Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: A method of forming a transistor is described. In one embodiment the method includes: forming a channel of a transistor in a surface of a substrate; forming a dielectric stack including a first oxide layer overlying the surface of the substrate, a middle layer comprising nitride overlying the first oxide layer and a second oxide layer overlying the middle layer; forming over the dielectric stack a mask exposing source and drain (S/D) regions of the transistor; etching the dielectric stack through the mask to thin the dielectric stack by removing the second oxide layer and at least a first portion of the middle layer in S/D regions of the transistor; and implanting dopants into S/D regions of the transistor through the thinned dielectric stack to form a lightly-doped drain (LDD) adjacent to the channel of the transistor. Other embodiments are also described.

Abstract: Systems, methods, and apparatus are disclosed for implementing memory cells having common source lines. The methods may include receiving a first voltage at a first transistor. The first transistor may be coupled to a second transistor and included in a first memory cell. The methods include receiving a second voltage at a third transistor. The third transistor may be coupled to a fourth transistor and included in a second memory cell. The first and second memory cells may be coupled to a common source line. The methods include receiving a third voltage at a gate of the second transistor and a gate of the fourth transistor that may cause them to operate in cutoff mode. The methods may include receiving a fourth voltage at a gate of the first transistor. The fourth voltage may cause, via Fowler-Nordheim tunneling, a change in a charge storage layer included in the first transistor.

Abstract: A circuit including both drain-extended metal-oxide-semiconductor (DEMOS) and low-voltage metal-oxide-semiconductor (LV_MOS) devices and methods of manufacturing the same are provided. In one embodiment, DEMOS device includes a first channel, a gate, a second channel, and a drain extension, wherein the second channel is split into a first portion and a second portion, and wherein the first portion of the second channel stops under the gate and is spaced away from the drain extension. Other embodiments are also described.

Abstract: Methods of integrating complementary SONOS devices into a CMOS process flow are described. In one embodiment, the method begins with depositing a hardmask (HM) over a substrate including a first-SONOS region and a second-SONOS region. A first tunnel mask (TUNM) is formed over the HM exposing a first portion of the HM in the second-SONOS region. The first portion of the HM is etched, a channel for a first SONOS device implanted through a first pad oxide overlying the second-SONOS region and the first TUNM removed. A second TUNM is formed exposing a second portion of the HM in the first-SONOS region. The second portion of the HM is etched, a channel for a second SONOS device implanted through a second pad oxide overlying the first-SONOS region and the second TUNM removed. The first and second pad oxides are concurrently etched, and the HM removed.

Abstract: A memory structure including a memory array of a plurality of memory cells arranged in rows and columns, the plurality of memory cells including a pair of adjacent memory cells in a row of the memory array, wherein the pair of adjacent memory cells include a single, shared source-line through which each of the memory cells in the pair of adjacent memory cells is coupled to a voltage source. Methods of operating a memory including the memory structure are also described.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: A memory device that includes a non-volatile memory (NVM) transistor which has an indium doped channel and a gate stack overlying the channel formed in a first region of a substrate and a metal-oxide-semiconductor (MOS) transistor formed in a second region of the substrate in which the gate oxide of the MOS and the oxide layer of the NVM transistor are formed concurrently.

Abstract: Systems, methods, and apparatus are disclosed for implementing memory cells having common source lines. The methods may include receiving a first voltage at a first transistor. The first transistor may be coupled to a second transistor and included in a first memory cell. The methods include receiving a second voltage at a third transistor. The third transistor may be coupled to a fourth transistor and included in a second memory cell. The first and second memory cells may be coupled to a common source line. The methods include receiving a third voltage at a gate of the second transistor and a gate of the fourth transistor that may cause them to operate in cutoff mode. The methods may include receiving a fourth voltage at a gate of the first transistor. The fourth voltage may cause, via Fowler-Nordheim tunneling, a change in a charge storage layer included in the first transistor.

Abstract: A latch circuit and method includes providing a first tri-gate non-volatile device, providing a second tri-gate non-volatile device, coupling the first tri-gate non-volatile device to the second tri-gate non-volatile device, erasing the first tri-gate non-volatile device, programming the second tri-gate non-volatile device, and latching an output node of the latch device to a logic state determined by respective thresholds of the first and second tri-gate non-volatile devices. Coupling the first tri-gate non-volatile device to the second tri-gate non-volatile device can include direct coupling, or indirect coupling through a cross-coupled circuit.

Abstract: Methods of forming memory cells including non-volatile memory (NVM) and MOS transistors are described. In one embodiment the method includes: depositing and patterning a gate layer over a dielectric stack on a substrate to form a gate of a NVM transistor, the dielectric stack including a tunneling layer overlying a surface of the substrate, a charge-trapping layer overlying the tunneling layer and a blocking layer overlying the charge-trapping layer; forming a mask exposing source and drain (S/D) regions of the NVM transistor; etching the dielectric stack through the mask to thin the dielectric stack by removing the blocking layer and at least a first portion of the charge-trapping layer in S/D regions of the NVM transistor; and implanting dopants into S/D regions of the NVM transistor through the thinned dielectric stack to form a lightly-doped drain adjacent to the gate of the NVM transistor.

Abstract: A memory cell can include at least a first programmable section coupled between a supply node and a first data node; a volatile storage circuit coupled to the first data node; and the programmable section includes a programmable transistor having a first source/drain (S/D) region shared with a first transistor, and a second S/D region shared with a second transistor; wherein the first S/D region has a different dopant diffusion profile than the second S/D region, and the programmable transistor has a charge storage structure formed between its control gate and its channel. Methods of forming such a memory cell are also disclosed.

Abstract: Systems, methods, and products of processes consistent with the innovations herein relate to aspects involving crystallization of layers on substrates. In one exemplary implementation, there is provided a method of fabricating a device. Moreover, such method may include placing an amorphous/poly material on a substrate and heating the material via a sub-melt laser anneal process to transform the material into crystalline form.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: A memory cell can include at least a first programmable section coupled between a supply node and a first data node; a volatile storage circuit coupled to the first data node; and the programmable section includes a programmable transistor having a first source/drain (S/D) region shared with a first transistor, and a second S/D region shared with a second transistor; wherein the first S/D region has a different dopant diffusion profile than the second S/D region, and the programmable transistor has a charge storage structure formed between its control gate and its channel. Methods of forming such a memory cell are also disclosed.

Abstract: Memory cells including embedded SONOS based non-volatile memory (NVM) and MOS transistors and methods of forming the same are described. Generally, the method includes: forming a dielectric stack on a substrate, the dielectric stack including a tunneling dielectric on the substrate and a charge-trapping layer on the tunneling dielectric; patterning the dielectric stack to form a gate stack of a NVM transistor of a memory device in a first region of the substrate while concurrently removing the dielectric stack from a second region of the substrate; and performing a gate oxidation process of a baseline CMOS process flow to thermally grow a gate oxide of a MOS transistor overlying the substrate in the second region while concurrently growing a blocking oxide overlying the charge-trapping layer. In one embodiment, Indium is implanted to form a channel of the NVM transistor.

Abstract: Memory cells including embedded SONOS based non-volatile memory (NVM) and MOS transistors and methods of forming the same are described. Generally, the method includes: forming a dielectric stack on a substrate, the dielectric stack including a tunneling dielectric on the substrate and a charge-trapping layer on the tunneling dielectric; patterning the dielectric stack to form a gate stack of a NVM transistor of a memory device in a first region of the substrate while concurrently removing the dielectric stack from a second region of the substrate; and performing a gate oxidation process of a baseline CMOS process flow to thermally grow a gate oxide of a MOS transistor overlying the substrate in the second region while concurrently growing a blocking oxide overlying the charge-trapping layer. In one embodiment, Indium is implanted to form a channel of the NVM transistor.

Abstract: A latch circuit and method includes providing a first tri-gate non-volatile device, providing a second tri-gate non-volatile device, coupling the first tri-gate non-volatile device to the second tri-gate non-volatile device, erasing the first tri-gate non-volatile device, programming the second tri-gate non-volatile device, and latching an output node of the latch device to a logic state determined by respective thresholds of the first and second tri-gate non-volatile devices. Coupling the first tri-gate non-volatile device to the second tri-gate non-volatile device can include direct coupling, or indirect coupling through a cross-coupled circuit.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: Systems, methods, and products of processes consistent with the innovations herein relate to aspects involving crystallization of layers on substrates. In one exemplary implementation, there is provided a method of fabricating a device. Moreover, such method may include placing an amorphous/poly material on a substrate and heating the material via a sub-melt laser anneal process to transform the material into crystalline form.