Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract: The water-resistant zipper includes first and second profiles which are interlocked or separated by the movement of a slider. A triangular island and separating plow are formed at the opening end to separate the first and second profiles. The slider includes various channels which engage corresponding rails in the profiles in order to properly position the profiles.

Abstract: The water-resistant zipper includes first and second profiles which are interlocked or separated by the movement of a slider. A triangular island and separating plow are formed at the opening end to separate the first and second profiles. The slider includes various channels which engage corresponding rails in the profiles in order to properly position the profiles.

Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract: The water-resistant or waterproof zipper includes first and second profiles which are interlocked or separated by the movement of a slider. The first sidewall of the slider is generally planar while the second sidewall is generally curved so that the sidewalls are relatively closer together at the closing end and generally further apart at the opening end. A triangular island and separating plow are formed at the opening end to separate the first and second profiles. The slider includes various channels which engage corresponding rails in the profiles in order to properly position the profiles. The slider further includes various protrusions and a flange to properly position the profiles.

Abstract: The semiconductor wafer containment device or wafer box includes a base with a planar floor and a double concentric cylindrical wall structure arising therefrom. The double concentric cylindrical wall structure includes slots through which latch elements pivot radially. The latch elements include an inward padded spacer element. The latch elements pivot between an outward position wherein the padded spacer elements are relatively away from the wafer containment space and an inward upright position wherein the padded spacer elements impinge into the wafer containment space and are urged against the semiconductor wafers therein. Ramps on the lid capture the latch elements in the outward position and urge the latch elements to pivot to the inward upright position and be detent engaged in this position by slots formed on the lid.

Abstract: The wafer box includes a tray (10) and a cover (62). The tray (10) includes an inner (34, 36, 38, 40) and outer (24, 26, 28, 30) wall configuration with horizontal semicircular channels (48, 50, 52, 54) therebetween to perform spacing, strengthening and horizontal shock-absorbing functions. The tray (10) further includes a wafer cavity (42) formed within the inner wall (34, 36, 38, 40). The wafer cavity (42) includes a lattice (46) of ridges on the floor thereof to provide a vertical shock absorbing function. The wall (76, 78, 80, 82) of the cover (62) engages and mates to the outer wall (24, 26, 28, 30) of the tray (10) thereby forming a double wall configuration. A pedestal configuration (90, 92) is formed on the corners and mid-spans of the top of the cover (62) to provide standoff clearance between the inter-stacked boxes to minimize or eliminate the transmission of shock and vibration through an inter-stack configuration.

Abstract: The water-resistant or waterproof zipper includes first and second profiles which are interlocked or separated by the movement of a slider. The first sidewall of the slider is generally planar while the second sidewall is generally curved so that the sidewalls are relatively closer together at the closing end and generally further apart at the opening end. A triangular island and separating plow are formed at the opening end to separate the first and second profiles. The slider includes various channels which engage corresponding rails in the profiles in order to properly position the profiles. The slider further includes various protrusions and a flange to properly position the profiles.

Abstract: The present disclosure pertains to a wafer box for transporting semiconductor wafers, typically in a coin stack configuration. The wafer box includes an outer box and at least one inner box. The semiconductor wafers are placed in the inner box or boxes, typically with appropriate separators and interleaves. The outer box includes a tray portion and a lid portion. The tray portion includes posts rising from its floor which are received by sleeves in the inner box. Shock absorbing rings are placed on the posts both above and below the inner box or boxes in order to provide protection against vertical shocks. Moreover, the outer box includes radially pivoting latching elements with padded bumper elements. These padded bumper elements are brought to an upright position to urge against the inner box or boxes in order to provide horizontal or lateral shock protection.

Abstract: A stacking tray for electrical components, such as integrated circuit chips, particularly those of the ball grid array (BGA) type is disclosed. The tray is stackable and includes an upper side and a lower side. An array of storage pockets is formed between the upper side of a lower tray and the lower side of an upper tray. The storage pockets are separated by complementary support elements and further include a segmented pedestal arising from the center of the storage pocket, on the upper side of the trays. The segmented pedestal supports the integrated circuit chip, without interfering with the spherical balls. Moreover, the tray allows for variation of the dimensions of the integrated circuit chip while adequately stabilizing the chip.

Abstract: An adjustable height wafer box for the transportation of coin-stacked semiconductor wafers is disclosed. The adjustable height wafer box comprises a base plate, a cover plate, a plurality of ring insert plates and elastomer bumpers. The ring insert plates are stacked so as to successively engage one another, as well as engaging the base plate and the cover plate. The elastomer bumpers are engaged between successive ring insert plates and extend inwardly into the wafer containment space. The number of ring insert plates can be chosen to adjust the height of the wafer box in accordance with the number of coin-stacked semiconductor wafers to be shipped.

Abstract: The semiconductor wafer containment device or wafer box includes a base with a planar floor and a cylindrical wall arising therefrom. A double concentric wall structure includes slots which receive body chip wafer pins which extend into the space formed between the inner cylindrical wall and the wafer so as to cushion the semiconductor wafers and prevent movement of the semiconductor wafers during transportation. Alternately, a single cylindrical wall includes slots which receive extruded finned pins which include fins which extend inward into the space formed within the cylindrical wall so as to cushion the semiconductor wafers and prevent movement of the semiconductor wafers during transportation. The semiconductor wafer containment device or wafer box further includes a lid which is engaged by the base thereby capturing the extruded finned pins during transportation.

Abstract: A separator of semiconductor wafers is made from polyethylene with a dissipative material and includes a first and second set of embossed cut perpendicular lines. The first set is typically parallel to the second set, and each set includes pairs of cut lines which are spaced from adjacent pairs. The depth of grid lines cut into the material allows air flow, circulation and vacuum release.

Abstract: A stacking tray for electrical components, such as integrated circuits, particularly those of the ball grid array (BGA type) includes an upper side and a lower side. The upper side includes corner elements of a greater height, the inner intersections of which define the periphery of the storage pockets for the electrical components. These corner elements therefore capture and support the electrical component in directions parallel to the floor of the tray. The upper side further includes lateral elements of a lesser height which extend across the periphery of the storage pocket thereby creating a ledge for capturing and supporting the electrical component in the direction perpendicular to the floor. The lower side includes lateral elements of a greater height with inner edges which abut the periphery of the storage pockets thereby capturing and supporting the electrical components in directions parallel to the floor of the tray.

Abstract: The semiconductor wafer containment device or wafer box includes a base with a planar floor and a cylindrical wall arising therefrom. A double concentric wall structure includes slots which receive body chip wafer pins which extend into the space formed between the inner cylindrical wall and the wafer so as to cushion the semiconductor wafers and prevent movement of the semiconductor wafers during transportation. Alternately, a single cylindrical wall includes slots which receive extruded finned pins which include fins which extend inward into the space formed within the cylindrical wall so as to cushion the semiconductor wafers and prevent movement of the semiconductor wafers during transportation. The semiconductor wafer containment device or wafer box further includes a lid which is engaged by the base thereby capturing the extruded finned pins during transportation.

Abstract: A stacking tray for electrical components, such as integrated circuits, particularly those of the ball grid array (BGA type) includes an upper side and a lower side. The upper side includes corner elements of a greater height, the inner intersections of which define the periphery of the storage pockets for the electrical components. These corner elements therefore capture and support the electrical component in directions parallel to the floor of the tray. The upper side further includes lateral elements of a lesser height which extend across the periphery of the storage pocket thereby creating a ledge for capturing and supporting the electrical component in the direction perpendicular to the floor. The lower side includes lateral elements of a greater height with inner edges which abut the periphery of the storage pockets thereby capturing and supporting the electrical components in directions parallel to the floor of the tray.