Patents by Inventor Vasav Sahni

Vasav Sahni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200384677
    Abstract: Coextruded polymeric article (100, 200) comprising first and second opposed major surfaces (111, 211), wherein a plurality of projections (114, 117, 214, 214, 217) extend from only the first major surface (111, 112, 211, 212), wherein each projection (214) has at least first and second opposed sides (218) and a height from the first major surface (111, 112, 211, 212) to a distal end (116, 216), wherein at least a majority by number of the projections (114, 117, 214, 214, 217) have a protrusion (117, 217) extending from It only the first side (118, 218) and extending in one direction not more than to the first major surface (111, 112, 211, 212) and extending in an opposite direction to less than the height of the respective projection (214), wherein the projections (114, 117, 214, 214, 217) extend to the second major surface (111, 112, 211, 212), wherein there are regions (119, 120, 220) extending from the first and second major surfaces (111, 211) that are between projections (114, 117, 214, 214, 217), wherei
    Type: Application
    Filed: January 14, 2019
    Publication date: December 10, 2020
    Inventors: Ronald W. Ausen, Thomas P. Hanschen, William J. Kopecky, Vasav Sahni, Ramasubramani` Kuduva Raman Thanumoorthy
  • Publication number: 20200095476
    Abstract: In one embodiment, an adhesive composition is described comprising a polyisobutylene polymer component, a styrene-isobutylene block copolymer, and optionally a tackifier. The polyisobutylene polymer component comprises one or more polyisobutylene polymers. The polyisobutylene polymer component has an average weight average molecular weight ranging from 15,000 g/mole to 300,000 g/mole. The weight ratio of block copolymer to polyisobutylene polymer of the adhesive composition is greater than 2.2:1. In some embodiments, the adhesive composition is a pressure sensitive adhesive.
    Type: Application
    Filed: March 26, 2018
    Publication date: March 26, 2020
    Inventors: Vasav Sahni, Jason D. Clapper, Jacob P. Johnson, Ying Zhang
  • Publication number: 20200048511
    Abstract: The present invention is an adhesive composition for use in passivating metallic conductors in an electronic device including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower, at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher, and optionally, at least one tackifier. Each of the polyisobutylenes and the optional tackifier has a halogen ion content of no more than 1 ppm.
    Type: Application
    Filed: February 12, 2018
    Publication date: February 13, 2020
    Inventors: Ying Zhang, Vasav Sahni, Albert I. Everaerts
  • Publication number: 20190375967
    Abstract: The present invention is an adhesive composition including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower, at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher, and optionally, at least one tackifier.
    Type: Application
    Filed: February 14, 2018
    Publication date: December 12, 2019
    Inventors: Ying Zhang, Vasav Sahni, Albert I. Everaerts, Jason D. Clapper, Jianhui Xia
  • Publication number: 20190352790
    Abstract: A tape includes: a flexible backing layer having two major surfaces, wherein the backing layer has a thickness of greater than 64 micrometers and up to 200 micrometers, and one major surface of the backing layer includes a primed surface; and a rubber-based pressure sensitive adhesive layer disposed on the primed surface of the backing layer, wherein the pressure sensitive adhesive layer has a thickness of at least 7.6 micrometers (and preferably up to 25 micrometers); wherein, when disposed on an aluminum substrate, the tape displays a peel adhesion of less than 20 oz/in (219 N/m) according to a Peel Adhesion Strength Test described in the Examples Section, and a leakage distance of less than 762 micrometers according to a Chromic Acid Anodization—Leakage Distance Test described in the Examples Section.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 21, 2019
    Inventors: Sarang V. Deodhar, James J. Kobe, Meredith A. Opatz, Vasav Sahni, Daniel C. Munson
  • Publication number: 20190300634
    Abstract: Dust suppression compositions include at least one cationic or zwitterionic (meth)acrylate-based copolymer and at least one solvent, where the solvent can be water, an aqueous mixture, or one or more non-water solvents. The dust suppression composition can also include a plasticizer, generally glycerol. The dust suppression compositions are suitable for use with sand mixtures, especially silica sand mixtures.
    Type: Application
    Filed: May 16, 2017
    Publication date: October 3, 2019
    Inventors: Susannah C. Clear, Mahfuza B. Ali, Vasav Sahni
  • Patent number: 9827709
    Abstract: The present invention is directed to synthetic attachment discs made from adhesive nanofibers and/or microfibers that are capable of attaching long fibers to a wide variety of surfaces, and related methods for forming and using them. The synthetic attachment discs of the present invention use very little material relative to prior art systems, while producing a very strong attachment force. Experimental and theoretical evidence are provided to confirm the advantages of thousands of micron-size ‘staple-pins’ and their low peeling angles to enhance the adhesive forces required to peel the synthetic attachment discs. The present invention provides a unique strategy for designing new adhesives that use very little material for various biomedical and material science applications.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: November 28, 2017
    Assignee: The University of Akron
    Inventors: Ali Dhinojwala, Vasav Sahni, Dharamdeep Jain
  • Publication number: 20150328831
    Abstract: The present invention is directed to synthetic attachment discs made from adhesive nanofibers and/or microfibers that are capable of attaching long fibers to a wide variety of surfaces, and related methods for forming and using them. The synthetic attachment discs of the present invention use very little material relative to prior art systems, while producing a very strong attachment force. Experimental and theoretical evidence are provided to confirm the advantages of thousands of micron-size ‘staple-pins’ and their low peeling angles to enhance the adhesive forces required to peel the synthetic attachment discs. The present invention provides a unique strategy for designing new adhesives that use very little material for various biomedical and material science applications.
    Type: Application
    Filed: December 23, 2013
    Publication date: November 19, 2015
    Applicant: THE UNIVERSITY OF AKRON
    Inventors: Ali DHINOJWALA, Vasav SAHNI, Dharamdeep JAIN
  • Publication number: 20140302249
    Abstract: A method of preparing a fiber with periodically spaced beads includes the steps of: coating a base fiber with a settable coating; thereafter allowing the settable coating to form periodically spaced beads on the base fiber; and stabilizing the periodically spaced beads into periodically spaced beads thus creating a fiber with beads-on-a-string morphology.
    Type: Application
    Filed: August 31, 2012
    Publication date: October 9, 2014
    Applicant: THE UNIVERSITY OF AKRON
    Inventors: Ali Dhinojwala, Vasav Sahni, Disha Vinod Labhasetwar