Patents by Inventor Tzyy-Chyi Tsai

Tzyy-Chyi Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080053616
    Abstract: An exemplary hot-melting method includes the following steps. A hot-melting machine (20) is provided. The hot-melting machine includes a rotatable worktable (23), a heater (25), at least one cooler (26), and a plurality of carriers located on the worktable and being uniformly spaced apart. A first workpiece loaded on a first one of the carriers is cooled using the at least one cooler. Simultaneously, a second workpiece loaded on a second one of the carriers is heated using the heater.
    Type: Application
    Filed: December 8, 2006
    Publication date: March 6, 2008
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: Shun-Ho Chen, Li-Pei Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang, Chin-Hsien Tsai
  • Publication number: 20080023148
    Abstract: An exemplary hot-melting machine (20) includes a worktable (23), a number of carriers (24), a heater (25), at least one cooler (26), and a controller (28). The carriers are located on the worktable and are uniformly spaced apart. Each carrier is configured for holding a workpiece. The heater is configured for heating the workpiece. The cooler is configured for cooling the workpiece. The controller is configured for driving the worktable to rotate, the heater to move down toward and up away from a corresponding one of the carriers, and the at least one cooler to move down toward and up away from another corresponding one of the carriers. At each of successive stages in operation of the hot-melting machine, one of the carriers is aligned with the heater, another one the carriers is aligned with the at least one cooler, and a further one of the carriers is positioned such that a workpiece can be unloaded from the further one of the carriers and another workpiece can be loaded on the further one of the carriers.
    Type: Application
    Filed: December 8, 2006
    Publication date: January 31, 2008
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: Shun-Ho Chen, Li-Pie Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang, Chuan-Xiong Tu, Chin-Hsien Tsai
  • Patent number: 7290591
    Abstract: A cooling mold (262) includes a cooling portion (2632), and defines a channel. The cooling portion has a number of intersecting grooves (2636). The channel communicates with at least one of the grooves. The channel and the grooves are configured for gas to flow therethrough to a workpiece at least partly received in the cooling portion.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 6, 2007
    Assignees: Hon Hai Precision Industry Co., Ltd., Foxsemicon Integrated Technology, Inc.
    Inventors: Shun-Ho Chen, Li-Pei Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang