Patents by Inventor Uwe Seidel

Uwe Seidel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10800201
    Abstract: A security object has a document body. A lens array is formed on a top side and first information is stored in the document body. The optical detectability of the first information through the lens array is dependent on a detection direction. The document body has a top view section, in which the document body has a material layer that is translucent or opaque, and adjacent thereto a window section, in which the document body is formed of a material transparent in volume between a top side and a bottom side. The lens array extends over part of the window section and over part of the top view section and spans a section boundary between the sections. The first information also is formed partially in the top view section and partially in the window section and, in the window section, laser-marked, static second information is stored in the document body.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: October 13, 2020
    Assignees: Bundesdruckerei GmbH, Bundesrepublik Deutschland, vertreten durch das Bundesministerium des Innern, vertreten durch das Bundeskriminalamt
    Inventors: Simone Zernicek, Andreas Bosien, Michael Knebel, Andre Leopold, Uwe Seidel, Ulrich Schneider
  • Patent number: 10625317
    Abstract: A method for producing metal strip in a rolling mill, so that as a result of a more accurate manufacturing of metal strips in the future, a more precise forecasting of the profile contour of the metal strip can be obtained over the width of the metal strip, as well as a more precise setting of the profile actuator of the rolling mill. A forecast value is calculated for the profile contour within the context of the simulation of the rolling process before the rolling of the metal strip. In contrast to that, the calculation in the simulation is not conducted prior to the rolling, but instead it is obtained by a post-calculation after the rolling of the metal strip has been carried out.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: April 21, 2020
    Assignee: SMS group GmbH
    Inventors: Jürgen Seidel, Uwe Baumgärtel, Ralf Wachsmann
  • Patent number: 10615029
    Abstract: A method for manufacturing a device includes: providing a semiconductor substrate having an RF-device; providing a BEOL-layer stack on the first main surface of the semiconductor substrate; attaching a carrier structure to a first main surface of the BEOL-layer stack; removing a lateral portion of the semiconductor substrate which laterally adjoins the device region to expose a lateral portion of the second main surface of the BEOL-layer stack; and opening a contacting region of the BEOL-layer stack at the lateral portion of second main surface of the BEOL-layer stack.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: April 7, 2020
    Assignee: Infineon Technologies AG
    Inventors: Christoph Kadow, Uwe Seidel
  • Publication number: 20190293615
    Abstract: A method for tracking a sample identity during a process in an analysis system is disclosed. The analysis system comprises a liquid chromatograph and a mass spectrometer. The method comprises providing a sample, adding a composition of different chemical substances to the sample with a concentration being above a detection level of the mass spectrometer, processing the sample together with the composition with the analysis system, detecting and measuring a component and/or components of the sample with the mass spectrometer, detecting and measuring the composition or parts of the composition of different chemical substances with the mass spectrometer, and identifying the sample based on a detection of a substance detection signal pattern of the mass spectrometer including substance detection signals representing the composition of chemical substances.
    Type: Application
    Filed: June 12, 2019
    Publication date: September 26, 2019
    Applicant: Roche Diagnostics Operations, Inc.
    Inventors: Dieter Heindl, Uwe Kobold, Martin Rempt, Christoph Seidel
  • Publication number: 20190293611
    Abstract: A method for identifying a reagent during a process in an analysis system is disclosed. The analysis system comprises a liquid chromatograph and a mass spectrometer. The method comprises providing a reagent, adding at least one chemical substance to the reagent with a concentration being below a detection level of the mass spectrometer, enriching the chemical substance within the liquid chromatograph to a concentration above the detection level of the mass spectrometer, processing the reagent together with the enriched chemical substance by means of the analysis system, and identifying the reagent based on a detection of a substance detection signal of the mass spectrometer representing the chemical substance.
    Type: Application
    Filed: June 12, 2019
    Publication date: September 26, 2019
    Applicant: Roche Diagnostics Operations, Inc.
    Inventors: Dieter Heindl, Uwe Kobold, Christoph Seidel, Martin Rempt
  • Publication number: 20190293612
    Abstract: A method for identifying a reagent during a process in an analysis system is disclosed. The analysis system comprises a liquid chromatograph and a mass spectrometer. The method comprises providing a reagent, adding at least one chemical substance to the reagent with a concentration being above a detection level of the mass spectrometer, processing the reagent together with the chemical substance with the analysis system, and identifying the reagent based on a detection of a substance detection signal of the mass spectrometer representing the chemical substance.
    Type: Application
    Filed: June 12, 2019
    Publication date: September 26, 2019
    Applicant: Roche Diagnostics Operations, Inc.
    Inventors: Dieter Heindl, Thomas Heinemeyer, Uwe Kobold, Martin Rempt, Christoph Seidel
  • Publication number: 20190283482
    Abstract: A security object has a document body. A lens array is formed on a top side and first information is stored in the document body. The optical detectability of the first information through the lens array is dependent on a detection direction. The document body has a top view section, in which the document body has a material layer that is translucent or opaque, and adjacent thereto a window section, in which the document body is formed of a material transparent in volume between a top side and a bottom side. The lens array extends over part of the window section and over part of the top view section and spans a section boundary between the sections. The first information also is formed partially in the top view section and partially in the window section and, in the window section, laser-marked, static second information is stored in the document body.
    Type: Application
    Filed: March 3, 2017
    Publication date: September 19, 2019
    Applicants: BUNDESDRUCKEREI GMBH, BUNDESREPUBLIK DEUTSCHLAND, VETRETEN DURCH DAS BUNDESMINISTERIUM DES INNERN, VERTR. D. DAS BUNDES
    Inventors: SIMONE ZERNICEK, ANDREAS BOSIEN, MICHAEL KNEBEL, ANDRE LEOPOLD, UWE SEIDEL, ULRICH SCHNEIDER
  • Publication number: 20190043716
    Abstract: A method for manufacturing a device includes: providing a semiconductor substrate having an RF-device; providing a BEOL-layer stack on the first main surface of the semiconductor substrate; attaching a carrier structure to a first main surface of the BEOL-layer stack; removing a lateral portion of the semiconductor substrate which laterally adjoins the device region to expose a lateral portion of the second main surface of the BEOL-layer stack; and opening a contacting region of the BEOL-layer stack at the lateral portion of second main surface of the BEOL-layer stack.
    Type: Application
    Filed: July 24, 2018
    Publication date: February 7, 2019
    Inventors: Christoph Kadow, Uwe Seidel
  • Patent number: 9659877
    Abstract: One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral element for electrically connecting the base element to the cover element in such that a circuit part to be shielded is arranged within the shielding elements. Since at least one partial section of the shielding elements includes a semiconductor material, a shielding device can be realized completely and cost-effectively in an integrated circuit.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: May 23, 2017
    Assignee: Infineon Technologies AG
    Inventors: Winfried Bakalski, Bernd Eisener, Uwe Seidel, Markus Zannoth
  • Patent number: 9165828
    Abstract: A semiconductor device comprises a semiconductor substrate, an anorganic isolation layer on the semiconductor substrate and a metallization layer on the anorganic isolation layer. The metallization layer comprises a fuse structure. At least in an area of the fuse structure the metallization layer and the anorganic isolation layer have a common interface.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: October 20, 2015
    Assignee: Infineon Technologies AG
    Inventors: Gabriele Bettineschi, Uwe Seidel, Wolfgang Walter, Michael Schrenk, Hubert Werthmann
  • Patent number: 9159620
    Abstract: One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a substrate; forming a dielectric layer over the substrate; forming a first opening and a second opening at least partially simultaneously through the dielectric layer over the substrate; and forming a third opening through the bottom surface of the first opening and into at least a portion of the substrate.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: October 13, 2015
    Assignee: Infineon Technologies AG
    Inventors: Gunther Mackh, Uwe Seidel, Rainer Leuschner
  • Publication number: 20150017801
    Abstract: One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a substrate; forming a dielectric layer over the substrate; forming a first opening and a second opening at least partially simultaneously through the dielectric layer over the substrate; and forming a third opening through the bottom surface of the first opening and into at least a portion of the substrate.
    Type: Application
    Filed: September 2, 2014
    Publication date: January 15, 2015
    Inventors: Gunther MACKH, Uwe SEIDEL, Rainer LEUSCHNER
  • Patent number: 8822329
    Abstract: One or more embodiments relate to a method for making a semiconductor structure, the method including: forming a first conductive interconnect at least partially through the substrate; and forming a second conductive interconnect over the substrate, wherein the first conductive interconnect and the second conductive interconnect are formed at least partially simultaneously.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: September 2, 2014
    Assignee: Infineon Technologies AG
    Inventors: Rainer Leuschner, Gunther Mackh, Uwe Seidel
  • Patent number: 8815743
    Abstract: A structure and method of forming through substrate vias in forming semiconductor components are described. In one embodiment, the invention describes a method of forming the through substrate via by filling an opening with a first fill material and depositing a first insulating layer over the first fill material, the first insulating layer not being deposited on sidewalls of the fill material in the opening, wherein sidewalls of the first insulating layer form a gap over the opening. The method further includes forming a void by sealing the opening using a second insulating layer.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 26, 2014
    Assignee: Infineon Technologies AG
    Inventors: Albert Birner, Uwe Hoeckele, Thomas Kunstmann, Uwe Seidel
  • Publication number: 20140127895
    Abstract: A semiconductor device comprises a semiconductor substrate, an anorganic isolation layer on the semiconductor substrate and a metallization layer on the anorganic isolation layer. The metallization layer comprises a fuse structure. At least in an area of the fuse structure the metallization layer and the anorganic isolation layer have a common interface.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Gabriele Bettineschi, Uwe Seidel, Wolfgang Walter, Michael Schrenk, Hubert Werthmann
  • Patent number: 8697574
    Abstract: Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: April 15, 2014
    Assignee: Infineon Technologies AG
    Inventors: Gunther Mackh, Uwe Seidel, Rainer Leuschner
  • Patent number: 8659118
    Abstract: A semiconductor device comprises a semiconductor substrate, an anorganic isolation layer on the semiconductor substrate and a metallization layer on the anorganic isolation layer. The metallization layer comprises a fuse structure. At least in an area of the fuse structure the metallization layer and the anorganic isolation layer have a common interface.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: February 25, 2014
    Assignee: Infineon Technologies AG
    Inventors: Gabriele Bettineschi, Uwe Seidel, Wolfgang Walter, Michael Schrenk, Hubert Werthmann
  • Publication number: 20130328178
    Abstract: One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral element for electrically connecting the base element to the cover element in such that a circuit part to be shielded is arranged within the shielding elements. Since at least one partial section of the shielding elements includes a semiconductor material, a shielding device can be realized completely and cost-effectively in an integrated circuit.
    Type: Application
    Filed: August 15, 2013
    Publication date: December 12, 2013
    Applicant: Infineon Technologies AG
    Inventors: Winfried Bakalski, Bernd Eisener, Uwe Seidel, Markus Zannoth
  • Publication number: 20130267093
    Abstract: A structure and method of forming through substrate vias in forming semiconductor components are described. In one embodiment, the invention describes a method of forming the through substrate via by filling an opening with a first fill material and depositing a first insulating layer over the first fill material, the first insulating layer not being deposited on sidewalls of the fill material in the opening, wherein sidewalls of the first insulating layer form a gap over the opening. The method further includes forming a void by sealing the opening using a second insulating layer.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 10, 2013
    Inventors: Albert Birner, Uwe Hoeckele, Thomas Kunstmann, Uwe Seidel
  • Patent number: 8513782
    Abstract: One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral element for electrically connecting the base element to the cover element in such that a circuit part to be shielded is arranged within the shielding elements. Since at least one partial section of the shielding elements includes a semiconductor material, a shielding device can be realized completely and cost-effectively in an integrated circuit.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: August 20, 2013
    Assignee: Infineon Technologies AG
    Inventors: Winfried Bakalski, Bernd Eisener, Uwe Seidel, Markus Zannoth