Patents by Inventor Veeraraghavan Basker

Veeraraghavan Basker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200020575
    Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above at least an active region, wherein the gate structure has an axial length in a direction corresponding to a gate width direction of the transistor device. In this example, a first portion of the axial length of the gate structure has a first upper surface and a second portion of the axial length of the gate structure has a second upper surface, wherein the first upper surface is positioned at a level that is above a level of the second upper surface. The device also includes a gate contact structure that contacts the first upper surface of the gate structure.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Ruilong Xie, Lars W. Liebmann, Balasubramanian Pranatharthi Haran, Veeraraghavan Basker
  • Patent number: 10522639
    Abstract: At least one method, apparatus and system disclosed herein involves forming trench in a gate region, wherein the trench having an oxide layer to a height to reduce or prevent process residue. A plurality of fins are formed on a semiconductor substrate. Over a first portion of the fins, an epitaxial (EPI) feature at a top portion of each fin of the first portion. Over a second portion of the fins, a gate region is formed. In a portion of the gate region, a trench is formed. A first oxide layer at a bottom region of the trench is formed. Prior to performing an amorphous-silicon (a-Si) deposition, a flowable oxide material is deposited into the trench for forming a second oxide layer. The second oxide layer comprises the flowable oxide and the first oxide layer. The second oxide layer has a first height.
    Type: Grant
    Filed: June 29, 2019
    Date of Patent: December 31, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hui Zang, Daniel Jaeger, Haigou Huang, Veeraraghavan Basker, Christopher Nassar, Jinsheng Gao, Michael Aquilino
  • Patent number: 10497612
    Abstract: One illustrative method disclosed includes, among other things, forming at least one layer of sacrificial material above an underlying conductive structure, forming a sacrificial contact structure in the at least one layer of sacrificial material and forming at least one layer of insulating material around the sacrificial contact structure. In this example, the method also includes performing at least one process operation to expose an upper surface of the sacrificial contact structure, removing the sacrificial contact structure so as to form a contact opening that exposes the upper surface of the underlying conductive structure and forming a final contact structure in the contact opening, the final contact structure conductively contacting the underlying conductive structure.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: December 3, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Ruilong Xie, Lars W. Liebmann, Balasubramanian Pranatharthi Haran, Veeraraghavan Basker
  • Patent number: 10497629
    Abstract: A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: December 3, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Publication number: 20190326408
    Abstract: At least one method, apparatus and system disclosed herein involves forming trench in a gate region, wherein the trench having an oxide layer to a height to reduce or prevent process residue. A plurality of fins are formed on a semiconductor substrate. Over a first portion of the fins, an epitaxial (EPI) feature at a top portion of each fin of the first portion. Over a second portion of the fins, a gate region is formed. In a portion of the gate region, a trench is formed. A first oxide layer at a bottom region of the trench is formed. Prior to performing an amorphous-silicon (a-Si) deposition, a flowable oxide material is deposited into the trench for forming a second oxide layer. The second oxide layer comprises the flowable oxide and the first oxide layer. The second oxide layer has a first height.
    Type: Application
    Filed: June 29, 2019
    Publication date: October 24, 2019
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Hui Zang, Daniel Jaeger, Haigou Huang, Veeraraghavan Basker, Christopher Nassar, Jinsheng Gao, Michael Aquilino
  • Patent number: 10418455
    Abstract: At least one method, apparatus and system disclosed herein involves forming trench in a gate region, wherein the trench having an oxide layer to a height to reduce or prevent process residue. A plurality of fins are formed on a semiconductor substrate. Over a first portion of the fins, an epitaxial (EPI) feature at a top portion of each fin of the first portion. Over a second portion of the fins, a gate region is formed. In a portion of the gate region, a trench is formed. A first oxide layer at a bottom region of the trench is formed. Prior to performing an amorphous-silicon (a-Si) deposition, a flowable oxide material is deposited into the trench for forming a second oxide layer. The second oxide layer comprises the flowable oxide and the first oxide layer. The second oxide layer has a first height.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: September 17, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hui Zang, Daniel Jaeger, Haigou Huang, Veeraraghavan Basker, Christopher Nassar, Jinsheng Gao, Michael Aquilino
  • Publication number: 20190181042
    Abstract: One illustrative method disclosed includes, among other things, forming at least one layer of sacrificial material above an underlying conductive structure, forming a sacrificial contact structure in the at least one layer of sacrificial material and forming at least one layer of insulating material around the sacrificial contact structure. In this example, the method also includes performing at least one process operation to expose an upper surface of the sacrificial contact structure, removing the sacrificial contact structure so as to form a contact opening that exposes the upper surface of the underlying conductive structure and forming a final contact structure in the contact opening, the final contact structure conductively contacting the underlying conductive structure.
    Type: Application
    Filed: December 11, 2017
    Publication date: June 13, 2019
    Inventors: Ruilong Xie, Lars W. Liebmann, Balasubramanian Pranatharthi Haran, Veeraraghavan Basker
  • Publication number: 20190097015
    Abstract: At least one method, apparatus and system disclosed herein involves forming trench in a gate region, wherein the trench having an oxide layer to a height to reduce or prevent process residue. A plurality of fins are formed on a semiconductor substrate. Over a first portion of the fins, an epitaxial (EPI) feature at a top portion of each fin of the first portion. Over a second portion of the fins, a gate region is formed. In a portion of the gate region, a trench is formed. A first oxide layer at a bottom region of the trench is formed. Prior to performing an amorphous-silicon (a-Si) deposition, a flowable oxide material is deposited into the trench for forming a second oxide layer. The second oxide layer comprises the flowable oxide and the first oxide layer. The second oxide layer has a first height.
    Type: Application
    Filed: September 26, 2017
    Publication date: March 28, 2019
    Applicant: GLOBALFOUDRIES INC.
    Inventors: Hui Zang, Daniel Jaeger, Haigou Huang, Veeraraghavan Basker, Christopher Nassar, Jinsheng Gao, Michael Aquilino
  • Publication number: 20180047637
    Abstract: A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.
    Type: Application
    Filed: October 27, 2017
    Publication date: February 15, 2018
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Patent number: 9805987
    Abstract: A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: October 31, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Patent number: 9627278
    Abstract: A method of forming field effect transistors (FETs), and forming integrated circuit (IC) chip including the FETs. Gates are formed on said semiconductor fins to define multi fin field effect transistors (FinFETs). Dielectric sidewalls on fins protect the sidewalls while the surface is damaged intentionally, e.g., with an implant that leaves source/drain junctions undisturbed. After removing the dielectric sidewalls semiconductor material is grown epitaxially on the sidewalls with the damage retarding growth on the surface. The epi-growth bridges between fins in the same FET. After the damage is repaired, chip processing continues normally.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: April 18, 2017
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Ali Khakifirooz
  • Publication number: 20170076993
    Abstract: A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.
    Type: Application
    Filed: November 2, 2016
    Publication date: March 16, 2017
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Publication number: 20170069549
    Abstract: A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.
    Type: Application
    Filed: September 4, 2015
    Publication date: March 9, 2017
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Patent number: 9559014
    Abstract: A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: January 31, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Publication number: 20160372383
    Abstract: A method of forming field effect transistors (FETs), and forming integrated circuit (IC) chip including the FETs. Gates are formed on said semiconductor fins to define multi fin field effect transistors (FinFETs). Dielectric sidewalls on fins protect the sidewalls while the surface is damaged intentionally, e.g., with an implant that leaves source/drain junctions undisturbed. After removing the dielectric sidewalls semiconductor material is grown epitaxially on the sidewalls with the damage retarding growth on the surface. The epi-growth bridges between fins in the same FET. After the damage is repaired, chip processing continues normally.
    Type: Application
    Filed: June 16, 2015
    Publication date: December 22, 2016
    Applicant: International Business Machines Corporation
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Ali Khakifirooz
  • Patent number: 9379025
    Abstract: A method of forming field effect transistors (FETs), and forming integrated circuit (IC) chip including the FETs. After forming replacement metal gate (RMG) FinFETs on a surface layer of a silicon on insulator (SOI) wafer, and growing unmerged epitaxially (epi) on the fins, the epi is capped with dielectric and an inter-level dielectric (ILD) layer is formed on the SOI wafer. The said ILD layer is patterned to an upper surface of the epi above encased fins in a timed etch. Then, etching, preferably with an etchant selective to silicon, the epi is opened to, and into, the fins. The resulting orifices are filled with conductive material to form source drain contacts.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: June 28, 2016
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Ali Khakifirooz
  • Patent number: 9373618
    Abstract: A technique relates to forming a semiconductor device. A field-effect transistor structure having a substrate, a fin structure patterned in the substrate, a gate stack structure, and an insulator layer is first provided. A non-capacitor region and a capacitor region are then formed on the field-effect transistor structure by masking portions of the field-effect transistor structure with a mask such that a non-capacitor region is masked and a capacitor region is exposed, and etching the insulator layer to further recess the fin structure and gate stack structure within the capacitor region such that a revealed height of the fins within the capacitor region is increased relative to the revealed height of the fins in the non-capacitor region. A high-k layer can be deposited over the recessed fins and gate stack structures and a gate metal can fill the recessed portions therein.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: June 21, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Patent number: 9337254
    Abstract: A technique relates to forming a semiconductor device. A field-effect transistor structure having a substrate, a fin structure patterned in the substrate, a gate stack structure, and an insulator layer is first provided. A non-capacitor region and a capacitor region are then formed on the field-effect transistor structure by masking portions of the field-effect transistor structure with a mask such that a non-capacitor region is masked and a capacitor region is exposed, and etching the insulator layer to further recess the fin structure and gate stack structure within the capacitor region such that a revealed height of the fins within the capacitor region is increased relative to the revealed height of the fins in the non-capacitor region. A high-k layer can be deposited over the recessed fins and gate stack structures and a gate metal can fill the recessed portions therein.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: May 10, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Veeraraghavan Basker, Kangguo Cheng, Theodorus Standaert, Junli Wang
  • Patent number: 9324842
    Abstract: A method for fabricating a finfet with a buried local interconnect and the resulting device are disclosed. Embodiments include forming a silicon fin on a BOX layer, forming a gate electrode perpendicular to the silicon fin over a portion of the silicon fin, forming a spacer on each of opposite sides of the gate electrode, forming source/drain regions on the silicon fin at opposite sides of the gate electrode, recessing the BOX layer, undercutting the silicon fin and source/drain regions, at opposite sides of the gate electrode, and forming a local interconnect on a recessed portion of the BOX layer.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: April 26, 2016
    Assignees: GLOBALFOUNDRIES INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hui Zang, Chun-chen Yeh, Tenko Yamashita, Veeraraghavan Basker
  • Publication number: 20150179766
    Abstract: A method for fabricating a finfet with a buried local interconnect and the resulting device are disclosed. Embodiments include forming a silicon fin on a BOX layer, forming a gate electrode perpendicular to the silicon fin over a portion of the silicon fin, forming a spacer on each of opposite sides of the gate electrode, forming source/drain regions on the silicon fin at opposite sides of the gate electrode, recessing the BOX layer, undercutting the silicon fin and source/drain regions, at opposite sides of the gate electrode, and forming a local interconnect on a recessed portion of the BOX layer.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Inventors: Hui ZANG, Chun-chen YEH, Tenko YAMASHITA, Veeraraghavan BASKER