Abstract: A fluid dispense system having a coating layer applied to the fluid flow path and the external surfaces is described. The coating layer is chemically resistant to the working fluids of the fluid dispense system and prevents the leaching of a plurality of ions from the fluid dispense system.

Abstract: A fluid for dispensation on a substrate. In one implementation, the fluid comprises a set of fluid parameters to facilitate dispensation of the fluid from the system. In another implementation, the fluid comprises a set of fluid parameters specific to a polymerizable material.

Abstract: A drop dispense apparatus may be manufactured utilizing an imprint lithography process. Exemplary methods for manufacturing a drop dispense apparatus are described.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.