Publication date: January 27, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Dong-Sheng LIN, Tzyy-Chyi TSAI, Jian-Jun LI
  • Publication number: 20110021105
    Abstract: A vacuum device includes a main body and an adjustment assembly connected to the main body. The main body includes a frame, a loading member, and an elastic film. The loading member and the elastic film are arranged at opposite end surfaces of the frame. A chamber is cooperatively formed by the frame, the loading member, and the elastic film. The adjustment assembly adjusts the inner air pressure of the chamber. The loading member includes an absorption area connecting the chamber to outside the main body. The absorption area changes the air pressure inside the chamber. Also provided is a bonding apparatus using the vacuum device.
    Type: Application
    Filed: September 28, 2009
    Publication date: January 27, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Dong-Sheng LIN, Tzyy-Chyi TSAI, Jian-Jun LI
  • Patent number: 7847217
    Abstract: An exemplary hot-melting method includes the following steps. A hot-melting machine (20) is provided. The hot-melting machine includes a rotatable worktable (23), a heater (25), at least one cooler (26), and a plurality of carriers located on the worktable and being uniformly spaced apart. A first workpiece loaded on a first one of the carriers is cooled using the at least one cooler. Simultaneously, a second workpiece loaded on a second one of the carriers is heated using the heater.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: December 7, 2010
    Assignees: Hon Hai Precision Industry Co., Ltd., Foxsemicon Integrated Technology, Inc.
    Inventors: Shun-Ho Chen, Li-Pei Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang, Chin-Hsien Tsai
  • Publication number: 20100260583
    Abstract: A measurement apparatus includes a support frame to support a feed mechanism, an orientation mechanism, a measurement mechanism, a transfer mechanism, and an unloading mechanism. The feed mechanism includes a first holding assembly, a first elevation assembly, a second elevation assembly, and a first clipping assembly. The first elevation assembly and the second elevation assembly are positioned under the holding assembly, and the first clipping assembly is positioned over the holding assembly. The measurement mechanism includes a support stage and at least one calibration head. The transfer mechanism includes at least one pickup head. The orientation mechanism includes a driving member and a securing assembly driven by the driving member. The unloading mechanism has the same structure as the feed mechanism. The disclosure further provides a measuring method using the measurement apparatus.
    Type: Application
    Filed: October 30, 2009
    Publication date: October 14, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Dong-Sheng LIN, Tzyy-Chyi TSAI, Jian-Jun LI
  • Publication number: 20100256806
    Abstract: A sorting device includes a feed mechanism, a plurality of unloading mechanisms, a support mechanism, a measurement mechanism, a marking mechanism, and a plurality of transfer mechanisms. The plurality of transfer mechanisms is between the support mechanism and the feed mechanism or the plurality of unloading mechanisms, the measurement mechanism and the marking mechanism are on one side of the support mechanism and aim at different stations of the support mechanism.
    Type: Application
    Filed: September 9, 2009
    Publication date: October 7, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: DONG-SHENG LIN, TZYY-CHYI TSAI, HAI-XIA ZENG, YUN-QING JIANG
  • Publication number: 20100243171
    Abstract: An vacuum laminator for laminating workpieces includes a grasping assembly, an alignment assembly, a pickup head, and a sealed body. The grasping assembly is configured for grasping one workpiece. The alignment assembly is connected to the grasping assembly for adjusting a position of the workpiece on the grasping assembly. The pickup head is configured for picking up another workpiece. The grasping assembly and pickup head are received in the sealed body opposite to each other. The grasping assembly includes two grasping members grasping and releasing the workpiece.
    Type: Application
    Filed: August 27, 2009
    Publication date: September 30, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: DONG-SHENG LIN, TZYY-CHYI TSAI, ZHI-BIN WANG
  • Publication number: 20100236058
    Abstract: A bonding apparatus includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. Each of the holding seats defines a plurality of air holes. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.
    Type: Application
    Filed: June 30, 2009
    Publication date: September 23, 2010
    Applicants: HONG FU PRECISION INDUSTRY (ShenZhen) CO.,LTD., HON HAI PRECISION INDUSTRY CO.,LTD.
    Inventors: DONG-SHENG LIN, TZYY-CHYI TSAI, JIA-JIE CHEN
  • Patent number: 7745761
    Abstract: An exemplary hot-melting machine (20) includes a worktable (23), a number of carriers (24), a heater (25), at least one cooler (26), and a controller (28). The carriers are located on the worktable and are uniformly spaced apart. Each carrier is configured for holding a workpiece. The heater is configured for heating the workpiece. The cooler is configured for cooling the workpiece. The controller is configured for driving the worktable to rotate, the heater to move down toward and up away from a corresponding one of the carriers, and the at least one cooler to move down toward and up away from another corresponding one of the carriers. At each of successive stages in operation of the hot-melting machine, one of the carriers is aligned with the heater, another one the carriers is aligned with the at least one cooler, and a further one of the carriers is positioned such that a workpiece can be unloaded from the further one of the carriers and another workpiece can be loaded on the further one of the carriers.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: June 29, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd., Foxsemicon Integrated Technology, Inc.
    Inventors: Shun-Ho Chen, Li-Pei Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang, Chuan-Xiong Tu, Chin-Hsien Tsai