Abstract: Process for the moderately refractory assembly of at least two articles made of silicon carbide-based materials by non-reactive brazing in an oxidizing atmosphere, in which the articles are placed in contact with a non-reactive brazing composition and the assembly formed by the articles and the brazing composition is heated in an oxidizing atmosphere at a brazing temperature sufficient to melt the brazing composition so as to form a moderately refractory joint, wherein the non-reactive brazing composition is a composition A composed of silica (SiO2), alumina (Al2O3) and calcium oxide (CaO), or alternatively a composition B composed of alumina (Al2O3), calcium oxide (Cao) and magnesium oxide (MgO). Brazing suspension, paste comprising a powder of said brazing composition and an organic binder. Refractory joint and assembly.

Abstract: The invention relates to a method for assembling at least one part made of a porous carbon material with at least one part made of a copper-rich metal material, and to an alloy paste used to implement same. The method according to the invention includes a step comprising the use of an alloy based on copper and silicon, having formula I CuxSiy, wherein x and y are atomic percentages with 25?x?60, 40?y?75 and x+y?95%, in order to assemble at least one part made of a porous carbon material with at least one part made of a copper-rich metal material. The invention is particularly suitable for use in the field of thermal engineering.

Abstract: An assembly between a metal piece and a ceramic material piece made of SiC and/or C based ceramic material. The assembly includes a stack structure including the following elements assembled together in pairs in this order, by brazing: the metal piece; a first intermediate piece; a second intermediate piece; and the ceramic material piece. The second intermediate piece is made of another ceramic material, that is chemically less reactive relative to metals than are SiC or C, and that presents a coefficient of expansion smaller than that of the material constituting the metal piece. The first intermediate piece is made of metal and can deform to compensate for expansion difference between the metal piece and the second intermediate piece. The assembly can be used in a turbomachine.

Abstract: The invention relates to a process for the metallization with a silicon alloy melting at a temperature T1 of certain zones of the surface of a part made of an oxide ceramic unable to be wetted by the said alloy, the said process comprising, in succession, a step of depositing carbon on the said zones of the said part that are to be metallized, a step of depositing the silicon alloy in solid form on at least one portion of the said part, so that the said alloy has at least one point of contact with the said zones to be metallized, followed by a heating step at a temperature greater than or equal to T1, the said alloy gathering in the molten state on the said zones to be metallized. This process applies also to the brazing of parts, at least one of which is a part made of an oxide ceramic unable to be wetted by the said alloy. Application of the said processes to the fields of electronics, electrical engineering, thermal engineering and chemical engineering.

Abstract: The invention relates to a process for the metallization with a silicon alloy melting at a temperature T1 of certain zones of the surface of a part made of an oxide ceramic unable to be wetted by the said alloy, the said process comprising, in succession, a step of depositing carbon on the said zones of the said part that are to be metallized, a step of depositing the silicon alloy in solid form on at least one portion of the said part, so that the said alloy has at least one point of contact with the said zones to be metallized, followed by a heating step at a temperature greater than or equal to T1, the said alloy gathering in the molten state on the said zones to be metallized. This process applies also to the brazing of parts, at least one of which is a part made of an oxide ceramic unable to be wetted by the said alloy. Application of the said processes to the fields of electronics, electrical engineering, thermal engineering and chemical engineering.